CN101040378A - 用于发光二极管光引擎的磁性连接方法 - Google Patents
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Abstract
一种光引擎(16),包括至少一个用于产生多种波长之一的光的LED(12)。该LED(12)设置于磁芯印刷电路板(14)上。散热片(26)设置成与底座(24)和该LED(12)热连接,用于从该LED(12)传导出热能。该光引擎(16)通过磁体(50)磁性连接到该散热片上(26),该磁体(50)固定在该散热片(26)上,来产生在该磁芯板(14)和该散热片(26)之间的磁力。
Description
技术领域
本发明涉及照明领域,特别特别应用于LED基光源,并将并且将特别针对此加以描述。然而,应该理解,本发明也可以适用于其他类似用途。
背景技术
用于高亮度系统的LED通常是焊接到金属芯印刷电路板(MCPCBs)的表面安装装置。承载LED的MCPCB以各种方式连接到散热片或者热传导固定装置上。
将板固定到散热片的一种常规方法是借助于例如螺丝的机械紧固件。然而,当受热元件例如LED板通过螺丝和绝缘垫圈夹持到散热片时,通常会出现热传递效率随时间的降低。附加装置的长期蠕变或塑性变形会将最初的夹持力减小到初始值的一小部分。这严重损害了穿过安装界面的热流动,这可能导致热引起的光源失效。
将板固定到散热片的另一种常规方法是使用粘合剂。粘合剂连接系统通常更能耐住高温作用,但是有时由于重复的温度循环而出现脱开现象。塑料、环氧树脂和金属的热膨胀系数的相对大的差异会在连接区域产生显著的应力。这种应力可能超过粘合剂的力并可能最终导致连接失败。
与通过机械紧固件和/或粘合剂的连接有关的其它不便之处在于:每种方法都要求表面处理并且哪种方法都不是非常适于将LED从板轻易地分离。
发明内容
根据本发明的一个方面,光组件包括平台,该平台上配置至少一个LED,以及用于从该平台传导出热能的散热片。该散热片和平台通过至少一个磁体连接。
根据本发明的另一个方面,披露了用于连接光组件中两个部件的方法。提供了一种光引擎,该光引擎包括一个平台和至少一个配置于该平台上的LED。该光引擎磁性连接到散热片,从至少一个LED传导出热能。
本发明的一个优点在于可以快速连接/脱开LED光引擎。
另一个优点在于减小穿过界面的热阻。
另一个优点为在组装过程中改善了部件的对齐和连接。
附图说明
图1用示意图示出了基于LED的灯的剖面图;
图2用示意图示出了包括磁芯印刷电路板的基于LED的灯的部分剖面图;以及
图3用示意图示出了包括非磁性印刷电路板的基于LED的灯的部分剖面图。
具体实施方式
参照图1,照明系统10包括放置在安装平台14上并限定光引擎16的一个或多个LED 12。该LED 12通过焊接、引线粘接、热超声、热压焊、电导性粘合剂、热导性粘合剂、其他合适的方法之一,或者上述方法的组合固定到该平台14的上表面18。该LED 12可以是发射从UV到红外的光谱中的光的无机或有机发光装置。通过以不同方式布置LED来实现光学性能、视角、和强度水平的调整。该照明系统10包括光罩或外壳20。该罩20可以是球形、椭圆形、柱形、半球形、方形、n边形、或者任何其他形状。优选地,该罩20是由光透明或半透明的材料或其组合制成。该罩20材料选自玻璃、塑料、丙烯酸树脂、聚碳酸酯、或者其他合适的材料。
至少一个散热器22是整体配置,与该光引擎16和底座24热连接,从该LED 12带走热量。优选地,该散热器22包括带有均热片28的散热片26,该均热片28位于该散热片26的下表面30。该散热片是由能够从该LED 12传导出热量的材料构成,例如铜、铝、碳化硅、氮化硼、以及已知其它具有高的导热系数的材料。在一个具体实施方式中,在该光引擎16和该散热片26之间设有一个中间导热元件(未示出)。优选地,该平台14为磁性连接到该散热器22的印刷电路板,这将在下文更详细地讨论。
优选地,该底座24是一个可商业购得的灯泡插座,为其便于场交换和用该LED光引擎16翻新该灯泡,使得该外壳20可以套在该光引擎16上。这种设计允许用各种不同的LED光引擎替代传统的灯,而无需改动灯插座或者灯罩。可选地,该底座24是传统制造的。
优选地,使用折射率合适的材料32来包围该光引擎16以改善光提取。该折射率适合的材料选自硅酮、丙烯酸树脂、环氧树脂、热塑性材料、玻璃、以及任何其他合适的材料。可选地,优选用作热扩散介质的折射率适合的流体存在于光引擎16和罩20之间。该流体选自固体、凝胶、液体、碳氟化合物冷却剂、发光材料和其它可产生理想视觉效果的材料。此外,可以向该流体添加反射颗粒或者半透明颗粒来达到更进一步的视觉效果。罩20与内部流体共同作用来优化光提取和/或提供视觉效果,在一个具体实施方式中,该折射率适合的材料32被构造成提供透镜化。
为了向该LED 12提供合适的电力,该照明系统10包括一个或多个电力转换电路、控制电子设备、或电力电子电路40,其优选地与该光引擎16结合成一体。可替换地,该电力转换电路40可以与该光引擎16相邻、位于底座24内、或者设置为远离该照明系统10。在一个具体实施方式中,该电力转换电路40包括AC/DC转换器,其允许LED基照明系统10由标准家用120VAC或国际220VAC使用电压提供动力。
优选地,该照明系统10包括波长转换材料,例如有机或者无机的磷光体。该磷光体可以位于任何合适的位置,例如整合到该LED 12内、在罩20内部或外部、包含在该外壳20内、或者它们的组合。
参照图2,该平台14为磁芯印刷电路板(MCPCB),由例如但不限于钢铁的磁性基体材料制成。该平台14通过一个固定在散热片26约上表面52的磁体50固定到散热器22上。更特别地,磁体50嵌入到凹槽54内,凹槽54位于散热片26的中心轴周围,使得该磁体50的第一表面56被暴露来产生散热片26和平台14之间的磁引力。该磁力将平台14锁位在适当位置,牢固地连接该光引擎16,并提供足够的法向力来产生穿过该界面的低热阻。该散热片上表面52的大部分区域被暴露,来接触平台14从而有效地传递热量。可选地,热界面材料层58被设置于散热片26和平台14的下表面60之间,来进一步帮助降低穿过该MCPCB到散热片26的热阻。很多种加填料的或未加填料的油脂、凝胶、或者粘弹性材料可以降低该界面的热阻抗以便最大化该热传递。
参照图3,平台14由例如铝的非磁性材料制成。当然,还可以考虑使用任何其它非磁性材料制造该平台14。正如上文结合图2所描述的,磁体50嵌入在凹槽54内,凹槽54位于散热片26的中心轴周围,来暴露该磁体50的第一表面56。将第二磁体或磁条材料70固定到该平台14的下表面60,以产生散热片26和平台14之间的磁引力。可选地,将热界面材料层58设置在散热片26和平台下表面60之间,以帮助降低该界面热阻。该材料58优选包括第二凹槽72,该第二磁体70嵌入第二凹槽中。
当然,还可以考虑,该磁性连接可以用在从该LED光引擎16的传热路径下游的任何位置,用在需要连接照明系统10的任何两个部件,且需要保持散热路径的有效热传递的任何位置。
已经参照优选具体实施方式描述了本发明。显然,在阅读和理解了前述详细描述的基础上,其他人可以进行各种修改和变更。仅由所附权利要求限定的本发明旨在覆盖落入所附权利要求及其等同替换范围内的所有此类修改和改变。
Claims (15)
1.一种光组件,包括:
一个平台,具有设置在所述平台上的至少一个发光二极管;以及
一个散热片,用于从所述平台传导热能,其中所述平台通过至少一个磁体连接到所述散热片上。
2.根据权利要求1所述的光组件,其中,所述磁体嵌入于所述散热片内。
3.根据权利要求2所述的光组件,其中,所述平台包括磁芯印刷电路板(MCPCB)。
4.根据权利要求2所述的光组件,其中,所述平台包括非磁性材料,并且进一步包括设置于所述平台之上或之内的磁性材料。
5.根据权利要求1所述的光组件,进一步包括:
靠近所述平台的下表面设置的一热材料,与所述散热片的大部分上表面热连接,以降低所述平台和所述散热片之间的热阻。
6.根据权利要求1所述的光组件,其中,所述平台和所述散热片之间的磁性连接适于快速脱开。
7.一种连接光组件中的两个部件的方法,所述方法包括:
提供一个光引擎,所述光引擎包括一个平台,和置于所述平台上的至少一个发光二极管;以及
将所述光引擎磁性连接到一个导热元件,以从所述至少一个LED传导出热能。
8.根据权利要求7所述的方法,其中,所述导热元件包括散热片。
9.根据权利要求8所述的方法,进一步包括:将一个磁体附着在所述散热片上。
10.根据权利要求9所述的方法,进一步包括:将所述磁体嵌入所述散热片中。
11.根据权利要求9所述的方法,其中,所述平台包括一个磁芯印刷电路板(MCPCB)。
12.根据权利要求9所述的方法,其中,所述平台包括非磁性材料。
13.根据权利要求12所述的方法,进一步包括:将一个磁性材料附着在所述平台上。
14.根据权利要求8所述的方法,进一步包括:降低所述平台和所述散热片之间的热阻,包括使一种热材料靠近所述平台的下表面附着,其与光引擎和所述散热片的大部分上表面热连接。
15.一种电灯,包括:
一个光引擎,包括一个上面设有多个LED的平台;
一个散热片,用于从所述光引擎传导出热能;以及
一个磁性接合部,设置于所述光引擎和所述散热片之间,
所述磁性接合部产生一个使所述光引擎和所述散热片可脱开地相互连接的磁力。
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US10/962,947 | 2004-10-12 | ||
US10/962,947 US7145179B2 (en) | 2004-10-12 | 2004-10-12 | Magnetic attachment method for LED light engines |
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CN101040378A true CN101040378A (zh) | 2007-09-19 |
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US (1) | US7145179B2 (zh) |
EP (1) | EP1805797A4 (zh) |
CN (1) | CN101040378A (zh) |
WO (1) | WO2006044027A2 (zh) |
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CN102376846A (zh) * | 2010-08-25 | 2012-03-14 | 展晶科技(深圳)有限公司 | 发光二极管组合 |
CN102445773A (zh) * | 2010-10-08 | 2012-05-09 | 瀚宇彩晶股份有限公司 | 背光源及其驱动电路板组合及液晶显示器 |
CN102593276A (zh) * | 2011-01-06 | 2012-07-18 | 佛山市奇明光电有限公司 | 用磁场对发光二极管进行固晶的方法 |
CN102290504A (zh) * | 2011-09-07 | 2011-12-21 | 惠州市西顿工业发展有限公司 | 基于高导热基板倒装焊技术的cob封装led模块和生产方法 |
Also Published As
Publication number | Publication date |
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EP1805797A4 (en) | 2008-06-04 |
EP1805797A2 (en) | 2007-07-11 |
WO2006044027A3 (en) | 2006-07-06 |
WO2006044027A2 (en) | 2006-04-27 |
US20060076672A1 (en) | 2006-04-13 |
US7145179B2 (en) | 2006-12-05 |
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