CN101026141A - Coated article package structure with anti-float means - Google Patents
Coated article package structure with anti-float means Download PDFInfo
- Publication number
- CN101026141A CN101026141A CN 200610054922 CN200610054922A CN101026141A CN 101026141 A CN101026141 A CN 101026141A CN 200610054922 CN200610054922 CN 200610054922 CN 200610054922 A CN200610054922 A CN 200610054922A CN 101026141 A CN101026141 A CN 101026141A
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- China
- Prior art keywords
- crystal
- package structure
- coated package
- float means
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Lead Frames For Integrated Circuits (AREA)
Abstract
This invention relates to a cladding chip package structure with a float-proof unit including a lead frame, a cladding chip and multiple solders, in which, said lead frame includes multiple leading pins and a fixed base and the top surface of the fixed base forms at least one hole for clipping the engine, said cladding chip has an active side set with at least an engine-clipping block and multiple humps and the block is clutched to the hole correspondingly as the float-proof unit of the package structure, when a solder is welded to the hump and the leading pins, said float-proof unit can prevent the chip from floating up and avoid that the solder shrinks at the neck after back-solder.
Description
Technical field
The present invention relates to a kind of crystal-coated package structure, particularly have anti-float means in order to the projection of scolder connection crystal covered chip and the crystal-coated package structure of lead frame about a kind of.
Background technology
Along with Development of Packaging Technology, crystal-coated package structure becomes the center of gravity of present development.Existing crystal-coated package structure is to a lead frame, to reduce packaging cost with a chip chip bonding.The TaiWan, China patent announcement has disclosed a kind of semiconductor chip crystal-coated package structure for No. 567598, comprises a lead frame, semiconductor chip, a plurality of first projection and a plurality of second projection.This lead frame has a chip bearing and a plurality of lead foot.This semiconductor chip has an active surface and with respect to the back side of this active surface, has a plurality of first weld pads and second weld pad on this active surface.First projection and second projection are located at respectively on corresponding first weld pad and second weld pad, make this semiconductor chip become a crystal covered chip.Towards the configuration of this lead frame, and first projection and second projection are connected on this chip bearing and the corresponding lead foot this semiconductor chip with its active surface.First projection and second projection are generally the low temperature eutectic projection, to be soldered to corresponding lead foot.Yet when welding first projection and second projection in this chip bearing and lead foot, the lead foot of lead frame does not have welding resisting layer to define bonding area, and therefore first projection and second projection can influence its height because of defeated and dispersed diffusion.
Another kind of existing juncture is high temperature projection and the lead frame with solder bonds one crystal covered chip.Please refer to Fig. 1 and Fig. 2, this existing crystal-coated package structure 100 mainly comprises a lead frame 110, a crystal covered chip 120 and a plurality of eutectic solder 130.This lead frame 110 has a plurality of lead foots 111, has been pre-formed eutectic solder 130 on these lead foots 111.This crystal covered chip 120 has a plurality of high temperature projections 121, as slicker solder 95/5 contour plumbous projection (as shown in Figure 1), makes when these eutectic solders 130 of reflow, and these high plumbous projections 121 can not be melted, thereby avoid taking place the defeated and dispersed phenomenon of projection.Fig. 2 shows; the high temperature projection 121 that utilizes these eutectic solders 130 welding crystal covered chips 120 is during with the lead foot 111 of lead frame 110; in reflow process; crystal covered chip 120 regular meetings float because of the surface tension of these eutectic solders 130; make after scolder 130 reflows; can form neck 131 (necking portion) near a side of lead frame 110, thereby stress is concentrated and caused easy fracture.
Summary of the invention
Therefore, main purpose of the present invention is to provide a kind of crystal-coated package structure with anti-float means, and this anti-float means can prevent that crystal covered chip from floating in reflow process, thereby avoids scolder to form constriction (necking) after reflow.
For achieving the above object, according to the present invention's first specific embodiment, the crystal-coated package structure that the present invention has anti-float means comprises a lead frame, a crystal covered chip and a plurality of scolder, and wherein this lead frame has a plurality of lead foots and a holder, and this holder is formed with at least one holding hole; This crystal covered chip has an active surface and at least one holding piece and plurality of bump on this active surface, and this holding piece is connected in this holding hole; This scolder is used to connect lead foot and projection.
According to the present invention's second specific embodiment, the crystal-coated package structure that the present invention has anti-float means comprises a chip carrier, a crystal covered chip and a plurality of scolder, wherein this chip carrier has a upper surface, a lower surface, and a plurality of contacts and at least one holding hole that are revealed in this upper surface; This crystal covered chip has an active surface and at least one holding piece and plurality of bump on this active surface, and this holding piece is connected in this holding hole; This scolder is used to connect contact and projection.
Compared with prior art, the present invention is connected in the holding hole of lead frame or chip carrier by the holding piece of crystal covered chip, the fixing spacing of crystal covered chip and lead frame or chip carrier, avoid when the reflow scolder, this crystal covered chip come-up or slip, and the projection of this crystal covered chip is kept in touch with the corresponding lead foot of lead frame or the corresponding contact of chip carrier, thereby avoid scolder to form constriction (necking), increase reliability in a side near this lead frame or chip carrier.
The present invention is further illustrated below in conjunction with accompanying drawing and embodiment.
Description of drawings
Fig. 1 is the schematic cross-section of existing a kind of crystal-coated package structure when chip bonding.
Fig. 2 is existing crystal-coated package structure produces the scolder necking phenomenon after chip bonding a schematic cross-section.
Fig. 3 is the schematic cross-section of the crystal-coated package structure with anti-float means when chip bonding of the present invention's first specific embodiment.
Fig. 4 is the schematic cross-section of the crystal-coated package structure with anti-float means after sealing of the present invention's first specific embodiment.
Fig. 5 is the schematic cross-section of the crystal-coated package structure with anti-float means of the present invention's second specific embodiment.
Embodiment
Relevant detailed description of the present invention and technology contents, existing as follows with regard to accompanying drawings:
Fig. 3 and Figure 4 shows that a kind of crystal-coated package structure with anti-float means according to the present invention's first specific embodiment.This crystal-coated package structure 200 comprises a lead frame 210, a crystal covered chip 220, a plurality of scolder 230 and an adhesive body 240, and wherein lead frame 210 has a holder 211 and a plurality of lead foot 212, and holder 211 has a upper surface 213 and a lower surface 214.Holder 211 can be rectangular flat shape or strip less than crystal covered chip 220.The upper surface 213 of this holder 211 is formed with at least one holding hole 215, and preferably, this holder 211 has the holding hole 215 of a plurality of symmetrical distributions, and this holding hole 215 is to utilize the mode that etches partially to form and have a reducing.Each lead foot 212 has a upper surface 216 and a lower surface 217.Crystal covered chip 220 has an active surface 221 and at least one holding piece on this active surface 221 222 and plurality of bump 223.In the present embodiment, this holding piece 222 is middle positions of being located at active surface 221, and projection 223 is peripheral positions of being located at active surface 221.The external diameter of holding piece 222 is slightly larger than the size in holding hole 215, makes this holding piece 222 can be connected in the holding hole 215.In addition, in this holding hole 215, can be provided with adhesive (not shown), be fixed in this holding hole 215 so that holding piece 222 is cohered.This holding piece 222 can be ground connection projection (ground bump) or the empty projection (dummy bump) with heat conduction function.Preferably, the height of this holding piece 222 is higher than projection 223, and projection 223 is higher than the metal material of 200 degree Celsius above (being higher than scolder 230) for high temperature projection (as slicker solder 95/5 or slicker solder 90/10 contour plumbous projection) or fusing point, can be projection with reflow, as copper, nickel, gold or the like, these scolders 230 are eutectic solder, to connect lead foot 212 and projection 223 after reflow.As shown in Figure 3, crystal covered chip 220 with its active surface 221 towards upper surface 213 chip bondings of holder 211 in lead frame 210.When the projection 223 of this crystal covered chip 220 is engaged in the upper surface 216 of lead foot 212 of lead frame 210 with scolder 230, holding piece 222 correspondences of this crystal covered chip 220 are connected in holding hole 215, with anti-float means as this crystal-coated package structure 200, make this crystal covered chip 220 fix to engaging spacing, in reflow process, float to prevent this crystal covered chip 220 with the vertical of this lead frame 210.In addition, when scolder 230 solder bond projections 223 and lead foot 212, because this holding piece 222 is connected in holding hole 215, therefore under fixing joint spacing, these scolders 230 can not form the constriction place.As shown in Figure 4, these projections 223 and this holding piece 222 of adhesive body 240 sealings.In the present embodiment, the lower surface 214 of holder 211 all is revealed in this adhesive body 240 with the lower surface 217 of lead foot 212, to constitute the crystal-coated package structure of a non-connection pin.
Because the holding piece 222 of crystal covered chip 220 is connected in the holding hole 215 of holder 211, to fix the spacing of this crystal covered chip 220 and lead frame 210, avoid when reflow scolder 230, this crystal covered chip 220 come-ups or slip, and the projection 223 of this crystal covered chip 220 can be kept in touch with the lead foot 212 of lead frame 210, avoiding scolder 230 forming constriction (necking), thereby increase reliability near a side of lead frame 210.
The purpose of crystal-coated package structure provided by the present invention is to be to solve scolder causes the chip come-up when welding crystal covered chip and chip carrier problem, therefore can be used in the chip carrier except lead frame.As shown in Figure 5, the crystal-coated package structure with anti-float means 300 of the present invention's second specific embodiment comprises that mainly a chip carrier 310, has the crystal covered chip 320 of a plurality of holding pieces 322, a plurality of scolder 330 and an adhesive body 340.This chip carrier 310 has a upper surface 311, a lower surface 312, is emerging in the contact 313 of a plurality of for example connection gaskets of upper surface 311, and at least one holding hole 314 that is emerging in upper surface 311.This chip carrier 310 can be selected from one of them of printed circuit board (PCB), ceramic circuit board, lead frame, metal support plate.In the present embodiment, this chip carrier 310 is the circuit substrate just like printed circuit board (PCB) or ceramic circuit board, therefore this chip carrier 310 can comprise a dielectric layer 315 and a bronze medal layer 316, wherein this dielectric layer 315 has at least one first hole 315a, this copper layer 316 is formed on the dielectric layer 315 and has at least one and the second hole 316a first hole 315a vertical alignment, forms a holding hole 314 by this first hole 315a and this second hole 316a.In addition, this copper layer 316 can be made of same Copper Foil with these contacts 313.Preferably, the aperture of the second hole 316a of copper layer 316 is less than the aperture of the first hole 315a of dielectric layer 315, so that holding hole 314 has a reducing, in order to clamping holding piece 322.
Crystal covered chip 320 has an active surface 321, and at least one holding piece 322 is formed on this active surface 321 with plurality of bump 323.In the present embodiment, these projections 323 are the trellis array, and this holding piece 322 is formed on the periphery or the corner of active surface 321.The reflow that utilizes scolder 330 is with soldering projection 323 and these contacts 313, and holding piece 322 is connected in holding hole 314.In addition, after chip bonding, can form the upper surface 311 of this adhesive body 340, with sealing projection 323 and holding piece 322 by pressing mold or other technology at chip carrier 310.In the present embodiment, crystal covered chip 320 is also by this adhesive body 340 coating that seals.In addition, can be provided with a plurality of soldered balls 350 in addition or other externally connects assembly at the lower surface 312 of chip carrier 310.Be connected in holding hole 314 by holding piece 322, this crystal covered chip 320 can be avoided the phenomenon that floats improperly or break away from the reflow process of scolder 330 with in the forming process of adhesive body 340.
In sum, the present invention is connected in the holding hole of lead frame or chip carrier by the holding piece of crystal covered chip, the fixing spacing of crystal covered chip and lead frame or chip carrier, avoid when the reflow scolder, this crystal covered chip come-up or slip, and the projection of this crystal covered chip is kept in touch with the corresponding lead foot of lead frame or the corresponding contact of chip carrier, thereby avoid scolder to form constriction (necking), increase reliability in a side near this lead frame or chip carrier.
Claims (13)
1, a kind of crystal-coated package structure with anti-float means, comprise a lead frame, a crystal covered chip and a plurality of scolder, this lead frame has a holder and a plurality of lead foot, this crystal covered chip has an active surface and is arranged on plurality of bump on this active surface, and these a plurality of scolders connect described projection and lead foot; It is characterized in that:
Be formed with at least one holding hole on the holder of this lead frame, correspondence is provided with at least one holding piece on the active surface of this crystal covered chip, and described holding piece is connected in described holding hole.
2, the crystal-coated package structure with anti-float means as claimed in claim 1 is characterized in that described holding hole has a reducing.
3, the crystal-coated package structure with anti-float means as claimed in claim 1 it is characterized in that the external diameter of described holding piece is slightly larger than the size in described holding hole, and the height of described holding piece is higher than described projection.
4, the crystal-coated package structure with anti-float means as claimed in claim 1 it is characterized in that the fusing point of described projection is higher than described scolder, and described holding piece is ground connection piece or heat-conducting block.
5, the crystal-coated package structure with anti-float means as claimed in claim 1 is characterized in that this crystal-coated package structure further comprises an adhesive body, to seal described projection and holding piece.
6, the crystal-coated package structure with anti-float means as claimed in claim 5 is characterized in that this holder has a lower surface that is revealed in this adhesive body, and the lower surface of described lead foot also is revealed in this adhesive body.
7, the crystal-coated package structure with anti-float means as claimed in claim 1 is characterized in that this crystal-coated package structure further comprises the adhesive of being located at described holding hole, to fix described holding piece in described holding hole.
8, a kind of crystal-coated package structure with anti-float means comprises a chip carrier, a crystal covered chip and a plurality of scolder, and this chip carrier has a upper surface, a lower surface, and a plurality of contacts that are emerging in this upper surface;
This crystal covered chip has an active surface and is arranged on plurality of bump on this active surface; These a plurality of scolders connect described projection and contact; It is characterized in that:
This chip carrier also comprises at least one holding hole that is emerging in its upper surface, and correspondence is provided with at least one holding piece on the active surface of this crystal covered chip, and described holding piece is connected in described holding hole.
9, the crystal-coated package structure with anti-float means as claimed in claim 8, it is characterized in that this chip carrier is a circuit substrate, this circuit substrate comprises a dielectric layer and a bronze medal layer, this dielectric layer has at least one first hole, this copper layer is formed on this dielectric layer and has at least one and second hole this first hole vertical alignment, uses and forms described holding hole.
10, the crystal-coated package structure with anti-float means as claimed in claim 9, the aperture in this second hole that it is characterized in that this copper layer is less than the aperture in this first hole of this dielectric layer, so that this holding hole has a reducing.
11, the crystal-coated package structure with anti-float means as claimed in claim 8 is characterized in that the external diameter of described holding piece is slightly larger than the size in described holding hole.
12, the crystal-coated package structure with anti-float means as claimed in claim 8 is characterized in that this crystal-coated package structure further comprises an adhesive body, to seal described projection and holding piece.
13, the crystal-coated package structure with anti-float means as claimed in claim 8 is characterized in that this crystal-coated package structure further comprises the adhesive of being located at described holding hole, to fix described holding piece in described holding hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610054922 CN101026141A (en) | 2006-02-20 | 2006-02-20 | Coated article package structure with anti-float means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610054922 CN101026141A (en) | 2006-02-20 | 2006-02-20 | Coated article package structure with anti-float means |
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| Publication Number | Publication Date |
|---|---|
| CN101026141A true CN101026141A (en) | 2007-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610054922 Pending CN101026141A (en) | 2006-02-20 | 2006-02-20 | Coated article package structure with anti-float means |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206464A (en) * | 2015-05-29 | 2016-12-07 | 南茂科技股份有限公司 | Flip chip package structure and chip |
| CN109148399A (en) * | 2018-08-21 | 2019-01-04 | 武汉华星光电半导体显示技术有限公司 | Electrical connection module and display device |
-
2006
- 2006-02-20 CN CN 200610054922 patent/CN101026141A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206464A (en) * | 2015-05-29 | 2016-12-07 | 南茂科技股份有限公司 | Flip chip package structure and chip |
| CN109148399A (en) * | 2018-08-21 | 2019-01-04 | 武汉华星光电半导体显示技术有限公司 | Electrical connection module and display device |
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