CN212182315U - Lead frame and flip chip packaging structure - Google Patents
Lead frame and flip chip packaging structure Download PDFInfo
- Publication number
- CN212182315U CN212182315U CN202021078043.9U CN202021078043U CN212182315U CN 212182315 U CN212182315 U CN 212182315U CN 202021078043 U CN202021078043 U CN 202021078043U CN 212182315 U CN212182315 U CN 212182315U
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- welding
- pin
- chip
- lead frame
- base island
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a lead frame and a flip chip packaging structure, wherein the lead frame comprises a base island and a pin, a pin welding area for welding and connecting an external structure is arranged on the pin, the pin welding area is lower than the upper surface of the base island, and a supporting space is arranged between the pin welding area and the upper surface of the base island; the flip chip packaging structure comprises the lead frame, a chip and a welding connecting piece, wherein the welding connecting piece is a conductive welding connecting piece; the chip is provided with a bonding area and a plurality of bonding pads, the bonding pads are positioned on the outer side of the bonding area, the bonding area is fixed on the base island through a welding material layer, one end of the welding connecting piece is welded with the bonding pads, and the other end of the welding connecting piece is welded with the pin welding area. The utility model discloses a lead frame can prevent the chip slope when using, and flip chip packaging structure can avoid the chip slope, guarantees that welded connection spare effectively welds between with chip and the pin to improve welding quality, improve the yields.
Description
Technical Field
The utility model relates to a semiconductor package technical field especially relates to a lead frame and flip chip packaging structure.
Background
At present, the flip chip package structure has many advantages over the traditional package structure using wire bonding process for packaging, such as: superior electrical properties, thermal properties, high I/0 pin count, and reduced package size, etc., and thus, the flip chip package structure is widely used. In the production of the existing flip chip packaging structure, generally, a connecting piece is welded on a chip by welding a tin ball and the like, then the chip is turned over, and a reflow soldering process is adopted to melt the connecting piece so as to realize the connection of the connecting piece and a substrate for bearing the chip.
However, as shown in fig. 1 and 2, in the reflow soldering process of the conventional product, the chip 200 is inclined (as shown in fig. 1) due to inconsistent melting of the solder balls (i.e., the soldering connection member 300), and some solder balls are not in contact with the lead frame 100 or the substrate (as shown in fig. 2) below the chip 200 after the chip 200 is inclined, so that the solder balls cannot be soldered to the lead frame 100 or the substrate, which may cause an open circuit at the position and result in product rejection.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an aim at: a lead frame is provided, when the lead frame is applied to flip chip packaging, the base island can be used for supporting a chip to prevent the chip from tilting.
The embodiment of the utility model provides a another aim at: the flip chip packaging structure is provided, the chip is supported through the base island, the chip can be prevented from inclining, and effective welding between the chip and the pins by welding connecting pieces is guaranteed.
The embodiment of the utility model provides a still another aim at: the utility model provides a flip chip packaging structure which can improve welding quality, improves the yields.
In order to achieve the purpose, the utility model adopts the following technical proposal:
the lead frame comprises a base island and a base pin, wherein a base pin welding area used for welding and connecting an external structure is arranged on the base pin, the base pin welding area is lower than the upper surface of the base island, and a supporting distance is reserved between the base pin welding area and the upper surface of the base island.
Preferably, the pins and the base islands have an insulating space therebetween.
Preferably, the pin is provided with a groove, the groove is provided with an upper end opening, and the pin welding area is positioned at the bottom of the groove; the upper end opening is used for placing an external structure.
Preferably, the side of the groove close to the base island is provided with a lateral opening.
Preferably, a barrier side wall is arranged between the groove and the base island.
Preferably, the upper surface of the base island protrudes from the upper surface of the pin.
A flip chip packaging structure comprises the lead frame, a chip and a welding connecting piece, wherein the welding connecting piece is a conductive welding connecting piece; the chip is provided with a bonding area and a plurality of bonding pads, the bonding pads are positioned on the outer side of the bonding area, the bonding area is fixed on the base island through a welding material layer, one end of the welding connecting piece is welded with the bonding pads, and the other end of the welding connecting piece is welded with the pin welding area.
Preferably, the support spacing is greater than 1/3 of the height of the welded connection; the ratio of the spacing between the pin lands and the top surface of the solder layer to the height of the solder connections is 0.8 to 1.
Preferably, the soldering connecting piece is a soldering connecting ball, and the soldering connecting ball is a solder ball.
Preferably, a groove is arranged on the pin, the groove is provided with an opening at the upper end, and the pin welding area is positioned at the bottom of the groove; the welding connecting piece is a conductive welding connecting piece, the welding connecting piece is inserted into the groove, and the end part of the welding connecting piece is welded with the pin welding area; the flip chip packaging structure further comprises a packaging body, and the packaging body wraps the lead frame, the chip and the welding connecting piece; the packaging body is an epoxy resin packaging body.
The utility model has the advantages that: when the lead frame is applied to flip chip packaging, the base island can be used for supporting a chip to prevent the chip from inclining; the flip chip packaging structure supports the chip through the base island, can avoid the chip from inclining, and ensures that a welding connecting piece is used for effectively welding the chip and the pins, thereby improving the welding quality and the yield.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
FIG. 1 is a diagram illustrating a flip chip package structure of a prior art for packaging defective products;
FIG. 2 is an enlarged view taken at A in FIG. 1;
fig. 3 is a schematic structural diagram of the lead frame according to the present invention;
fig. 4 is a schematic structural view of the flip chip package structure of the present invention;
in the figure: 100. a lead frame; 110. a base island; 120. a pin; 121. a groove; 122. a pin pad area; 200. a chip; 300. welding a connecting piece; 400. a solder layer; 500. and (5) packaging the body.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "fixed" are to be understood broadly, e.g. as a fixed connection, a detachable connection or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The utility model discloses a lead frame 100, when it is applied to flip chip 200 encapsulation, base island 110 can be used to support chip 200 in order to prevent chip 200 slope.
As shown in fig. 3-4, in an embodiment of the lead frame 100 of the present invention, the lead frame 100 includes a base island 110 and a pin 120, a pin land 122 for external structure welding is disposed on the pin 120, the pin land 122 is lower than the upper surface of the base island 110, and a supporting distance d is provided between the pin land 122 and the upper surface of the base island 110, where the supporting distance d is a height difference.
The lead frame 100 of the present invention is suitable for flip chip package structures; the base island 110 is used for welding a non-functional area of the chip 200 to play a role in supporting and fixing the chip 200; moreover, the pin lands 122 are arranged to be lower than the upper surface of the base island 110 with the supporting distance d therebetween, so that when the lead frame 100 is applied to a flip chip package structure, the base island 110 can well support the chip 200, the chip 200 is prevented from tilting, and a mounting height can be provided to the soldering connector 300 through the supporting distance d, so that both ends of the soldering connector 300 can be well soldered to the chip 200 and the pin lands 122, respectively.
Further, in another embodiment of the lead frame 100 of the present invention, the pin 120 and the base island 110 have an insulating space therebetween.
Further, in another embodiment of the lead frame 100 of the present invention, the pin lands 122 are lower than the upper surface of the base island 110 by the following way, so as to form the supporting distance d: a groove 121 extending downwards is arranged on the pin 120, the groove 121 has an upper end opening, and the pin soldering zone 122 is located at the bottom of the groove 121; the upper end opening is used for placing an external structure. So set up, both can form support interval d, can avoid increasing simultaneously again lead frame 100's whole thickness guarantees when it is applied to flip chip packaging structure, can avoid increasing chip 200 packaging structure's whole size.
Here, it is understood that, when the lead frame 100 is applied to a flip chip package structure, the upper end opening is used for the solder connector 300 to be inserted or inserted, so that the solder connector 300 is solder-bonded to the pin pad 122 at the bottom of the groove 121.
Specifically, the upper surface of the pin 120 is flush with the upper surface of the base island 110.
Further, the groove 121 can be implemented by at least two embodiments as follows:
first embodiment of the groove 121: as shown in fig. 3, the side of the groove 121 close to the base island 110 is also provided with a lateral opening, so that the lead frame 100 is easy to place the soldering connector 300 into the groove 121 and adjust the horizontal relative position of the chip 200 during application.
Embodiment two of the groove 121: a barrier side wall is arranged between the groove 121 and the base island 110; specifically, the groove 121 has sidewalls around the circumference thereof. With this arrangement, the side wall of the enclosure can prevent the conductive fluid generated when the welding connector 300 is melted from flowing to the insulation gap, thereby avoiding short circuit.
Specifically, the height of the enclosure sidewall is smaller than the support distance d, that is, the upper surface of the enclosure sidewall is lower than the upper surface of the base island 110, so as to ensure the support of the base island 110 on the chip 200, and prevent the chip 200 from tilting.
Further, in another embodiment of the lead frame 100 of the present invention, the pin lands 122 are lower than the upper surface of the base island 110 by the following way, so as to form the supporting distance d: the upper surface of the base island 110 protrudes with respect to the upper surface of the pin 120.
Specifically, the base island 110 has a thickness greater than that of the pin 120, and the lower surface of the base island 110 is flush with the lower surface of the pin 120.
The utility model also provides a flip chip packaging structure, it supports through base island 110 chip 200 can avoid chip 200 slopes, guarantees welded connection spare 300 will chip 200 with effectively weld between pin 120 to improve welding quality, improve the yields.
As shown in fig. 3 and 4, in an embodiment of the flip chip package structure of the present invention, the flip chip package structure includes the lead frame 100, further includes a chip 200 and a welding connector 300, wherein the welding connector 300 is a conductive welding connector 300; the chip 200 has a bonding area and a plurality of bonding pads, the bonding pads are located outside the bonding area, the bonding area is fixed to the base island 110 through a bonding material layer 400, one end of the bonding connector 300 is bonded to the bonding pads, and the other end of the bonding connector is bonded to the pin bonding area 122.
Specifically, the bonding pad is an input/output port of the chip 200, the bonding pad is soldered to the pin land 122 through the soldering connector 300, so as to electrically connect the chip 200 and the pin 120, and the pin 120 serves as an input/output port of the chip 200 for electrically connecting with an external circuit carrier.
In some embodiments, the bonding region is a non-functional region of the chip 200.
Further, the solder layer 400 is a bonding paste solder layer 400, the bonding paste solder layer 400 is formed by curing a bonding paste material, and a technician can select a suitable bonding paste material according to actual requirements.
Flip chip package structure, the lead frame 100 that has adopted pin soldering zone 122 is less than the upper surface of base island 110, and pin soldering zone 122 field have between the upper surface of base island 110 and support interval d, so base island 110 supports chip 200, in order to prevent in the time of chip 200 slope, support interval d and give the welding conjunction provides mounting height and gives welding connecting piece 300 to make welding connecting piece 300's both ends respectively can with chip 200, pin soldering zone 122 good welding, thereby avoid because the inconsistent back flow welding that leads to of tin ball melting the condition of chip 200 slope, thereby avoid chip 200 with welding between the lead frame 100 is opened a way, thereby improves welding quality, improves the yields.
Further, in another embodiment of the flip chip package structure of the present invention, in order to ensure the supporting function of the base island 110 on the chip 200, the bottom of the soldering connector 300 can be effectively soldered to the pin lands 122, and the supporting distance d is greater than 1/3 of the height of the soldering connector 300; the ratio of the spacing between the pin lands 122 and the top surface of the solder layer 400 to the height of the solder connections 300 is 0.8 to 1.
Further, in another embodiment of the flip chip package structure of the present invention, the soldering connecting element 300 is a solder ball, the solder ball is a lead ball or a lead-free ball, and the solder ball has a good soldering effect and a high cost performance.
In other embodiments, the solder connector 300 may also be a silver connector or a gold connector.
Further, in another embodiment of the flip chip package structure of the present invention, a groove 121 is disposed on the pin 120, the groove 121 has an upper end opening, and the pin bonding area 122 is located at the bottom of the groove 121; the welding connector 300 is a conductive welding connector 300, the welding connector 300 is inserted into the groove 121, and the end of the welding connector 300 is welded with the pin welding area 122; the flip chip package structure further comprises a package body 500, wherein the package body 500 wraps the lead frame 100, the chip 200 and the welding connector 300; the package 500 is an epoxy package 500. The package 500 plays a role of protection.
In the description herein, it is to be understood that the terms "upper", "lower", "left", "right", and the like are used in a descriptive sense and with reference to the illustrated orientation or positional relationship, and are used for convenience in description and simplicity in operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A lead frame (100) is characterized by comprising a base island (110) and a pin (120), wherein a pin welding area (122) for welding connection of an external structure is arranged on the pin (120), the pin welding area (122) is lower than the upper surface of the base island (110), and a supporting distance is arranged between the pin welding area (122) and the upper surface of the base island (110).
2. Lead frame (100) according to claim 1, characterized in that there is an insulating space between the pins (120) and the base island (110).
3. Lead frame (100) according to claim 1, characterized in that the pins (120) are provided with recesses (121), the recesses (121) having an upper end opening, the pin lands (122) being located at the bottom of the recesses (121); the upper end opening is used for placing an external structure.
4. Leadframe (100) according to claim 3, characterized in that the side of the recess (121) close to the base island (110) has a lateral opening.
5. Lead frame (100) according to claim 3, characterized in that between the recess (121) and the base island (110) there is a dam sidewall.
6. Leadframe (100) according to claim 1, characterized in that the upper surface of the base island (110) is convex with respect to the upper surface of the pins (120).
7. A flip chip package structure comprising the lead frame (100) according to any one of claims 1 to 6, further comprising a chip (200) and a solder connection (300), the solder connection (300) being an electrically conductive solder connection (300); the chip (200) is provided with a bonding area and a plurality of bonding pads, the bonding pads are positioned on the outer side of the bonding area, the bonding area is fixed on the base island (110) through a welding material layer (400), one end of the welding connecting piece (300) is welded with the bonding pads, and the other end of the welding connecting piece is welded with the pin welding area (122).
8. The flip-chip package structure of claim 7, wherein the support pitch is greater than 1/3 of the height of the solder connections (300); the ratio of the distance between the pin pad (122) and the top surface of the solder layer (400) to the height of the solder connection (300) is 0.8 to 1.
9. The flip-chip package structure of claim 7, wherein the solder connections (300) are solder connection balls, and the solder connection balls are solder balls.
10. The flip-chip package structure of claim 7, wherein the pin (120) is provided with a groove (121), the groove (121) has an upper end opening, and the pin pad (122) is located at the bottom of the groove (121); the welding connector (300) is a conductive welding connector (300), the welding connector (300) is inserted into the groove (121), and the end part of the welding connector (300) is welded with the pin welding area (122); the flip chip packaging structure further comprises a packaging body (500), wherein the packaging body (500) wraps the lead frame (100), the chip (200) and the welding connecting piece (300); the packaging body (500) is an epoxy resin packaging body (500).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021078043.9U CN212182315U (en) | 2020-06-11 | 2020-06-11 | Lead frame and flip chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021078043.9U CN212182315U (en) | 2020-06-11 | 2020-06-11 | Lead frame and flip chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212182315U true CN212182315U (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021078043.9U Active CN212182315U (en) | 2020-06-11 | 2020-06-11 | Lead frame and flip chip packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN212182315U (en) |
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2020
- 2020-06-11 CN CN202021078043.9U patent/CN212182315U/en active Active
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