CN109148399A - Electrical connection module and display device - Google Patents

Electrical connection module and display device Download PDF

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Publication number
CN109148399A
CN109148399A CN201810955250.9A CN201810955250A CN109148399A CN 109148399 A CN109148399 A CN 109148399A CN 201810955250 A CN201810955250 A CN 201810955250A CN 109148399 A CN109148399 A CN 109148399A
Authority
CN
China
Prior art keywords
terminal
electrical connection
connection module
groove
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810955250.9A
Other languages
Chinese (zh)
Inventor
高司恒
谭金龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201810955250.9A priority Critical patent/CN109148399A/en
Publication of CN109148399A publication Critical patent/CN109148399A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Abstract

The application discloses a kind of electrical connection module and display device.The electrical connection module includes the first terminal and Second terminal of alternative connection, it is arranged on the first terminal fluted, protrusion is provided in the Second terminal, the protrusion is sticked in the electrical connection that can be realized between first terminal and Second terminal in the groove.Based on this, the application can be conducive to promote yield when Bonding processing procedure is realized in heavy industry operation, and without using conducting resinl.

Description

Electrical connection module and display device
Technical field
This application involves field of electronic devices, and in particular to a kind of electrical connection module and display device.
Background technique
With the development of display technology, AMOLED (Active-matrix organic light emitting diode, Active matrix light-emitting diode) display technology has that carrier mobility is big, the response time is short, high contrast, wide colour gamut, wide view Angle, high saturation and low-power consumption etc. a little, just gradually replace traditional (Liquid Crystal Display, liquid crystal display) Display technology.In the processing procedure of AMOLED display device, Bonding (in conjunction with) processing procedure ten being electrically connected between each element is realized Divide key, is related to the transmission and final display effect of signal.But each film layer is very thin in AMOLED display device, power It spends biggish heavy industry operation to be easy to destroy film layer tearing, destroys the route for needing to be electrically connected, in addition, as shown in Figure 1, current Bonding processing procedure generally uses the Pad of two elements of realization of conducting resinl (Anisotropic Conductive Film, ACF) 13 Electrical connection between (terminal or pad) 11,12, but the viscosity of conducting resinl is very strong and is difficult to be removed liquid dissolution, once it needs two A element separation, tradition removal liquid is difficult to be dissolved removal, and easily corrodes two elements using potent removal liquid, causes Scrap of the product.
Summary of the invention
In view of this, the application provides a kind of electrical connection module and display device, can be conducive to promote heavy industry operation real Yield when existing Bonding processing procedure, and without using conducting resinl.
The electrical connection module of one embodiment of the application, first terminal and Second terminal including alternative connection are described It is arranged fluted on first terminal, is provided with protrusion in the Second terminal, the protrusion is sticked in the groove to realize Electrical connection between the first terminal and the Second terminal.
The display device of one embodiment of the application, including above-mentioned electrical connection module.
The utility model has the advantages that the application, which designs to be arranged in fluted, Second terminal on first terminal, is provided with protrusion, the protrusion It is sticked in the electrical connection that can be realized between first terminal and Second terminal in groove, engaging of the protrusion with groove is conducive to The implementation of heavy industry operation, so as to promote yield when Bonding processing procedure is realized in heavy industry operation, and without using conducting resinl.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the Pad electrical connection of two elements in the prior art;
Fig. 2 is the partial structural diagram of the electrical connection module of one embodiment of the application;
Fig. 3 is the structure schematic top plan view of the first terminal of one embodiment of the application;
Fig. 4 is the partial structural diagram of the electrical connection module of another embodiment of the application;
Fig. 5 is the structural schematic diagram of the display device of one embodiment of the application;
Fig. 6 is the structural schematic diagram in the region Bonding of display device shown in Fig. 5.
Specific embodiment
The primary and foremost purpose of the application is: the first terminal and Second terminal being electrically connected for needs are set on first terminal It sets groove, protrusion is set in Second terminal, the protrusion, which is sticked in groove, can be realized between first terminal and Second terminal Electrical connection, without using conducting resinl, also, it is this be connected together be conducive to heavy industry operation implementation, can be promoted heavy industry behaviour Yield when making.
The application is not intended to limit the concrete type of the first terminal and Second terminal, in other words, in different applied fields In scape or electrical connection environment, the structural detail that the first terminal and Second terminal are specifically referred to is different.For example, In display panel, the first terminal can be the outer pin (OLB) or Bonding of viewing area (Active Area, AA) Pad, accordingly, the Second terminal can be COF (Chip On Film, flip chip), driving IC and FPC (Flexible Printed Circuit, flexible circuit board) in any one pin.
Below with reference to the attached drawing in the embodiment of the present application, to the technology of each exemplary embodiment provided herein Scheme is clearly and completely described.In the absence of conflict, the feature in following each embodiments and embodiment can be with It is combined with each other.Also, directional terminology used by text of the statement, such as "upper", "lower" etc. are for preferably describing The technical solution of each embodiment is not intended to limit the protection scope of the application.
Fig. 2 is the partial structural diagram of the electrical connection module of one embodiment of the application.It please refers to shown in Fig. 2, the electricity Connection component 20 includes first terminal 21 and Second terminal 22.The first terminal 21 and Second terminal 22 are conducting element, Selective connection (electrical connection) is realized by engagement and disconnection between the two.The manufacture material of any one in the two can with it is existing The manufacture material of Bonding Pad is identical, such as can also use a variety of conductive golds using single metals such as copper, iron, titaniums Belong to the alloy formed according to predetermined ratio.In addition, any one in the two can be single layer structure, or multilayer conductive metal It is sequentially overlapped the composite layer to be formed.
The first terminal 21 includes the first noumenon 211 and is recessed inwardly setting from the side of the first noumenon 211 Groove 212.The Second terminal 22 includes that the second ontology 221 and extending outwardly from the side of second ontology 221 is set The protrusion 222 set.
Referring to Fig. 2, described raised 222 are sticked in groove 212, the first terminal 21 and Second terminal are realized with this Electrical connection between 22, at this point, the first noumenon 211 and the second ontology 221 can be with face contacts.And by described raised 222 from It is extracted in groove 212, the disconnection being electrically connected between the first terminal 21 and Second terminal 22 can be realized, at this point, described One ontology 211 and the second ontology 221 completely disengage contact.
It can be seen from the above, being realized between first terminal 21 and Second terminal 22 by means of the engaging of protrusion 222 and groove 212 Electrical connection, without using conducting resinl, in this, when first terminal 21 and Second terminal 22 disconnect electrical connection, without using going Except the removal liquid of conducting resinl, removal liquid damage first terminal 21 and Second terminal 22 can be avoided.In addition, raised 222 He This implementation itself having conducive to heavy industry operation that is connected together of groove 212, can promote heavy industry operation and realize 21 He of first terminal Yield when being electrically connected between Second terminal 22.
Please continue to refer to Fig. 2, the groove 212 can be the blind hole being opened on the first noumenon 211, in order to ensure The structural strength of first terminal 21 and the above-mentioned fastness being connected together, the depth of the groove 212 can be the first noumenon 211 The half of thickness.
In addition, the shape of the groove 212 and protrusion 222 can exactly match, when protrusion 222 and the engaging of groove 212, Maximum face contact is realized between the two.
Further, the groove 212 can be using the small but internal big design that is open, i.e., the maximum of the described groove 212 Radial dimension is greater than the radial dimension of the groove 212 opening, and specifically, the first terminal 21 is set in the opening of groove 212 It is equipped with blocking portion 213, the blocking portion 213 is extended towards the center that groove 212 is open.By Second terminal 22 towards When one terminal 21 pushes, deformation occurs due to the extruding of protrusion 222 for the blocking portion 213, is equivalent to the opening hair of the groove 212 Raw deformation, after protrusion 222 enters groove 212, which restores deformation, and is placed in protrusion 222 and the second ontology Between 221, in this, the blocking portion 213 is abutted against with the protrusion 222 being inserted in groove 212, stops the protrusion with this 222 exit from groove 212, to be conducive to improve the stability of electrical connection.
In this application, the quantity for the groove 212 that each first terminal 21 is included can be set according to actual needs It sets, however it is not limited to one shown in Fig. 2, such as can also be three shown in Fig. 3, accordingly, institute in each Second terminal 22 State protrusion 222 quantity it is identical with the quantity of the groove 212 on each first terminal 21 and correspond engage.
In addition, the application does not limit the opening shape of the groove 212 yet, for example, refering to Fig. 3, along perpendicular to first end The direction of visual lines of son 21, the shape that the groove 212 is open can be rectangle, and certainly, the opening of the groove 212 may be Round or other polygons.
Incorporated by reference to shown in Fig. 4, the electrical connection module 20 can also include the first sealing 23 and the second sealing 24.First After terminal 21 and Second terminal 22 are electrically connected, first sealing 23 is coated on except first terminal 21 and Second terminal 22, Such as the application scenarios on a underlay substrate 40 are carried on for first terminal 21, first sealing 23 and underlay substrate 40 are by One terminal 21 and Second terminal 22 coat completely.Wherein, first sealing 23 can not only fix first terminal 21 and second Connection between terminal 22 prevents from occurring loosening in use process avoiding poor electrical contact with this, and the first sealing 23 can To prevent water and oxygen from entering, first terminal 21 and Second terminal 22 is avoided to be electrically connected failure because of water oxygen corrosion with this.Described Two sealings 24 are coated on the outside of the first sealing 23 completely, to realize that water proof is oxygen barrier.
In application scenarios, first sealing 23 can be UV (Ultraviolet, ultraviolet light) solidification glue, have It certain viscosity and easily removes, after the modeling of 23 envelope of the first sealing is completed, if detecting first terminal 21 and Second terminal 22 Between electrical connection go wrong, then remove the first sealing 23, then detected and repaired operation, until 21 He of first terminal Electrical connection between Second terminal 22 meets the requirements, and then seals the second sealing 24 of modeling again.Second sealing 24 can be using viscous Resultant force is strong and the oxygen barrier ability of water proof also strong epoxide resin type thermoplastic.
The application also provides the display device of an embodiment.As shown in figure 5, the display device 50 include viewing area 51 with And non-display area 52, the area Bonding 521 is wherein provided in non-display area 52, above-mentioned electrical connection module 20 can be used as described Electrical connecting element in the area Bonding 521.As shown in connection with fig. 6, multiple Bonding Pad are provided in the area Bonding 521 522, every Bonding Pad 522 can be considered above-mentioned first terminal 21, and aforementioned Second terminal 22 can be the pin of COF. First terminal 21 and Second terminal 22 are corresponded into electrical connection using foregoing manner, COF can electrically be accessed the area Bonding 521, envelope modeling then is carried out using the first sealing 23 and the second sealing 24 to the area COF and Bonding 521 of electrical connection.
It is also designed using structure identical with aforementioned electrical connection module 20 in view of the display device 50, it is therefore, described aobvious Showing device 50 also has beneficial effect as hereinbefore.
It should be understood that above is only an example of the present application, being not intended to limit the scope of the patents of the application, all benefits Technical characteristic between the equivalent structure or equivalent flow shift made by present specification and accompanying drawing content, such as each embodiment Be combined with each other, being applied directly or indirectly in other relevant technical fields, similarly includes patent protection in the application In range.

Claims (10)

1. a kind of electrical connection module, which is characterized in that the electrical connection module includes the first terminal and the of alternative connection Two-terminal, is arranged on the first terminal fluted, protrusion is provided in the Second terminal, the protrusion is sticked in described recessed The electrical connection between the first terminal and the Second terminal is realized in slot.
2. electrical connection module according to claim 1, which is characterized in that the maximum radial dimension of the groove is greater than described The radial dimension of slot opening.
3. electrical connection module according to claim 2, which is characterized in that opening of the first terminal in the groove It is provided with blocking portion, the blocking portion and the protrusion being inserted in the groove are abutted against to stop the protrusion from the groove In exit.
4. electrical connection module according to claim 1, which is characterized in that the groove is to be opened on the first terminal Blind hole.
5. electrical connection module according to claim 1, which is characterized in that along the sight side perpendicular to the first terminal To the shape of the slot opening includes rectangle or circle.
6. electrical connection module according to claim 1, which is characterized in that the electrical connection module further includes the first sealing, The first terminal and Second terminal of the first sealant covers electrical connection.
7. the electrical connection module stated according to claim 6, which is characterized in that first sealing includes UV solidification glue.
8. electrical connection module according to claim 6, which is characterized in that the electrical connection module further includes the second sealing, Second sealant covers are in the outside of first sealing.
9. electrical connection module according to claim 8, which is characterized in that second sealing includes epoxide resin type thermoplastic Glue.
10. a kind of display device, which is characterized in that the display device includes as above-mentioned according to any one of claims 1 to 9 Electrical connection module.
CN201810955250.9A 2018-08-21 2018-08-21 Electrical connection module and display device Pending CN109148399A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810955250.9A CN109148399A (en) 2018-08-21 2018-08-21 Electrical connection module and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810955250.9A CN109148399A (en) 2018-08-21 2018-08-21 Electrical connection module and display device

Publications (1)

Publication Number Publication Date
CN109148399A true CN109148399A (en) 2019-01-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810955250.9A Pending CN109148399A (en) 2018-08-21 2018-08-21 Electrical connection module and display device

Country Status (1)

Country Link
CN (1) CN109148399A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026141A (en) * 2006-02-20 2007-08-29 日月光半导体制造股份有限公司 Coated article package structure with anti-float means
CN101180717A (en) * 2005-05-24 2008-05-14 松下电器产业株式会社 Method of forming solder bump and method of mounting semiconductor device
CN101345225A (en) * 2007-07-12 2009-01-14 雅马哈株式会社 Electronic component and method of forming the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101180717A (en) * 2005-05-24 2008-05-14 松下电器产业株式会社 Method of forming solder bump and method of mounting semiconductor device
CN101026141A (en) * 2006-02-20 2007-08-29 日月光半导体制造股份有限公司 Coated article package structure with anti-float means
CN101345225A (en) * 2007-07-12 2009-01-14 雅马哈株式会社 Electronic component and method of forming the same

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Application publication date: 20190104