CN101019217A - 具有公共引线框架上的倒装芯片设备的半导体设备模块 - Google Patents

具有公共引线框架上的倒装芯片设备的半导体设备模块 Download PDF

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Publication number
CN101019217A
CN101019217A CNA2005800253023A CN200580025302A CN101019217A CN 101019217 A CN101019217 A CN 101019217A CN A2005800253023 A CNA2005800253023 A CN A2005800253023A CN 200580025302 A CN200580025302 A CN 200580025302A CN 101019217 A CN101019217 A CN 101019217A
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China
Prior art keywords
common encapsulation
circuit
semiconductor portions
flip
mosfet
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Pending
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CNA2005800253023A
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English (en)
Chinese (zh)
Inventor
C·P·沙费尔
C·谢
K·胡
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Infineon Technologies Americas Corp
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International Rectifier Corp USA
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Publication of CN101019217A publication Critical patent/CN101019217A/zh
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
CNA2005800253023A 2004-06-03 2005-06-03 具有公共引线框架上的倒装芯片设备的半导体设备模块 Pending CN101019217A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57670304P 2004-06-03 2004-06-03
US60/576,703 2004-06-03
US11/144,156 2005-06-02

Publications (1)

Publication Number Publication Date
CN101019217A true CN101019217A (zh) 2007-08-15

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CNA2005800253023A Pending CN101019217A (zh) 2004-06-03 2005-06-03 具有公共引线框架上的倒装芯片设备的半导体设备模块

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CN (1) CN101019217A (de)
DE (1) DE112005001285B4 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011137733A3 (zh) * 2011-04-29 2012-04-05 华为技术有限公司 电源模块及其封装集成方法
CN102751268A (zh) * 2011-04-22 2012-10-24 乾坤科技股份有限公司 具有堆叠电容的金属氧化物半导体场效应晶体管对及方法
CN103681572A (zh) * 2012-08-13 2014-03-26 快捷半导体(苏州)有限公司 多芯片组件功率夹片
CN111365677A (zh) * 2013-10-18 2020-07-03 法雷奥照明公司 用于将至少一个光源电连接至电源供应系统的系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388319B1 (en) * 1999-05-25 2002-05-14 International Rectifier Corporation Three commonly housed diverse semiconductor dice
JP4124981B2 (ja) * 2001-06-04 2008-07-23 株式会社ルネサステクノロジ 電力用半導体装置および電源回路
US6946740B2 (en) * 2002-07-15 2005-09-20 International Rectifier Corporation High power MCM package
US7045884B2 (en) * 2002-10-04 2006-05-16 International Rectifier Corporation Semiconductor device package

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751268A (zh) * 2011-04-22 2012-10-24 乾坤科技股份有限公司 具有堆叠电容的金属氧化物半导体场效应晶体管对及方法
CN102751268B (zh) * 2011-04-22 2015-04-22 乾坤科技股份有限公司 具有堆叠电容的金属氧化物半导体场效应晶体管对及方法
WO2011137733A3 (zh) * 2011-04-29 2012-04-05 华为技术有限公司 电源模块及其封装集成方法
CN103681572A (zh) * 2012-08-13 2014-03-26 快捷半导体(苏州)有限公司 多芯片组件功率夹片
CN103681572B (zh) * 2012-08-13 2017-07-04 快捷半导体(苏州)有限公司 多芯片组件功率夹片
CN111365677A (zh) * 2013-10-18 2020-07-03 法雷奥照明公司 用于将至少一个光源电连接至电源供应系统的系统
US11353190B2 (en) 2013-10-18 2022-06-07 Valeo Vision System for the electrically connecting at least one light source to an electrical power supply system

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DE112005001285T5 (de) 2007-05-16
DE112005001285B4 (de) 2013-07-18

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Open date: 20070815