CN100587103C - Calibration device for vacuum evaporation plating - Google Patents
Calibration device for vacuum evaporation plating Download PDFInfo
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- CN100587103C CN100587103C CN200580051108A CN200580051108A CN100587103C CN 100587103 C CN100587103 C CN 100587103C CN 200580051108 A CN200580051108 A CN 200580051108A CN 200580051108 A CN200580051108 A CN 200580051108A CN 100587103 C CN100587103 C CN 100587103C
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- 238000007738 vacuum evaporation Methods 0.000 title claims description 17
- 238000007747 plating Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000000725 suspension Substances 0.000 claims abstract description 22
- 230000008021 deposition Effects 0.000 claims abstract description 5
- 238000001704 evaporation Methods 0.000 claims description 10
- 230000008020 evaporation Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 42
- 238000001771 vacuum deposition Methods 0.000 abstract description 5
- 238000000151 deposition Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000005755 formation reaction Methods 0.000 description 13
- 239000004020 conductor Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 230000008485 antagonism Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000012809 cooling fluid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
Abstract
An alignment device for vacuum deposition, having a substrate holder (11) held above a mask, the substrate holder (11) being held in a vacuum container (3) by a suspension member (12) inserted througha through-hole (1b) formed in a plate (1a) for installation that is an upper wall surface of the vacuum container; a plate (13) for connection, provided outside the vacuum container and connected tothe suspension member; a position adjustment device (14) capable adjusting the position relative to the mask of a substrate (5) in a deposition chamber (2) by moving the plate for connection; an extendable tubular shielding member (15) fitted over the suspension member and provided between the outer periphery of the through-hole (1b) in the plate for installation and the plate for connection, shielding between the vacuum side and the atmosphere side; and an urging device (16) for generating urging force in the direction reverse to that of pressing force that is generated by the inside of the tubular member being vacuum and is applied to the plate for connection.
Description
Technical field
The present invention relates to a kind of calibration device for vacuum evaporation plating.
Background technology
In the past, when making semiconductor chip etc., make the semiconductor material evaporation in vacuum vessel, simultaneously, evaporation forms the conductor fig of being scheduled to substrate surface.
In the occasion that forms this conductor fig, be formed with the mask of conductor fig usually in the surface configuration of substrate, expose to being coated on its surperficial photoresist material, thereby form conductor fig (for example with reference to Japanese kokai publication hei 5-159997 communique).
Summary of the invention
The problem that invention will solve
, in vacuum vessel, need relative mask that substrate is disposed at the predetermined position, be provided with the calibrating installation that is used to carry out this contraposition.
Though this calibrating installation is disposed in the vacuum vessel, be disposed at occasion in the vacuum vessel at the calibrating installation that aligning accuracy is high, need to use and emit parts and the lubricant that few special material constitutes by gas, simultaneously, need heat radiation countermeasure etc., so device itself is very expensive.
On the other hand, for fear of such state of affairs, can consider calibrating installation is disposed at the outside of vacuum vessel.
In the occasion that calibrating installation is disposed at the outside of vacuum vessel, need the vacuum of the insertion portion of substrate retaining member in vacuum vessel of calibrating installation to keep mechanism, therefore, need special sealing mechanism or processing, device is still expensive.
In addition,, might in other words, accept atmospheric big external force, produce strain, cause aligning accuracy to descend by vacuum power for the insertion portion of substrate retaining member in vacuum vessel.
Therefore, in order to address the above problem, the object of the present invention is to provide a kind of calibration device for vacuum evaporation plating that installs the manufacturing cost cheapness of self and can keep high-precision contraposition.
The means that are used to deal with problems
In order to address the above problem, the relative mask of calibration device for vacuum evaporation plating of the present invention carries out the contraposition of this substrate, and this mask is using during with the substrate of deposition material evaporation in remaining in vacuum vessel surperficial by predetermined pattern; Wherein: have substrate holder, connecting board, position regulator, telescopic tubular cut-off component and force application apparatus; Keep by suspension element above the mask of this substrate holder in remaining in above-mentioned vacuum vessel, this suspension element is inserted the communicating pores that leads to the wall body that is formed at this vacuum vessel; This connecting board is located at the foreign side of above-mentioned vacuum vessel, and is connected in above-mentioned suspension element; This position regulator can make this connecting board move and adjust the position of the relative mask of substrate in the deposited chamber that remains in substrate holder; This telescopic tubular cut-off component is embedded in above-mentioned suspension element outward, and is located between the periphery and above-mentioned connecting board of communicating pores of wall body blocking inlet side and atmospheric side; This force application apparatus produces and is in the opposite power of thrust pressure direction that acts on connecting board that vacuum state produces with the inboard of above-mentioned tubular cut-off component.
In addition, above-mentioned position regulator is so that the substrate that remains in connecting board by suspension element and substrate holder can be parallel to the mode that mask surface moves constitutes.
In addition, has the function that can move connecting board at above-mentioned position regulator at the orthogonal axis direction of substrate surface.
In addition, this vacuum evaporation constitutes with the mode of standard set-up with the power that can adjust force application apparatus.
The effect of invention
According to above-mentioned formation, when mask carries out the contraposition of substrate relatively under predetermined vacuum, because position regulator at the exterior arrangement substrate of vacuum vessel, so, do not need to use and considered the material under the vacuum etc., simultaneously, do not need special sealing mechanism etc. yet, therefore, the manufacturing cost of installing self becomes cheap.
In addition and since have can with the force application apparatus of the power of the thrust pressure antagonism that under vacuum, produces by normal atmosphere, so, can prevent in the unnecessary external force of position regulator effect, therefore, can keep the contraposition of the relative mask of substrate accurately.
Description of drawings
Fig. 1 illustrates the sectional view that the summary of the vacuum deposition apparatus of the calibrating installation that is provided with the invention process form 1 constitutes.
Fig. 2 is the substrate holder of this calibrating installation and the general perspective of substrate.
Fig. 3 is the general perspective of this calibrating installation.
Fig. 4 is the sectional view of this calibrating installation.
Fig. 5 is the orthographic plan of running gear in the plane of this calibrating installation, and the formation of running gear in the plane (a) is shown, and its action (b)～(f) is described.
Fig. 6 is the substrate of this calibrating installation of explanation and the orthographic plan to bit motion of mask.
Fig. 7 is the sectional view of the calibrating installation of the invention process form 2.
Fig. 8 is the sectional view of modified example that the calibrating installation of this form of implementation 2 is shown.
Fig. 9 is the sectional view of another modified example that the calibrating installation of this form of implementation 2 is shown.
Figure 10 is the sectional view of the calibrating installation of the invention process form 3.
Figure 11 is the sectional view of modified example of the calibrating installation of this form of implementation 3.
Figure 12 is the sectional view of another modified example of the calibrating installation of this form of implementation 3.
Embodiment
The following describes the calibration device for vacuum evaporation plating of the invention process form.
This calibration device for vacuum evaporation plating for example is located at the vacuum deposition apparatus of the display part that is used to make OLED display, when using mask organic materials (deposition material) evaporation to be obtained conductor fig to the surface of glass substrate, be used to keep mask and relative glass substrate to carry out the contraposition of this mask by predetermined figure.
[form of implementation 1]
Below, the calibration device for vacuum evaporation plating of form of implementation 1 is described according to Fig. 1～Fig. 6.
As shown in Figure 1, this calibrating installation 1 is located at the upper wall 3a of vacuum vessel 3 by installing with plate (example of wall body) 1a, and this vacuum vessel 3 has and is used under vacuum the deposited chamber 2 of organic materials evaporation to the surface of glass substrate.Can not use plate yet, and directly be installed to the whole upper wall that is provided with above vacuum vessel by installing.
At the bottom of the deposited chamber 2 of above-mentioned vacuum vessel 3 configuration evaporation source 4, simultaneously, top position at the deposited chamber 2 of vacuum vessel 3 keeps glass substrate (to call substrate in the following text) 5 by calibrating installation 1, in addition, below this substrate 5, the mask 6 that is used to form predetermined conductor fig is kept by mask holder 8 by its installing frame 7.Be provided with sending into of substrate 5 and mask 6 at the sidewall 3b of vacuum vessel 3 and send with opening 9, sending into and sending of substrate 5 and mask 6 uses the mechanical manipulator (not shown) to carry out.
At above-mentioned calibrating installation 1, as Fig. 2～as shown in Figure 4, have 11,2 suspension elements 12 cylindraceous of substrate holder rectangular under the plan view for example, rectangular connecting board 13, position regulator 14, telescopic tubular cut-off component (for example using the vacuum ripple pipe) 15 and force application apparatus 16 under plan view for example; This substrate holder 11 constitutes by the flaky electrostatic chuck 11b that adsorbable substrate 5 is set at tabular retainer main body 11a; These 2 suspension element 12 cylindraceous 2 positions about this substrate holder 11 connect the bottom, and simultaneously, the upper end is inserted to lead to and is formed at the communicating pores 1b that installs with plate 1a, is projected into the outside of vacuum vessel 3; This connecting board 13 is located at the outside of vacuum vessel 3, connects the upper end be connected to above-mentioned 2 suspension elements 12, and its upper end open portion opening in the above; This position regulator 14 is disposed at above-mentioned installation with above the plate 1a, moves by making connecting board 13, thereby can adjust the position of the substrate 5 relative masks 6 in the deposited chamber 2 that remains in substrate holder 11; This telescopic tubular cut-off component 15 is outer to be embedded in above-mentioned each suspension element 12, simultaneously, is located at the periphery and 13 of above-mentioned connecting boards of installing with the communicating pores 1b of the communicating pores 1a of plate 1a, blocking inlet side and atmospheric side; This force application apparatus 16 produces (applying) and the rightabout power of thrust pressure that acts on connecting board 13, and this thrust pressure that acts on connecting board 13 produces for vacuum state by the inboard that makes this tubular cut-off component 15.Above-mentioned tubular cut-off component 15 is connected with last ring-type mount pad 18 by the following ring-type mount pad 17 of pre-determined inner diameter respectively with connecting board 13 sides with plate 1a side with installing, the power (by the thrust pressure of atmospheric generation) that produces by vacuum affact tubular cut-off component 15 be located at installation use plate 1a side on the installation portion port area (contact area) of ring-type mount pad 18.
Above-mentioned position regulator 14 is made of running gear in the plane 21 and vertical shifting device 22; In this plane running gear 21 can with the surperficial parallel plane of mask 6 in make that connecting board 13 parallelly moves, revolution (center with plate is the revolution of center of turning circle) and rotation (is the revolution at center with the position different with the center of plate); This vertical shifting device 22 can be by moving with the orthogonal vertical direction of mask 6 (or connecting board) (axis direction).
Running gear 21 is such as shown in Figure 4 and Figure 5 in the above-mentioned plane, is made of with supporting device 33 and the movable plate 35 that supports by the web member 34 of being located at these each supporting devices 32,33 with supporting device 32 and the guiding that is disposed at 1 remaining position supporting plate rectangular in the plan view 31, the driving that is disposed at 3 positions in 4 jiaos on this supporting plate 31; In addition, this movable plate 35 is allowed the moving of vertical direction by lifting with guiding mechanism 36 with connecting board 13, simultaneously, and the mobile interlock (servo-actuated) in horizontal plane.
Above-mentioned driving is a known technology with supporting device 32, as shown in Figure 5, in horizontal plane, promptly, can move by linear steering mechanism 37 at the X-Y direction of principal axis, simultaneously, can force to move along a side axial (X-axis or Y direction) by servosystem 38, in addition, guiding can be by moving freely at the X-Y direction of principal axis with above-mentioned same linear steering mechanism 39 with supporting device 33.
3 drivings can be forced configuration movably in same direction with 2 in the supporting device 32, simultaneously, remaining 1 can be by forcing configuration movably with the orthogonal direction of above-mentioned 2 pressure travel direction, by driving predetermined (1 in these 3,2 or 3) driving with the servosystem 38 in the supporting device 32, thereby can make movable plate 35 towards X-direction (with reference to Fig. 5 (b)), Y direction (with reference to Fig. 5 (c)), the vergence direction (with reference to Fig. 5 (d)) of relative X-axis and Y-axis, center with movable plate 35 is the turning direction (with reference to Fig. 5 (e)) of rotating shaft, with supporting device 32 sides arbitrarily is that the direction (with reference to Fig. 5 (f)) of center rotation moves, can make movable plate 35 in horizontal plane towards direction arbitrarily with by turning angle or rotation angle move arbitrarily.
Above-mentioned lifting is such as shown in Figure 3 and Figure 4 with guiding mechanism 36, is made of with 41,4 axis of guides 42 of plate and 4 guide cylinders 43 installation rectangular in plan view; This installation with plate 41 be located at integratedly movable plate 35 above; These 4 axis of guides 42 stand with the front and back of plate 41 and in position, the left and right sides in this installation and establish; These 4 guide cylinders 43 are located at connecting board 13 sides, are embedded in each axis of guide 42 outward, are guided at above-below direction with moving freely.On drawing, the left and right sides axis of guide 42 and the guide cylinder 43 at front portion or rear portion only is shown.
As vertical shifting device 22, use electronic cylinder (being driven by servosystem), the going out to move back with bar 22a of this electronic cylinder is connected in above-mentioned installation usefulness plate 41, goes out to move back by making this go out to move back with bar 22a, thereby make substrate holder 11 liftings by connecting board 13, adjust the interval of substrate 5 relative masks 6.
Above-mentioned force application apparatus 16 is used for offsetting the thrust pressure by the normal atmosphere generation that (or alleviating) acts on the end face side in the tubular cut-off component 15, and being communicated in deposited chamber 2 by communicating pores 1b in this tubular cut-off component 15 becomes vacuum state.
That is, this force application apparatus 16 by the installation that in lateral plan, is a shape with ring-type mount pad 54 and telescopic tubular cut-off component (for example vacuum corrugated tube) 55 formations on the following ring-type mount pad 53 of framework 51, pre-determined inner diameter, the pre-determined inner diameter; This installation strides across connecting board 13 ground with framework 51 and stands to be located to install and use plate 1a; This time ring-type mount pad 53 be located at pedestal 52 above, this pedestal 52 is located at the position, the left and right sides of above-mentioned connecting board 13; Should go up ring-type mount pad 54 and be located at above-mentioned installation below the horizontal part 51a of framework 51; This telescopic tubular cut-off component 55 is connected 53,54 of these ring-type mount pads up and down.Be communicated in the vacuum vessel 3 with hole 56 by being formed at the connection of installing in each tubular cut-off component 55 about these with in the framework 51, therefore, this connection is communicated in the vacuum vessel 3 by being formed at the communicating aperture 1c that installs with plate 1a with the base end side in hole 56, simultaneously, another distolateral be located at install with the horizontal part 51a of framework 51 on the corresponding position opening of ring-type mount pad 54.
At least the port area of the last ring-type mount pad 18 of following ring-type mount pad 53 below being located at it of being located at top (being actually the top of pedestal 52) of connecting board 13 equates each other.That is, vacuum contact part of the same area is set in the top and bottom of connecting board 13, the thrust pressure that is caused by vacuum acts on equably from the top and bottom of connecting board 13, so, can prevent in the unnecessary external force of connecting board 13 effects.
In addition, as shown in Figure 4, use the framework of tubular as above-mentioned suspension element 12, simultaneously, at substrate holder 11 connection that is connected in two suspension elements 12 passage of hole 12a (for hole portion) 11c is set, supply with cooling fluids such as water from the upper end open of suspension element 12, thereby can cool off substrate 5, carry out from these connections electric distribution of the upper end of hole 12a to electrostatic chuck 11b.
In addition, such as shown in figures 1 and 3, for the mask 6 that remains in mask holder 8 relatively carries out the contraposition of substrate 5, promptly as shown in Figure 6, the circular masks side mark M1 that makes the substrate side mark M2 of the point-like of being located at substrate 5 sides enter into the bight on the diagonal lines of being located at mask 6 carries out contraposition interiorly, in connecting board 13 sides CCD camera head 57 is set, certainly, is provided with vision slit 58 with plate 1a side in installation.The shape of each mark then also can be Any shape such as cruciform as recognition image easily.
The contraposition operation of substrate 5 relative masks 6 in vacuum vessel 3 is described in the above-described configuration.
At first, as shown in Figure 1, send with opening 9 from the sending into of sidewall 3b that is formed at vacuum vessel 3, use mechanical manipulator substrate 5 to be inserted into the top of the mask 6 that keeps by mask holder 8, simultaneously, keep substrate 5 by electrostatic chuck 11b, then, mechanical manipulator is taken out from vacuum vessel 3, close to send into and send with opening 9.
Under this vacuum, as described above, top and bottom at connecting board 13 are provided with vacuum contact part of the same area by tubular cut-off component 15,15 (ring-type of correctly saying so mount pad 18,53), so, do not act on the unnecessary external force that produces by vacuum at this connecting board 13.
Then, relatively remain in mask 6 in the deposited chamber 2, carry out the contraposition of the substrate 5 that keeps by above-mentioned substrate holder 11 by mask holder 8.
In order to carry out the contraposition of substrate 5 relative these masks 6, use 2 camera heads 57 that are disposed on the diagonal lines.
Promptly, as shown in Figure 6, the substrate side mark M2 of the point-like of being located at substrate 5 sides is entered in the plane of ground activation point setting device 14 in the mask side mark M1 of the circle of being located at mask 6 sides behind the running gear 21, by vertical shifting device 22 mobile substrates 5, the feasible surface that almost touches mask 6.
When the contraposition of substrate 5 relative masks 6 is finished, by the heating of evaporation source 4, organic materials (deposition material) is attached to the surface of substrate 5 corresponding to the figure of mask 6, form predetermined conductor fig.
When forming predetermined conductor fig, send with after the opening 9 taking-up substrates 5 from sending into by mechanical manipulator, new substrate 5 is inserted in the vacuum vessel 3, remain in substrate holder 11, then, carry out contraposition as described above, form conductor fig and get final product.
Like this, when under predetermined vacuum, carrying out the contraposition of substrate 5 relative masks 6, owing to the outside that the position regulator 14 of substrate 5 is disposed at vacuum vessel 3, so, can make the formation cheapness of device self.
In addition, when being formed for suspension element 12 with the substrate 5 of this calibrating installation 1 and guiding to the communicating pores 1b of outside of vacuum vessel 3, owing to be used for that this communicating pores 1b is connected tubular cut-off component 55 (port area of ring-type mount pad 18) with the opposition side of tubular cut-off component 15 in the mounting portion of connecting board 13 of atmospheric side blocking, this tubular cut-off component 55 has the sectional area identical with this tubular cut-off component 15 and is communicated under the vacuum of vacuum vessel 3, promptly has the force application apparatus 16 that can resist the thrust pressure that under vacuum, produces by normal atmosphere, so, can prevent in the unnecessary external force of calibrating installation 1 effect, therefore, do not produce strain, can carry out the contraposition of the relative mask of substrate by high precision at device.
In detail, can obtain following such effect.
1. because the vertical shifting device 22 that makes running gear 21 in the plane that substrate 5 moves and move in horizontal plane in the outside of vacuum vessel 3 (under the normal atmosphere) configuration in vertical direction, so, do not need the refrigerating unit of special vacuum with mechanical part, electric motor, so, cheap and high-precision calibrating installation can be provided.
2. owing to dispose each running gear 21,22 in the outside of vacuum vessel 3 (under the normal atmosphere), simultaneously, force application apparatus 16 with power of the thrust pressure antagonism that can apply and under vacuum, act on, so, can alleviate the power that acts on each running gear 21,22 that is produced by vacuum, therefore, driving arrangements such as the electric motor of running gear can use the little driving arrangement of capacity, so, can obtain more cheap formation.
3. in addition, owing to dispose each running gear 21,22 in the outside of vacuum vessel 3 (under the normal atmosphere), simultaneously, have can apply can with the force application apparatus 16 of the power of the thrust pressure that under vacuum, acts on antagonism, so, can be suppressed at device self and produce strain, simultaneously, the visual field offset of the camera head 57 that the contraposition of substrate 5 is used can be prevented, therefore, high-precision contraposition can be carried out.
4. owing to keep substrate 5 with electrostatic chuck 11b, so, can keep the planeness of substrate 5, therefore, can reduce distance very little with mask 6, so, can carry out more high-precision contraposition.
5. in addition, owing to keep substrate 5 by electrostatic chuck 11b, so, can keep the planeness of substrate 5, press by uniform face to make substrate 5 be contacted with mask 6, therefore, can carry out high-precision contraposition.
6. owing to be formed for the suspension element 12 of bearing substrate retainer 11 and be communicated in the interior connection of retainer main body 11a hole 12a and passage 11c, simultaneously, these are communicated with being under the normal atmosphere in hole 12a and the passage 11c, thereby do not hinder calibration can easily carry out the cooling of substrate holder 11, simultaneously, the electric distribution at electrostatic chuck 11b also carries out easily.This be because, when using vacuum to supply with cooling fluid, need cover flexible pipe by metal system corrugated tube etc. with flexible pipe etc., for this reason, the rigidity height of flexible pipe side becomes the obstruction factor of the calibration that needs about several microns precision.
[form of implementation 2]
Below, the calibration device for vacuum evaporation plating of form of implementation 2 is described according to Fig. 7.
In above-mentioned form of implementation 1,, the device that utilizes the vacuum (vacuum power) in the vacuum vessel 3 has been described, but in this form of implementation 2, has utilized spring force as force application apparatus 16.
Form of implementation 1 is the part of this force application apparatus with form of implementation 2 differences, so, in this form of implementation 2, be conceived to this part and describe, other member of formation adopts the numbering identical with form of implementation 1 to describe (in form of implementation 3 described later too).
That is, as shown in Figure 7, be located at connecting board 13 about pedestal 52 and install with between the framework 51, the force application apparatus as bringing into play with the equal pulling force of the thrust pressure that is produced by vacuum for example is provided with whisker 61.
According to whisker 61 as this force application apparatus, then compare with the occasion in hole 56 with the connection that formation vacuum in installing with framework 51 is used, because its formation is simple, so, more cheap calibrating installation can be provided.
In addition, as shown in Figure 8,, also can obtain the effect same with above-mentioned form of implementation 2 even using pneumatic cushioning 71 to replace helical spring occasion.
In addition, also can use damper weight 81 to replace whisker as shown in Figure 9.
That is, lead to be connected to the pedestal 52 of each end side of being located at connecting board 13 with pulley 83 and be connected by being disposed at a plurality of (for example 2) that install with the horizontal part 51a of framework 51 in the other end of being connected in the cable body (for example line, rope etc.) 82 of damper weight 81, an end.
Certainly, the total weight of above-mentioned damper weight 81 can be resisted the thrust pressure that is produced by vacuum.
This formation also can obtain the effect same with above-mentioned form of implementation 2.
[form of implementation 3]
Below, the calibration device for vacuum evaporation plating of form of implementation 3 is described according to Figure 10.
In above-mentioned form of implementation 1, the vacuum (vacuum power) utilized in the vacuum vessel 3 occasion as force application apparatus 16 has been described, but in this form of implementation 3, has used pneumatic linear actuator.
Promptly, as shown in Figure 10, at the pedestal 52 of being located at connecting board about 13 and installation 51 configuration pneumatic linear actuators 91 of framework, in addition, this pneumatic linear actuator 91 for example uses the pneumatic linear actuator of single lever-type, simultaneously, the air supplying opening 93 in its bar side cylinder chamber 92 connects air supply pump 96 by the air pipe arrangement 95 that has pressure regulator 94 on the way.
Therefore, in making deposited chamber 2, be in vacuum following time to make 96 actions of air supply pump, produce and to get final product with the pulling force of the thrust pressure antagonism that produces by vacuum at pneumatic linear actuator 91.
In this occasion, obtain the effect same with form of implementation 1, in addition, by the air pressure that supplies to pneumatic linear actuator 91 is adjusted, thereby can adjust can with the size of the pulling force of thrust pressure antagonism.
In addition, in this form of implementation 3, for towards the top to connecting board 13 application of forces, pneumatic linear actuator 91 by the top that is disposed at this connecting board 13 carries out, but also can be as shown in Figure 11, configuration pneumatic linear actuator 91 at connecting board 13 and between installing with plate 1a, from the below towards the top to connecting board 13 application of forces.
According to this formation, do not need to install with framework and pedestal, but the reduction of the densification of implement device, lightweight and cost of manufacture.
In addition, be shown in the calibrating installation of Figure 11,, use electrostatic chuck, but also can keep substrate 5 with substrate holder 102 as shown in Figure 12 with pawl 101 for substrate is remained in substrate holder in modified example as form of implementation 3.Certainly, 4 positions were not provided with a plurality of (be located at and produce the such position of strained at substrate, as required, be located at 6 positions or 8 positions) around pawl 101 kept substrate 5.
In mask holder 103 sides, make when with substrate 5 mountings on mask 6 time pawl 101 be not contacted with mask holder 103 ground formation recess 103a.
In addition, lifting guiding mechanism as position regulator 14 shown in Figure 12, employing is by linear steering axle 111 and be embedded in the linear steering mechanism that mobile member 112 that a side of this linear steering axle 111 guided constitutes outward, replaces 4 axis of guides 42 of explanation in form of implementation 1 (Fig. 4) and 4 guide cylinders 43 that guided by this each axis of guide 42.In the column sections 103b of mask holder 103, form the path 10 3c of cooling fluid such as water.
According to this formation, do not use electrostatic chuck substrate 5 can be remained in the deposited chamber 2.
Figure 10～pneumatic linear actuator 91 shown in Figure 12 is configured in the pedestal 52 of connecting board 13 and installs and use 51 of frameworks or connecting board 13 and installation with between plate 1a, but, universal joint is installed at the both ends of pneumatic linear actuator 91 for connecting board 13 can move towards horizontal direction at least.In addition, in Figure 11 and Figure 12, will be fixed in as the cylinder main body of the downside of pneumatic linear actuator 91 side with plate 1a is installed, simultaneously, will rotate with ball (spot contact bearing) and be disposed at front end as the bar portion of upside, only be from downside connecting board 13 to be supported.
, though running gear 21 is made of with supporting device 33 with supporting device 32 and the guiding that is disposed at 1 position the driving that is disposed at 3 positions in the plane of above-mentioned each form of implementation, also can all constitute with supporting device 32 by driving.
In addition, in above-mentioned each form of implementation, to as the calibrating installation of organic EL Material evaporation in the vacuum deposition apparatus of glass substrate is illustrated, but the object as vacuum evaporation is not limited to this organic EL Material certainly, for example as long as for when making semiconductor device, in vacuum vessel, using mask on substrate, to form the device of conductor fig, then also applicablely arrive any vacuum deposition apparatus.
The possibility of utilizing on the industry
The present invention is because the mask that relatively is disposed in the vacuum tank by consisting of of cheapness carries out conduct By the contraposition of the glass substrate of evaporation member, so for example the organic EL of the most suitable formation shows The display part of device etc.
Claims (4)
1. calibration device for vacuum evaporation plating, mask carries out the contraposition of substrate relatively, and this mask is in the use during with this substrate of deposition material evaporation to remaining in vacuum vessel in surperficial by predetermined pattern; It is characterized in that: have substrate holder, connecting board, position regulator, telescopic tubular cut-off component and force application apparatus;
Keep by suspension element above the mask of this substrate holder in remaining in above-mentioned vacuum vessel, this suspension element is inserted the communicating pores that leads to the wall body that is formed at this vacuum vessel;
This connecting board is located at the foreign side of above-mentioned vacuum vessel, and is connected in above-mentioned suspension element;
This position regulator can make this connecting board move and adjust the position of the relative mask of substrate in the deposited chamber that remains in substrate holder;
This telescopic tubular cut-off component is embedded in above-mentioned suspension element outward, and is located between the periphery and above-mentioned connecting board of communicating pores of wall body blocking inlet side and atmospheric side;
This force application apparatus produces and is in the opposite power of thrust pressure direction that acts on connecting board that vacuum state produces with the inboard of above-mentioned tubular cut-off component.
2. calibration device for vacuum evaporation plating according to claim 1 is characterized in that: position regulator is so that the substrate that remains in connecting board by suspension element and substrate holder can be parallel to the mode that mask surface moves constitutes.
3. calibration device for vacuum evaporation plating according to claim 2 is characterized in that: have and can move the function of connecting board with the orthogonal axis direction of substrate surface at position regulator.
4. calibration device for vacuum evaporation plating according to claim 1 is characterized in that: this vacuum evaporation constitutes with the mode of standard set-up with the power that can adjust force application apparatus.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2005/015453 WO2007023552A1 (en) | 2005-08-25 | 2005-08-25 | Alignment device for vacuum deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101228289A CN101228289A (en) | 2008-07-23 |
| CN100587103C true CN100587103C (en) | 2010-02-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200580051108A Expired - Fee Related CN100587103C (en) | 2005-08-25 | 2005-08-25 | Calibration device for vacuum evaporation plating |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101190106B1 (en) |
| CN (1) | CN100587103C (en) |
| WO (1) | WO2007023552A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5486951B2 (en) * | 2010-02-12 | 2014-05-07 | 株式会社アルバック | Vapor deposition mask, vapor deposition apparatus, and thin film formation method |
| JP5783811B2 (en) * | 2010-07-06 | 2015-09-24 | キヤノン株式会社 | Deposition equipment |
| JP5639431B2 (en) * | 2010-09-30 | 2014-12-10 | キヤノントッキ株式会社 | Deposition equipment |
| JP2012140671A (en) * | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | Film-forming apparatus |
| CN102184934B (en) * | 2011-04-02 | 2012-07-04 | 东莞宏威数码机械有限公司 | Mask vacuum contraposition device |
| WO2020091413A1 (en) * | 2018-10-30 | 2020-05-07 | 어플라이드 머티어리얼스, 인코포레이티드 | Substrate treatment device |
| CN114908329B (en) * | 2021-02-08 | 2024-03-08 | 台湾积体电路制造股份有限公司 | Correction method and semiconductor manufacturing apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1499299A (en) * | 2002-10-25 | 2004-05-26 | 东京毅力科创株式会社 | Substrate calibrating appts, its processing device and delivery appts. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3789857B2 (en) * | 2002-06-25 | 2006-06-28 | トッキ株式会社 | Vapor deposition equipment |
| JP4184771B2 (en) | 2002-11-27 | 2008-11-19 | 株式会社アルバック | Alignment equipment, film deposition equipment |
| JP4596794B2 (en) * | 2004-02-27 | 2010-12-15 | 日立造船株式会社 | Alignment equipment for vacuum deposition |
-
2005
- 2005-08-25 CN CN200580051108A patent/CN100587103C/en not_active Expired - Fee Related
- 2005-08-25 WO PCT/JP2005/015453 patent/WO2007023552A1/en active Application Filing
- 2005-08-25 KR KR1020087000743A patent/KR101190106B1/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1499299A (en) * | 2002-10-25 | 2004-05-26 | 东京毅力科创株式会社 | Substrate calibrating appts, its processing device and delivery appts. |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007023552A1 (en) | 2007-03-01 |
| CN101228289A (en) | 2008-07-23 |
| KR101190106B1 (en) | 2012-10-11 |
| KR20080034883A (en) | 2008-04-22 |
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