CN100576970C - 在接收基质上形成电导体图案的方法 - Google Patents

在接收基质上形成电导体图案的方法 Download PDF

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Publication number
CN100576970C
CN100576970C CN200680016938A CN200680016938A CN100576970C CN 100576970 C CN100576970 C CN 100576970C CN 200680016938 A CN200680016938 A CN 200680016938A CN 200680016938 A CN200680016938 A CN 200680016938A CN 100576970 C CN100576970 C CN 100576970C
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CN
China
Prior art keywords
matrix
metal nanoparticle
donor
layer
laser
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680016938A
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English (en)
Chinese (zh)
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CN101199245A (zh
Inventor
K·阮
Z·杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
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Eastman Kodak Co
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Publication date
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Publication of CN101199245A publication Critical patent/CN101199245A/zh
Application granted granted Critical
Publication of CN100576970C publication Critical patent/CN100576970C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN200680016938A 2005-05-17 2006-05-02 在接收基质上形成电导体图案的方法 Expired - Fee Related CN100576970C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/130,772 2005-05-17
US11/130,772 US7648741B2 (en) 2005-05-17 2005-05-17 Forming a patterned metal layer using laser induced thermal transfer method

Publications (2)

Publication Number Publication Date
CN101199245A CN101199245A (zh) 2008-06-11
CN100576970C true CN100576970C (zh) 2009-12-30

Family

ID=36938060

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680016938A Expired - Fee Related CN100576970C (zh) 2005-05-17 2006-05-02 在接收基质上形成电导体图案的方法

Country Status (6)

Country Link
US (1) US7648741B2 (enExample)
EP (1) EP1884146A1 (enExample)
JP (1) JP2008541481A (enExample)
KR (1) KR20080007465A (enExample)
CN (1) CN100576970C (enExample)
WO (1) WO2006124320A1 (enExample)

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JP2007035742A (ja) * 2005-07-25 2007-02-08 Seiko Epson Corp 薄膜トランジスタの形成方法
US8084101B2 (en) * 2006-08-01 2011-12-27 The Board of Regents of the Nevada Systems of Higher Education on behalf of the University of Nevada, Las Vegas Fabrication of patterned and ordered nanoparticles
JP2010515233A (ja) * 2007-01-05 2010-05-06 ビーエーエスエフ ソシエタス・ヨーロピア 導電性表面の形成方法
US7666567B2 (en) * 2007-10-23 2010-02-23 E. I. Du Pont De Nemours And Company Negative imaging method for providing a patterned metal layer having high conductivity
TW201001624A (en) * 2008-01-24 2010-01-01 Soligie Inc Silicon thin film transistors, systems, and methods of making same
CN101519184B (zh) * 2008-02-29 2012-05-23 财团法人工业技术研究院 利用光热效应制作应用基板的方法
WO2009154156A1 (ja) * 2008-06-16 2009-12-23 東レ株式会社 パターニング方法およびこれを用いたデバイスの製造方法ならびにデバイス
FR2946639B1 (fr) * 2009-06-12 2011-07-15 Saint Gobain Procede de depot de couche mince et produit obtenu.
US20110027499A1 (en) * 2009-07-30 2011-02-03 International Business Machines Corporation Radiation-assisted nanoparticle printing
DE102009050199A1 (de) * 2009-10-21 2011-04-28 Giesecke & Devrient Gmbh Herstellung von Leiterstrukturen auf Kunststoff-Folien mittels Nanotinten
DE102010015659A1 (de) * 2010-04-20 2011-10-20 Giesecke & Devrient Gmbh Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten
FR2980279B1 (fr) * 2011-09-20 2013-10-11 Soitec Silicon On Insulator Procede de fabrication d'une structure composite a separer par exfoliation
KR20140140188A (ko) * 2013-05-28 2014-12-09 삼성디스플레이 주식회사 도너기판 및 이의 제조방법 및 이를 이용한 전사패턴 형성방법
CN106576429A (zh) * 2014-05-27 2017-04-19 耶路撒冷希伯来大学伊森姆研究发展有限公司 制造金属图案和物体的方法
EP3284325B1 (de) * 2015-04-13 2023-10-04 Jan Franck Vorrichtung und verfahren zur herstellung von leiterplatten für elektrische und/oder elektronische schaltungen
FR3035540B1 (fr) * 2015-04-27 2017-04-28 Centre Nat Rech Scient Procede d'impression au moyen de deux lasers
US9776442B2 (en) 2015-12-30 2017-10-03 Palo Alto Research Center Incorporated Single pass imaging using rapidly addressable laser lamination
EP3663090A1 (en) 2018-12-04 2020-06-10 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO High resolution laser induced forward transfer
CN117465081A (zh) * 2023-10-12 2024-01-30 广东工业大学 一种高吸光率复合膜片及其在激光诱导转移中的应用

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US20040079195A1 (en) * 2000-12-15 2004-04-29 Perry Joseph W. Method for patterning metal using nanopraticle containing percursors

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US5292559A (en) * 1992-01-10 1994-03-08 Amp Incorporated Laser transfer process
US20040079195A1 (en) * 2000-12-15 2004-04-29 Perry Joseph W. Method for patterning metal using nanopraticle containing percursors
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Also Published As

Publication number Publication date
CN101199245A (zh) 2008-06-11
WO2006124320A1 (en) 2006-11-23
EP1884146A1 (en) 2008-02-06
KR20080007465A (ko) 2008-01-21
JP2008541481A (ja) 2008-11-20
US20060263725A1 (en) 2006-11-23
US7648741B2 (en) 2010-01-19

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091230

Termination date: 20180502