CN100538986C - The fixture of specimen and scanning electron microscopy - Google Patents
The fixture of specimen and scanning electron microscopy Download PDFInfo
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- CN100538986C CN100538986C CNB2006100243121A CN200610024312A CN100538986C CN 100538986 C CN100538986 C CN 100538986C CN B2006100243121 A CNB2006100243121 A CN B2006100243121A CN 200610024312 A CN200610024312 A CN 200610024312A CN 100538986 C CN100538986 C CN 100538986C
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Abstract
The invention provides a kind of fixture of specimen, be applied to semiconductor die testing, can comprise with lower member: fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen.The present invention is simple in structure, and is with low cost, owing to adopt mechanical mode that sample is fixed on the fixture, vibration can not appear in sample in scanning process, so can improve the image quality of SEM; Because the width of fixed sample is adjustable, so go in a process of lapping, making one or more sample, make efficient thereby can improve sample, improve the speed of sample test.
Description
Technical field
The present invention relates to semiconductor chip and analyze the field, particularly relate to the fixture of sample on the scanning electron microscopy sample stage in the preparation of specimen and the analytical test process.
Background technology
Along with the development of semiconductor integrated circuit, electron microscope is by being applied in the microstructure analysis to product more and more widely.The manufacturing of IC (integrated circuit) is to be piled up up by pattern in layer basically; and in order to understand the structure of piling up pattern; to improve processing procedure or to solve Problem of Failure in the processing procedure; utilizing destructive cutting mode to observe by electron microscope through regular meeting, is the most basic a kind of means of inspection process quality and cut cross section (CROSS SECTION), observe (brilliant garden) cross section.Electron microscope generally comprises scanning electron microscopy SEM (Scanning Electron Microscopy), transmission electron microscope TEM (Transmission Electron Microscopy).
Profile analysis with integrated circuit is an example, generally adopts SEM to analyze.The most frequently used function mode of SEM electron microscope is divergent bundle mode (EMISSIVE MODE), and electronics is emitted by filament, and is quickened by the voltage of 5-35KV, through electromagnetic lens electron beam is assembled again and is exposed to the test piece surface.Generally make electric current pass through corresponding cathode ray tube deviation electron beam simultaneously, and on fluorescent screen, produce similar and bigger scanning motion, reach the effect of amplification by scanning coil.Sweep electron microscope SEM separates as can be used for checking the solid test piece between light microscope and transmission electron microscope, because visual field depth is long, but clear display three-dimensional space picture.
Along with the development of 90nm and the following technology of 90nm, strained silicon (strained silicon) technology begins to be applied in the cmos device, is used for improving the performance of integrated circuit (IC)-components.The principle of this technology is that the mobility along the draw direction electronics will promote like this, causes resistance to reduce with the crystal stretching of silicon.So the silicon at the grid lower channel place of metal-oxide-semiconductor is made " strained silicon " of stretching, that electric current when metal-oxide-semiconductor is opened will more successfully flow between source electrode and drain electrode along draw direction, and speed also can be faster.In order to realize the development of strained silicon technology, can realize by the migratory direction that changes metal-oxide-semiconductor raceway groove place electronics.The semiconductor industry is mainly used the Silicon Wafer of (100) type, before, the alignment recess of wafer (notch) is engraved in＜and 110〉crystal orientation, channel electrons can be along＜110〉crystal orientation migrations so, and in the processing procedure of 90nm technology, the wafer alignment recess be engraved in＜100〉crystal orientation, the electronics at raceway groove place be along＜100〉crystal orientation migration.There are some researches prove that concerning monocrystalline silicon, the migration rate of electronics along＜100〉crystal orientation is much larger than＜110〉crystal orientation, thus improve the speed of service of metal-oxide-semiconductor greatly.
When carrying out the profile analysis of integrated circuit, wafer need be cut, form less sheet (for example, 1cm * 1cm).Generally, be to cut out breach at crystal round fringes, exerting pressure makes its season crack.For monocrystalline silicon, its natural cleavage plane is (110) face, if the alignment recess of wafer is＜100〉direction, the limit of rupturing so can become miter angle (shown in Fig. 1 a) with IC circuit perseverance.Fig. 1 a is the chip schematic top plan view, Fig. 1 b is the enlarged diagram of cutting edge, when carrying out profile analysis, what generally need to measure is value apart from B, but what measure according to the cutting edge of Fig. 1 b is the value of distance A, the two gap is bigger, so needed sample is ground (polishing) before measuring.
Fig. 2 is the existing fixture (holder) that is used for process of lapping and profile analysis process, and Fig. 2 a is the stereogram that has adhered to the fixture of specimen (sample), and Fig. 2 b is the schematic perspective view of fixture.The centre of fixture generally can comprise a screwed hole, is used for being connected on the sample room of SEM fixture or T type milling tool.As shown in Figure 2, the chip after precut sticks on the side of fixture by thermosol (hot melt glue).By grinding the part that chip exceeds fixture is removed, made polished face be parallel to the circuit of chip, so just can when sem analysis, obtain correct metal wire (Metal Line) and polysilicon lines (Poly Line) actual value at directions X.
A kind of preparation method of TEM/SEM specimen is disclosed in the U.S. US6734427 patent application document, can obtain higher preparation speed and lower preparation cost, what but it adopted remains and the similar fixture of Fig. 2 (holder), still by thermosol (hot melt glue) specimen is fixed.In a word, there is following shortcoming in existing test sample preparation with the fixture of analyzing employing:
At first, the existing fixed device can only be made a sample at every turn, and it is longer to grind the needed time, so inefficiency, cost is higher.
Secondly, owing to generally adhere to each other between sample and the fixture by thermosol (hot melt glue).By adopting thermosol is exactly that general thermosol is heated to 40-60 ℃ and will causes sample to separate with fixture in order to take off sample easily.Sample carries out Measurement and analysis by SEM after grinding and finishing, but because SEM uses is electron beam scanning, will bring heat on sample, causes sample temperature to raise, make adhere between sample and the fixture insecure.So when passing through the cross section of SEM scanning samples, cross section produces slight shake or vibration because adhesion is insecure through regular meeting; the image that very slight vibration will cause SEM scanning to produce is apprehensive; unintelligible, can't finish accurate data and measure, thereby cause testing efficiency low.
Moreover, adopt the existing fixed device, in process of lapping, owing to grind stressed or grind through regular meeting at a high speed the situation that sample falls down from fixture takes place, all that has been achieved is spoiled thereby cause the sample preparation process.
Summary of the invention
In view of the above problems, technical problem to be solved by this invention provides the fixture in a kind of preparation and the analytical test sample process, can keep stable by sample in scanning process, improves the SEM image quality; Can a plurality of samples of fabrication process yields, improve sample and make efficient; And can be installed on the electron microscope such as existing SEM convenient the use.
Another object of the present invention provides a kind of scanning electron microscopy SEM that uses the said fixing device.
For solving the problems of the technologies described above, the objective of the invention is to be achieved through the following technical solutions:
The invention provides a kind of fixture of specimen, be applied to semiconductor die testing, comprise with lower member: fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen.
Preferably, also being provided with along the section of described fixation wall direction on the described base is leg-of-mutton groove, and this triangular groove links to each other with fixation wall, and specimen is close to described fixation wall, and part places in this triangular groove.Preferably, described base also comprises the screwed hole that is used to connect other devices.Preferably, described compressed part also comprises the pad between specimen and removable wall.
Preferably, described compressed part comprises fixed station, holding screw and removable wall; Described fixed station is arranged on the base, and comprises screwed hole; Described holding screw passes the screwed hole of fixed station, links to each other with removable wall; By holding screw mobile cause described removable wall away from or near described fixation wall.
In another preferred embodiment, described fixed part comprises anchorage bar, on this anchorage bar screw thread is arranged, and described compressed part is provided with porose, described anchorage bar passes this hole makes fixed part link to each other with the fastening part, the removable wall that causes compressed part by nut mobile on anchorage bar away from or near described fixation wall.
The present invention also provides a kind of scanning electron microscopy SEM, comprise electron-optical system, scanning system, acquisition of signal amplification system, image demonstration and register system, vacuum system and power-supply system, it is characterized in that, also comprise the sample room that the specimen fixture is set, described fixture comprises fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen.
Preferably, also be provided with triangular groove on the base of described fixture, the plane of this triangular groove and fixed part links to each other and is parallel, and specimen is close to the plane of fixed part, and part places in this triangular groove.Preferably, the base of described fixture also comprises screwed hole.Preferably, also comprise pad on the removable wall of the compressed part of described fixture.
Above technical scheme compared with prior art can draw the present invention and have following advantage:
Because fixture of the present invention adopts mechanical mode that sample is fixed on the fixture, vibration can not appear in sample in scanning process, so can improve the image quality of SEM.
Because the width of fixed sample is adjustable in the fixture of the present invention, so go in a process of lapping, making one or more sample, in the test analysis process, also can analyze a plurality of samples simultaneously, make efficient thereby can improve sample, improve the speed of sample test.
Because it is simple in structure, with low cost that fixture of the present invention adopts, and can be directly installed on the existing SEM, the convenient use.
The preparation of TEM sample when fixture of the present invention also can be applied to analysis chip.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the cutting situation schematic diagram of semiconductor die testing sample;
Fig. 2 is the fixture of existing a kind of specimen;
Fig. 3 is first embodiment of the fixture of specimen of the present invention;
Fig. 4 is second embodiment of the fixture of specimen of the present invention;
Fig. 5 is that specimen is fixed on the force analysis schematic diagram on the fixture of the present invention;
Fig. 6 is the structural representation of scanning electron microscopy embodiment of the present invention.
Embodiment
Core concept of the present invention is: changed the available technology adopting thermosol specimen is sticked to the fixing situation of realization on the fixture, adopt the mode of fixation wall and removable wall mechanical compaction to realize fixing, thereby can avoid the vibration in the specimen electron beam scanning process, improve the quality of SEM scan image; And,, improve testing efficiency so can fix a plurality of specimen simultaneously because the distance between fixation wall and the removable wall is adjustable.
With reference to Fig. 3, be first embodiment of the fixture of specimen of the present invention.Fig. 3 a is the three-dimensional structure diagram of first embodiment.Fig. 3 b is the structure perspective view of first embodiment, adopts light lines to show positive invisible inside and polycrystalline substance.
The fixture of specimen of the present invention is mainly used in electron microscope and measures the preparation of sample before (Sample preparation grinds etc.), and the sample in measurement analytic process etc.Described electron microscope can be scanning electron microscopy SEM, also can be the electron microscope of the needs making sample of transmission electron microscope TEM or other types, and the present invention is not limited this.
The fixture of the described specimen of Fig. 3 is applied to semiconductor die testing, comprising: fixed part 31, compressed part 32 and base 33; Described fixed part 31 comprises a fixation wall 311 perpendicular to base, and described fixed part 31 is arranged on the base 33, and compressed part 32 comprises a removable wall 321 perpendicular to base; The space that forms between fixation wall 311, removable wall 321 and the base 33 is used for fixing specimen.Along with removable wall 321 away from or near fixation wall 311, the space size that can regulate the fixing test sample, thus still a plurality of specimen are once fixed in decision.The removable wall 321 of the fixture of specimen of the present invention can adopt various mechanical compaction structures well known to those skilled in the art, and Fig. 3 only enumerates an embodiment.
The fixture of the described specimen of Fig. 3 is roughly a cylinder in order to adapt to the requirement of general electron microscope.Base 33 is a cylinder; Fixed part 31 is for being arranged on the agent structure on the base 33, and its side comprises a cambered surface and a plane, and cambered surface is to be provided with for the overall structure that adapts to fixture, and the plane is in order to be close to the plane of specimen, thus guarantee stressed evenly.
The fixture of the described specimen of Fig. 3 has provided a kind of implementation of compressed part 32, and described compressed part 32 comprises fixed station 322, holding screw 323 and removable wall 321; Described fixed station 322 is arranged on the base 33, and comprises screwed hole 324; Described holding screw 323 passes the screwed hole 324 of fixed station 322, links to each other with removable wall 321; By holding screw 323 mobile cause described removable wall 321 away from or near described fixation wall 311.The structure of described fixed station 322 can be identical with the structure of fixed part 31, also can adopt other structures to realize that the effect of support activities wall 321 gets final product.Size as for parts such as screwed hole 324 or removable walls 321 is not core of the present invention place, so the present invention does not limit this.
Certainly, the manufacture process of general test sample needs to grind, when so specimen is fixed in the space that fixation wall, removable wall and base form, what need a specimen part is higher than fixed part and compressed part, promptly expose described fixture, thereby can grind, obtain the measurement, the observation cross section that need.Because the base material of semiconductor chip generally all is more crisp, can not bear very big pressure, so the area of removable wall need satisfy certain requirement, the general requirement slightly greatly, for persons skilled in the art, these are all known, so do not repeat them here.
The area of described removable wall generally greater than the screwed hole of fixed station, so when making described fixture, need earlier holding screw to be passed the screwed hole of described fixed station, is connected removable wall on the end face of described holding screw again.Described connected mode can adopt the mode of welding, and this mode is suitable for realization, certainly, also can adopt other known interconnection techniques.In order to make being welded on the described holding screw that removable wall can be smooth, and be parallel to described fixation wall as much as possible, the hole of a corresponding size can be set on described removable wall, connect described holding screw.Certainly, preferred, this hole can not penetrate described removable wall, and promptly the part of described holding screw enters in the removable wall.
Because specimen is through after precut, be generally the rectangle sheet, when being fixed on the space of removable wall 321, fixation wall 311 and base 33 formation, in order to grind out measurement cross section and aforementioned＜110 that need〉problem of crystal orientation season crack, the specimen miter angle setting of need tilting, be that specimen has only an angular contact on base, thereby might cause the unstable of specimen or measure the difficulty that the cross section is aimed at.In order to address this problem, fixture shown in Figure 3, also being provided with along the section of described fixation wall direction on the base 33 is leg-of-mutton groove 34, this triangular groove 34 links to each other with fixation wall 311, specimen is close to described fixation wall 311, and part places in this triangular groove 34.Like this, specimen angle just preferably inlay card in described triangular groove 34.Because general precut limit becomes miter angle with the measurement cross section that needs, so the section of this triangular groove 34 preferably can be set to isosceles right triangle.
The fixture of specimen shown in Figure 3, described base 33 can also comprise screwed hole 35, is used to connect other devices.Because after specimen is fixed on this fixture, grind or measure, so can directly this fixture be installed on electron microscope or the milling tool in that screwed hole 35 is set on the base 33, and do not need to connect middleware, thereby can improve the ease of use of this fixture and use popularity.Concrete size and position as for this screwed hole 35 then can change according to actual needs, and the present invention is not limited in this respect, and general can be provided with a screwed hole on the vertical direction of base.
The fixture of specimen shown in Figure 3, described compressed part 32 can also comprise pad, between specimen and removable wall 321, promptly can be attached on the removable wall 321.Because semiconductor chip is frangible, and holding screw to compress the application of force bigger, so, can on removable wall, increase pad, generally adopt elastomeric material preferable in order to protect specimen.
Because the signal that sem analysis is generally commonly used mainly is the secondary electron of reflection sample surfaces or cross section pattern, SEM is little to the contrast difference of silicon, silica, polysilicon layer, metal and the metal silicide of compositing chip, and owing to the section after grinding can't directly scan, so generally before SEM observes, must carry out certain corrosion treatment to the section of specimen.The sandwich construction that described corrosion treatment can adopt the mixed solution of HF or HF, HNO3 that Direct observation be can't see becomes the height pattern that SEM can observe, and for example, corrode certain silicon layer and form " hole ", and the metal level height is constant.After the corrosion, in parameter by distance between SEM observation and the measurement lines or layer structure.Because specimen is ground, burn into is measured generally can not take off specimen and carried out, but once fixing just passable, so preferred, the material require of fixture of the present invention is anticorrosive, for example: adopt 1Cr13 (C0.1%, stainless steel Cr13%).Corrosion needs according to different can adopt various material, and the present invention is not limited this.
With reference to Fig. 4, be the vertical view of second embodiment of the fixture of specimen of the present invention.
The structure of this second embodiment is similar with first embodiment, and institute's difference is the annexation of compressed part and fixed part, and similarity just repeats no more.The fixed part 41 of second embodiment comprises anchorage bar 411, on this anchorage bar 411 screw thread is arranged, described compressed part 42 is provided with porose 421, described anchorage bar 411 passes this hole 421 makes fixed part 41 link to each other with compressed part 42, the removable wall 422 that causes compressed part 42 by nut 412 mobile on anchorage bar 411 away from or near described fixation wall 413.Anchorage bar 411 generally can be arranged on the both sides of fixed part 41, the placement of specimen in the middle of not influencing like this.
Certainly, adjustable for the distance between fixed part and the compressed part in the present invention conceives, other multiple realization means can also be arranged, do not enumerate one by one at this.
With reference to Fig. 5, be that specimen is fixed on the force analysis schematic diagram on the fixture of the present invention.Because specimen 51 is more crisp, and the set-up procedure complexity, so need avoid the breaking-up of process of lapping as far as possible, promptly need to analyze to stressed, select abrasive parameters.As shown in Figure 5, need the factor of consideration to comprise: the area S of the pressure (press) that frictional force (Friction), specimen are subjected to, sample thickness T, example cross section, the height that sample need grind off, the coefficient of friction of ground flat and the fragility parameter of specimen material self etc.Only list the factor that some need be considered in this present invention, concrete computational process is undertaken by the technical staff in implementing process of the present invention.
With reference to Fig. 6, be the structural representation of scanning electron microscopy embodiment of the present invention.
The claimed scanning electron microscopy of the present invention is characterised in that, has adopted the fixture of specimen of the present invention.Scanning electron microscopy is in specimen surface point by point scanning imaging with focused beam.Sample is bulk or powder particle, and imaging signal can be secondary electron, backscattered electron or absorb electronics.Wherein secondary electron is topmost imaging signal.Energy by the electron gun emission is the electronics of 5～35keV, intersect spot as electron source with it, the fine electron beam that formation has certain energy, certain beam intensity and beam spot diameter, that dwindles through secondary condenser and object lens, under scanning coil drives, do grid type scanning by certain hour, spatial order in specimen surface.Focused beam and sample interact, and produce secondary (and other physical signalling), and the secondary amount changes with the specimen surface pattern.Secondary electron signal is detected device and collects and to convert electric signal to, is input to the picture tube grid after video amplifies, and the picture tube brightness of modulation and incident beam synchronous scanning obtains reflecting the secondary electron image of specimen surface pattern.
The primary structure of scanning electron microscopy shown in Figure 6 can comprise with lower member:
Electron-optical system 61: comprise parts such as electron gun, condenser (first, second condenser and object lens), lens isis, be used to form fine electron beam.
Scanning system 62: comprise sweep generator, scanning amplification controller, scanning deflection coil etc., be used to finish the sample scanning process.
Acquisition of signal amplification system 63: be used for surveying and collecting electronic signals such as secondary electron, backscattered electron.
Image shows and register system 64: early stage SEM adopts picture tube, camera etc.; Now digital SEM adopts computer system to carry out image demonstration and record management.
Vacuum system 65: sample test is crossed range request vacuum degree and is higher than 10-4Torr; General commonly used can having: oil-sealed rotary pump, diffusion pump, turbomolecular pump etc.
Power-supply system 66: can comprise high-voltage generator, pressure-oil tank etc.
Sample room 67: be used to place specimen, fixture 68 can be directly installed in the sample room, for example, and SEM4700, SEM4800.Described fixture 68 can comprise: fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen.Along with removable wall away from or near fixation wall, the space size that can regulate the fixing test sample, thus still a plurality of specimen are once fixed in decision.
More than the fixture and the scanning electron microscopy of a kind of specimen provided by the present invention is described in detail, used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1, a kind of fixture of specimen is applied to semiconductor die testing, it is characterized in that, comprising: fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen; Also being provided with along the section of described fixation wall direction on the described base is leg-of-mutton groove, and this triangular groove links to each other with fixation wall, and specimen is close to described fixation wall, and part places in this triangular groove.
2, the fixture of specimen as claimed in claim 1 is characterized in that, described base also comprises the screwed hole that is used to connect other devices.
3, the fixture of specimen as claimed in claim 1 is characterized in that, described compressed part also comprises the pad between specimen and removable wall.
4, the fixture of specimen as claimed in claim 1 is characterized in that, described compressed part also comprises fixed station and holding screw; Described fixed station is arranged on the base, and comprises screwed hole; Described holding screw passes the screwed hole of fixed station, links to each other with described removable wall; By holding screw mobile cause described removable wall away from or near described fixation wall.
5, the fixture of specimen as claimed in claim 1, it is characterized in that, described fixed part comprises anchorage bar, on this anchorage bar screw thread is arranged, described compressed part is provided with porose, described anchorage bar passes this hole makes fixed part link to each other with compressed part, the removable wall that causes compressed part by nut mobile on anchorage bar away from or near described fixation wall.
6, a kind of scanning electron microscopy SEM, comprise electron-optical system, scanning system, acquisition of signal amplification system, image demonstration and register system, vacuum system and power-supply system, it is characterized in that, also comprise the sample room that the specimen fixture is set, described fixture comprises fixed part, compressed part and base; Described fixed part comprises a fixation wall perpendicular to base, and described fixed part is arranged on the base, and compressed part comprises a removable wall perpendicular to base; The space that forms between fixation wall, removable wall and the base is used for fixing specimen; Also be provided with triangular groove on the base of described fixture, the plane of this triangular groove and fixed part links to each other and is parallel, and specimen is close to the plane of fixed part, and part places in this triangular groove.
7, scanning electron microscopy SEM as claimed in claim 6 is characterized in that, the base of described fixture also comprises screwed hole.
8, scanning electron microscopy SEM as claimed in claim 6 is characterized in that, also comprises pad on the removable wall of the compressed part of described fixture.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006100243121A CN100538986C (en) | 2006-03-02 | 2006-03-02 | The fixture of specimen and scanning electron microscopy |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100243121A CN100538986C (en) | 2006-03-02 | 2006-03-02 | The fixture of specimen and scanning electron microscopy |
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| CN100538986C true CN100538986C (en) | 2009-09-09 |
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| CN101846497A (en) * | 2010-04-29 | 2010-09-29 | 上海宏力半导体制造有限公司 | Key size calibration method and device thereof |
| CN102830056B (en) * | 2012-08-28 | 2014-11-12 | 杭州富如德科技有限公司 | Testing component of rotary liquid-solid two-phase flow erosive wear testing device |
| CN103198997B (en) * | 2013-03-22 | 2015-05-13 | 中国科学院半导体研究所 | Sample support with angle adjustment function |
| CN103700562A (en) * | 2013-12-25 | 2014-04-02 | 苏州新锐合金工具股份有限公司 | Height adjustment type scanning electron microscope sampler holder |
| CN103730312B (en) * | 2014-01-09 | 2015-12-02 | 东北大学 | A kind of sample platform for nanomechanic test system and using method thereof |
| CN104362133B (en) * | 2014-10-16 | 2017-10-10 | 东莞市柏尔电子科技有限公司 | A kind of fixing device of triode |
| CN106526826B (en) * | 2015-09-10 | 2019-07-05 | 中国计量科学研究院 | A kind of bracket of contactless light-permeable |
| JP7042071B2 (en) * | 2016-12-20 | 2022-03-25 | エフ・イ－・アイ・カンパニー | Integrated circuit analysis system and method using locally exhausted volume for e-beam operation |
| CN106876234B (en) * | 2017-04-17 | 2018-06-26 | 南京大学 | A kind of sample stage for the analysis of mineral facies automatic identification |
| CN107748274B (en) * | 2017-09-30 | 2020-12-15 | 中国船舶重工集团公司第七0七研究所 | Method for detecting internal vacuum degree of accelerometer through servo circuit frequency sweep |
| CN107991512B (en) * | 2017-11-09 | 2021-03-26 | Tcl华星光电技术有限公司 | Detection platform based on atomic force microscope |
| WO2020052490A1 (en) | 2018-09-11 | 2020-03-19 | Changxin Memory Technologies, Inc. | Method and apparatus for controlling tester, medium and electronic device |
| CN110361409A (en) * | 2019-07-19 | 2019-10-22 | 福建福清核电有限公司 | The multi-functional irradiation Special sample support of one kind and application method |
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