CN100535590C - 基板测定装置 - Google Patents

基板测定装置 Download PDF

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Publication number
CN100535590C
CN100535590C CNB2006100772445A CN200610077244A CN100535590C CN 100535590 C CN100535590 C CN 100535590C CN B2006100772445 A CNB2006100772445 A CN B2006100772445A CN 200610077244 A CN200610077244 A CN 200610077244A CN 100535590 C CN100535590 C CN 100535590C
Authority
CN
China
Prior art keywords
objective table
mentioned
table portion
substrate
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100772445A
Other languages
English (en)
Chinese (zh)
Other versions
CN1873373A (zh
Inventor
山下浩
山下典良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1873373A publication Critical patent/CN1873373A/zh
Application granted granted Critical
Publication of CN100535590C publication Critical patent/CN100535590C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
CNB2006100772445A 2005-05-30 2006-04-28 基板测定装置 Expired - Fee Related CN100535590C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005156507 2005-05-30
JP2005156507A JP2006329895A (ja) 2005-05-30 2005-05-30 基板測定装置

Publications (2)

Publication Number Publication Date
CN1873373A CN1873373A (zh) 2006-12-06
CN100535590C true CN100535590C (zh) 2009-09-02

Family

ID=37483910

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100772445A Expired - Fee Related CN100535590C (zh) 2005-05-30 2006-04-28 基板测定装置

Country Status (4)

Country Link
JP (1) JP2006329895A (ko)
KR (1) KR100730450B1 (ko)
CN (1) CN100535590C (ko)
TW (1) TWI285728B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102997795B (zh) * 2012-12-03 2015-10-21 京东方科技集团股份有限公司 一种摩擦装置和整机设备
CN105717154A (zh) * 2016-05-05 2016-06-29 东旭科技集团有限公司 用于测量板材收缩率的装置和方法
KR102390357B1 (ko) * 2016-06-23 2022-04-22 니폰 덴키 가라스 가부시키가이샤 유리 기판 왜곡 측정 방법 및 유리 기판 왜곡 측정 장치
JP6889216B2 (ja) * 2017-10-16 2021-06-18 ファナック株式会社 作業システム
JP7153231B2 (ja) * 2018-12-21 2022-10-14 日本電気硝子株式会社 ガラス板の撓み測定装置及びガラス板の製造方法
CN109813237A (zh) * 2019-01-28 2019-05-28 广东拓斯达科技股份有限公司 玻璃厚度检测装置
EP4060671A4 (en) * 2019-11-12 2023-01-04 Panasonic Intellectual Property Management Co., Ltd. POSITIONING DEVICE
KR102262532B1 (ko) * 2021-02-05 2021-06-07 박덕식 철도차량 하부장비 검수장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58187710U (ja) * 1982-06-08 1983-12-13 東芝機械株式会社 刷版の絵柄面積率測定装置
JP3221823B2 (ja) * 1995-11-24 2001-10-22 キヤノン株式会社 投影露光装置およびこれを用いた露光方法ならびに半導体製造方法
JPH11211615A (ja) * 1998-01-21 1999-08-06 Micronics Japan Co Ltd 表示パネル用基板の検査装置
JP2001358204A (ja) * 2000-06-15 2001-12-26 Tokyo Electron Ltd 検査ステージ
JP2003014649A (ja) * 2001-06-27 2003-01-15 Hitachi Kokusai Electric Inc 板状物体検査装置
KR100479904B1 (ko) * 2002-06-29 2005-03-30 삼성테크윈 주식회사 부품 검사 장치
KR100538003B1 (ko) * 2003-04-30 2005-12-20 주식회사 이오테크닉스 레이저 시스템의 ｘ－ｙ 스테이지의 이동오차 보정방법 및그 장치

Also Published As

Publication number Publication date
KR100730450B1 (ko) 2007-06-19
CN1873373A (zh) 2006-12-06
TWI285728B (en) 2007-08-21
JP2006329895A (ja) 2006-12-07
TW200702628A (en) 2007-01-16
KR20060124563A (ko) 2006-12-05

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090902

Termination date: 20110428