CN100533997C - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN100533997C
CN100533997C CNB2004100749810A CN200410074981A CN100533997C CN 100533997 C CN100533997 C CN 100533997C CN B2004100749810 A CNB2004100749810 A CN B2004100749810A CN 200410074981 A CN200410074981 A CN 200410074981A CN 100533997 C CN100533997 C CN 100533997C
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CN
China
Prior art keywords
mentioned
circuit
sensor
signal processing
processing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100749810A
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English (en)
Chinese (zh)
Other versions
CN1667975A (zh
Inventor
山下春造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CN1667975A publication Critical patent/CN1667975A/zh
Application granted granted Critical
Publication of CN100533997C publication Critical patent/CN100533997C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Air Conditioning Control Device (AREA)
  • Semiconductor Integrated Circuits (AREA)
CNB2004100749810A 2004-03-09 2004-09-01 电子装置 Expired - Fee Related CN100533997C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004064973A JP4049112B2 (ja) 2004-03-09 2004-03-09 電子装置
JP2004064973 2004-03-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2008100876640A Division CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法

Publications (2)

Publication Number Publication Date
CN1667975A CN1667975A (zh) 2005-09-14
CN100533997C true CN100533997C (zh) 2009-08-26

Family

ID=34918211

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2004100749810A Expired - Fee Related CN100533997C (zh) 2004-03-09 2004-09-01 电子装置
CN2008100876640A Expired - Fee Related CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008100876640A Expired - Fee Related CN101257768B (zh) 2004-03-09 2004-09-01 电子电路及其控制方法

Country Status (3)

Country Link
US (2) US7304857B2 (enExample)
JP (1) JP4049112B2 (enExample)
CN (2) CN100533997C (enExample)

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DE102004008738A1 (de) * 2004-02-23 2005-09-08 BSH Bosch und Siemens Hausgeräte GmbH Elektronische Baugruppe und Verfahren zur Herstellung dieser
JP4552670B2 (ja) * 2005-01-31 2010-09-29 株式会社日立製作所 センサノード、基地局、及びセンサネットワークシステム
JP4848732B2 (ja) * 2005-10-17 2011-12-28 株式会社日立製作所 端末装置
US8290747B2 (en) * 2005-10-21 2012-10-16 Microstrain, Inc. Structural damage detection and analysis system
JP4800981B2 (ja) * 2006-02-08 2011-10-26 セイコーインスツル株式会社 無線通信装置
JP5285842B2 (ja) * 2006-04-13 2013-09-11 パナソニック株式会社 集積回路実装基板および電力線通信装置
US8118483B2 (en) 2006-06-21 2012-02-21 Intel Corporation Thermal sensor having toggle control
JP4814018B2 (ja) 2006-08-29 2011-11-09 株式会社日立製作所 センサノード
US20080225445A1 (en) * 2007-03-14 2008-09-18 Zippy Technology Corp. Arc-discharge protection device with temperature detection mode
US8115629B2 (en) * 2009-09-24 2012-02-14 Microdata Corporation Collective objects management system using R.F. object identification with multiple crystals
KR101049477B1 (ko) 2009-09-30 2011-07-15 제주대학교 산학협력단 센서 인터페이스 보드 어셈블리
JP5470556B2 (ja) * 2010-07-16 2014-04-16 伊原電子工業株式会社 生体信号検出装置、その制御方法及びプログラム
JP5269864B2 (ja) * 2010-12-07 2013-08-21 株式会社東芝 半導体装置
US9258030B2 (en) 2011-02-10 2016-02-09 Mediatek Inc. Wireless communication device
US9713093B2 (en) 2011-02-10 2017-07-18 Mediatek Inc. Wireless communication device
US8971378B2 (en) 2011-02-10 2015-03-03 Mediatek Inc. Wireless communication device
US9369172B2 (en) 2011-02-10 2016-06-14 Mediatek Inc. Wireless communication device
JP5818310B2 (ja) * 2011-06-27 2015-11-18 セイコーインスツル株式会社 センサ端末、センサシステム及びその方法
US20130039230A1 (en) * 2011-08-09 2013-02-14 Jaesik Lee Method and Device for Wireless Broadcast Power-up Sequence in Wireless Sensor Network
US10222272B2 (en) * 2012-07-24 2019-03-05 Renesas Electronics Corporation Semiconductor device and electronic apparatus
JP6340285B2 (ja) 2014-08-22 2018-06-06 ルネサスエレクトロニクス株式会社 半導体装置、電子装置およびセンシング方法
JP6571358B2 (ja) * 2015-03-24 2019-09-04 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
KR20160120496A (ko) * 2015-04-08 2016-10-18 삼성전기주식회사 실장 기판 모듈
JP6725059B2 (ja) * 2017-03-15 2020-07-15 株式会社村田製作所 高周波モジュール及び通信装置
US11375607B2 (en) * 2019-03-28 2022-06-28 Apple Inc. Mirrored voltage regulator for high-current applications and method the same
WO2021234989A1 (ja) * 2020-05-18 2021-11-25 三菱電機株式会社 センサー電源制御システムおよび空気清浄機
CN116746070A (zh) 2021-01-25 2023-09-12 三星电子株式会社 用于控制通信模块的发射功率的电子装置和方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5938956A (en) * 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US6567703B1 (en) * 2000-11-08 2003-05-20 Medtronic, Inc. Implantable medical device incorporating miniaturized circuit module
CN1461057A (zh) * 2002-05-23 2003-12-10 罗姆股份有限公司 图像传感器组件及其制造方法

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US4616655A (en) * 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
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JPH1027987A (ja) * 1996-07-10 1998-01-27 Hitachi Ltd 低ｅｍｉ回路基板及び低ｅｍｉケーブルコネクタ
US5781078A (en) * 1996-12-05 1998-07-14 Glenayre Electronics, Inc. Filter enhancement using input-to-output ground isolation and shielding
KR100238408B1 (ko) * 1997-02-26 2000-01-15 김승찬 컴퓨터 도난 방지 시스템
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WO1999013676A2 (en) * 1997-09-12 1999-03-18 Williams Wireless, Inc. Wide area telemetry network
US6013876A (en) * 1998-01-23 2000-01-11 General Instrument Corporation Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board
JP3199039B2 (ja) * 1998-11-02 2001-08-13 日本電気株式会社 消費電力低減回路及びこれを用いた無線通信装置並びに無線通信装置における消費電力低減方法
JP2001127652A (ja) 1999-10-22 2001-05-11 Matsushita Electric Ind Co Ltd 高周波無線装置
JP2001213008A (ja) 2000-02-03 2001-08-07 Casio Comput Co Ltd 階調印字制御装置
JP2001232843A (ja) 2000-02-23 2001-08-28 Alps Electric Co Ltd サーマルプリンタおよびその記録方法
JP2001337931A (ja) 2000-05-29 2001-12-07 Matsushita Electric Ind Co Ltd 携帯端末装置
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JP4338885B2 (ja) 2000-08-22 2009-10-07 パナソニック株式会社 無線通信機能を持つ携帯端末装置とその応答方法
JP3642029B2 (ja) 2001-02-06 2005-04-27 日本電気株式会社 携帯電話機
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US5938956A (en) * 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US6567703B1 (en) * 2000-11-08 2003-05-20 Medtronic, Inc. Implantable medical device incorporating miniaturized circuit module
CN1461057A (zh) * 2002-05-23 2003-12-10 罗姆股份有限公司 图像传感器组件及其制造方法

Also Published As

Publication number Publication date
CN101257768A (zh) 2008-09-03
US20080130253A1 (en) 2008-06-05
JP2005260291A (ja) 2005-09-22
CN101257768B (zh) 2012-02-22
US7663893B2 (en) 2010-02-16
US7304857B2 (en) 2007-12-04
US20050200002A1 (en) 2005-09-15
CN1667975A (zh) 2005-09-14
JP4049112B2 (ja) 2008-02-20

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090826

Termination date: 20130901