CN100524166C - Dynamic computer chip radiator - Google Patents
Dynamic computer chip radiator Download PDFInfo
- Publication number
- CN100524166C CN100524166C CNB2006100836451A CN200610083645A CN100524166C CN 100524166 C CN100524166 C CN 100524166C CN B2006100836451 A CNB2006100836451 A CN B2006100836451A CN 200610083645 A CN200610083645 A CN 200610083645A CN 100524166 C CN100524166 C CN 100524166C
- Authority
- CN
- China
- Prior art keywords
- heating radiator
- computer chip
- substrate
- radiator
- heater element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The inveniton discloses a mobile radiator of computer chip, which comprises the following parts: radiator base to contact heating element surface of the cooled computer chip, at least one fan to force countercurrent cooling for radiator base, micro-driving mechanism to make the surface of heating element to do reciprocal interval movement with rotation, sliding or contact/leaving corresponding to radiator base, conductive dielectric layer coated between the radiator base and heating element, wherein the radiating gill is set on the other end face of radiator base. The invention has compact structure and low energy consumption, which utilizes the heat conductivity and similar countercurrent patterns to irradiate, in order to reinforcing the heat exchange between radiator base and heating element.
Description
Technical field
The present invention relates to the computer chip heat abstractor, particularly a kind of dynamic computer chip radiator, the substrate that this dynamic computer chip radiator contacts with heating surface is in the motion shape, can strengthen its thermotransport ability.
Background technology
Current, along with the growth at full speed of computer chip integrated level, the solution of superhigh intensity heat dissipation problem is more and more got into a difficult position.The present state of the art is, computing machine generally adopts the forced convection air to cool off heater members, promptly by the expansion fin, the improvement air-flow distributes, increase blast, the cooling air force feed was loose should locate heat to spreader surface, and the cooling effectiveness of this kind mode is directly proportional with fan speed, thereby can produce obvious noise; In case and the micro element heat generation density is when too high, traditional air cooling will be difficult to be competent at.Therefore, must be improved this.
For in the performance that promotes the fin heat dissipation technology to a greater extent, the present invention provides a kind of notion of dynamic computer chip radiator first.The principle of work of this dynamic computer chip radiator is like this: heat spreader structures is consistent with traditional finned radiator, air-flow cooling radiator fin by fans drive, but the substrate that dynamic computer chip radiator comprises not is to be fixed in the euthermic chip surface as traditional approach, and the motion state that is in contact all the time on the euthermic chip surface or breaks away from, like this, substrate by this heating radiator contacts and disengaging with the dynamic of euthermic chip hot junction, the heat of chip surface can be transferred to far-end rapidly; Relend the relative motion that helps fan airstream and substrate, the heat that can continuously chip heating end be produced better transmission is rapidly walked; Afterwards, cooled heating radiator substrate is returned to and the contacted state of heating surface once again, accepts heating, so moves in circles, and the heat delivered that is about to chip heating end is to far-end.
The present invention is because the heating radiator substrate is in the motion state as the fluid, thereby provide simultaneously and flowed and two kinds of heat transfer modes of heat conduction, and because the heating radiator substrate is high-thermal conductive metal, thereby its transfer rate surmounts in any fluid type of cooling in the past; And it is not high to drive the required power consumption of heating radiator motion, and control is convenient, compact conformation, and this is the not available advantage of conventional fluid type of drive, it also becomes extremely valuable place of the present invention.
Summary of the invention
The object of the present invention is to provide a kind of dynamic computer chip radiator, be used for cooling to euthermic chip, this is a kind of active heat removal device of low-power consumption, adopt high thermal conductivity the metal conduct the heating radiator substrate and utilize the motion of heating radiator substrate to reach the purpose of heat transportation.
Technical scheme of the present invention is as follows:
Dynamic computer chip radiator provided by the invention comprises:
One with computer chip heater element 1 surperficial contacted heating radiator substrate 3 to be cooled; Have radiated rib 4 on the surface, other end of described heating radiator substrate 3; With
Described heating radiator substrate 3 is implemented at least one fan 5 of forced convertion cooling;
It is characterized in that, also comprise:
Drive the micro driving mechanism that described heating radiator substrate 3 rotated, did sliding motion with respect to the surface of heater element 1 or does the reciprocating type geneva motion that contacts/leave; And
Be coated on the heat-conducting medium layer between described heating radiator substrate 3 and the heater element 1.
One is installed on the turning axle 2 in the described heating radiator substrate 3 and drives the motor that described turning axle 2 rotates.
Described micro driving mechanism also can comprise: one is installed on turning axle 2 in the described heating radiator substrate 3 or fixture and driven in rotation axle 2 or fixture makees motor with respect to the translation motion on computer chip heater element 1 surface to be cooled.
Described micro driving mechanism also can comprise: one is installed on turning axle 2 or the fixture in the described heating radiator substrate 3, makees motor with respect to the reciprocating type geneva motion that contacts/leave on computer chip heater element 1 surface to be cooled with driven in rotation axle 2 or fixture.
Substrate and fin that described heating radiator substrate 3 and fin 4 are made for copper, aluminium, silver, graphite, carbon or their compound substance.Described fin 4 thickness be 10nm to 5cm, its rib spacing is that 10nm is to 20cm.
During use, the heat that spreads out of from chip heater element to be cooled 1 surface is absorbed by heating radiator substrate 3, heating radiator substrate 3 temperature behind the absorption heat raise rapidly and leave chip heater element to be cooled 1 surface, cool off by heat conduction and convection type afterwards, finish cooled heating radiator substrate 3 again with euthermic chip surface contact heat-exchanging.
Because the temperature conductivity height of heating radiator substrate 3, thereby the end heating that is easy to be generated heat, thereby its substrate breaks away from when generating heat end surfaces and being exposed to surrounding environment, because surface temperature is higher, its radiating effect is very remarkable, this just is equivalent to the heater element surface is expanded greatly, thereby helps the discharging of heat.
Whole process heater element 1 surface can contact (as Fig. 1 with heating radiator substrate 3 continuously, shown in Figure 2) or batch (-type) contact (as shown in Figure 3), be easy to by environment cools with the heating radiator substrate 3 after heater element 1 surface contacts, this has just overcome in traditional heating radiator need pass to the fin surface by the bottom surface by means of heat conduction, thereby outside surface and circumstance of temperature difference are less, so that be unfavorable for the drawback of dispelling the heat.In Fig. 1, heating radiator substrate 3 contacts with the euthermic chip surface continuously, and the noncontact part is cooled off with fan or other modes, between heater element 1 and heating radiator substrate 3, is added with the heat-conducting medium layer so that reduce thermal contact resistance and friction.In Fig. 2, slip heating radiator substrate 3 contacts with chip surface to be cooled, the noncontact part is cooled off with fan or other modes, between euthermic chip and heating radiator substrate 3, also there is heat-conducting medium to be used to reduce thermal contact resistance and reduces and rub, in Fig. 3, heating radiator substrate 3 is with after chip surface to be cooled contacts certain hour, by breaking away from the euthermic chip surface after the effect of driving mechanism 9, adopt modes such as convection current or jet impulse that euthermic chip surface and heating radiator substrate 3 are cooled off during the disengaging, heating radiator substrate 3 contacts with the euthermic chip surface again behind the certain hour.Heating radiator substrate 3 is driven by micro driving mechanism, can rotate, and slides or breaks away from and move.The dynamic computer chip radiator that the present invention proposes, fin can be by highly heat-conductive material or the manufacturings of its compound substance such as copper, aluminium, silver, graphite, carbon, and its fin shape or distribution mode can variations.At dynamic computer chip radiator, can implement to be forced to the air cooling to the heating radiator substrate by one or several fans, position of fan can be installed in heating radiator substrate 3 tops as required, perhaps the below, be installed in the below fan be for cooling radiator substrate faster 3.
Crucial part of the present invention is to have introduced campaign-styled heating radiator, thereby the heating radiator substrate 3 that temporarily breaks away from the euthermic chip surface can contact with the euthermic chip surface after the cooling that stands environment once again, thereby increased the temperature difference of euthermic chip surface with heating radiator substrate 3, and utilized two kinds of heat transfer types of similar convection current and heat conduction, thereby strengthened heat exchange.The present invention changes the traditional die heating radiator and euthermic chip is fixed thereby the mode of the difficult cooling in bottom, can make total heat radiation density higher.
Description of drawings
Fig. 1 a, Fig. 1 b and Fig. 1 c are the structural representation of motion attitude of the present invention (way of contact rotatablely moves) computer chip heating radiator;
Fig. 2 a, Fig. 2 b and Fig. 2 c are the structural representation of motion attitude of the present invention (the sliding motion way of contact) computer chip heating radiator;
Fig. 3 a, Fig. 3 b and Fig. 3 c are the structural representation of motion attitude of the present invention (Intermittent Contact mode of motion) computer chip heating radiator;
Embodiment
Further describe the present invention below in conjunction with the drawings and specific embodiments:
Fig. 1 a, Fig. 1 b and Fig. 1 c are the structural representation of motion attitude of the present invention (way of contact rotatablely moves) computer chip heating radiator; Fig. 2 a, Fig. 2 b and Fig. 2 c are the structural representation of motion attitude of the present invention (the sliding motion way of contact) computer chip heating radiator; Fig. 3 a, Fig. 3 b and Fig. 3 c are the structural representation of motion attitude of the present invention (Intermittent Contact mode of motion) computer chip heating radiator; As seen from the figure, dynamic computer chip radiator provided by the invention comprises:
One with computer chip heater element 1 surperficial contacted heating radiator substrate 3 to be cooled; Have radiated rib 4 on the surface, other end of described heating radiator substrate 3; With
Described heating radiator substrate 3 is implemented at least one fan 5 of forced convertion cooling;
It is characterized in that, also comprise:
Drive the micro driving mechanism that described heating radiator substrate 3 rotated, did sliding motion with respect to the surface of heater element 1 or does the reciprocating type geneva motion that contacts/leave; And
Be coated on the heat-conducting medium layer between described heating radiator substrate 3 and the heater element 1.
One is installed on the turning axle 2 in the described heating radiator substrate 3 and drives the motor that described turning axle 2 rotates.
Described micro driving mechanism also can comprise: one is installed on turning axle 2 in the described heating radiator substrate 3 or fixture and driven in rotation axle 2 or fixture makees motor with respect to the translation motion on computer chip heater element 1 surface to be cooled.
Described micro driving mechanism also can comprise: one is installed on turning axle 2 or the fixture in the described heating radiator substrate 3, makees motor with respect to the reciprocating type geneva motion that contacts/leave on computer chip heater element 1 surface to be cooled with driven in rotation axle 2 or fixture.
Substrate and fin that described heating radiator substrate 3 and fin 4 are made for copper, aluminium, silver, graphite, carbon or their compound substance.Described fin 4 thickness be 10nm to 5cm, its rib spacing is that 10nm is to 20cm.
Embodiment 1:
Fig. 1 a, Fig. 1 b and Fig. 1 c are the structural representation of motion attitude of the present invention (way of contact rotatablely moves) computer chip heating radiator; Also be one embodiment of the present of invention; By Fig. 1 a, Fig. 1 b and Fig. 1 c as can be known, the substrate 3 of this dynamic computer chip radiator is under the driving of micro driving mechanism, contact with heater element 1 surface continuously, exchange heat is carried out with heater element 1 surface gap in heating radiator substrate 3 surfaces of low temperature, thereby heater element 1 temperature is reduced; Certainly, the way of contact in the real process can have multiple, is not limited to the above.The substrate 3 of this dynamic computer chip radiator and be fixed in suprabasil fin 4 and make by highly heat-conductive material such as highly heat-conductive material such as copper, aluminium, silver, graphite, carbon or its compound substance, can entrust company's processing of special production heating radiator or voluntarily design produce.Micro driving mechanism is easy to buy from market.Between substrate 3 surface of heating radiator and heater element 1 surface, can be provided with the dielectric layer (as the heat-conducting silicone grease layer) that is used for heat conduction and reduces to rub, as an embodiment, we can select to rotate the turning axle of heating radiator, heating radiator is around this turning axle rotation, one cooling fan 5 is arranged on the fin 4 of heating radiator, be used for the cooling radiator fin, the space below heating radiator substrate 3 also can have one or 10 fans to be used for the cooling radiator substrate.Certainly, also can not adopt turning axle, this moment heating radiator in the chip surface free movement, below the heating radiator substrate and also need not use fan cooled above the fin, other the type of cooling such as water-cooled, jet impulses etc. all can be united use with mechanism provided by the invention.
Embodiment 2:
Fig. 2 a, Fig. 2 b and Fig. 2 c are the structural representation of motion attitude of the present invention (the sliding motion way of contact) computer chip heating radiator; The heat spreader structures of this moment is identical with embodiment 1, and just heating radiator substrate 3 is a sliding type with the relative motion on heater element 1 surface.Described micro driving mechanism comprises that one is installed on the axle of described heating radiator substrate, and driving shaft makes to be parallel to the straight-line motor of chip, and like this, under the driving of mechanism 9, heating radiator substrate 3 promptly with between heater element 1 surface parallel relative slip takes place.
Embodiment 3:
Fig. 3 a, Fig. 3 b and Fig. 3 c are the structural representation of motion attitude of the present invention (Intermittent Contact mode of motion) computer chip heating radiator; The heat spreader structures of this moment is identical with embodiment 1, and just the relative motion on heating radiator substrate 3 and heater element 1 surface is the gap way of contact in vertical state.Described micro driving mechanism comprises that one is installed on the axle of described heating radiator substrate, and driving shaft is done perpendicular to straight-line motor about heater element 1 surface, like this, under the driving of motor, relative up and down contact takes place with heater element 1 surface or breaks away from the to-and-fro movement of pattern in heating radiator substrate 3.
Dynamic computer chip radiator provided by the invention has lot of advantages, at first, because dynamic computer chip radiator is the same with traditional heat-dissipating device structure, therefore can makes full use of the fin technology of having optimized at present and reduce processing cost.This campaign-styled heating radiator is being installed and can carried out on existing basis.Do not have the leakage problem of liquid cooling mode, energy consumption is low.
Dynamic computer chip radiator of the present invention can be advantageously used in the heat that heater element produces is led away from its surface.With embodiment 1 is example, use the mode of dynamic computer chip radiator of the present invention as follows: according to treating the cooling surface area size, select the dynamic computer chip radiator of different sizes, chip heating surface and in addition spacing is close in its substrate, and the surface of contact between the two adopts the high thermal conductivity grease to increase heat-transfer effect and to reduce friction; Can regulate of the job requirement of the movement velocity of dynamic computer chip radiator of the present invention according to amount of heat or chip temperature level, thereby make chip maintain a normal working temperature with adaptive system and chip.So this is a kind of adjustable novel chip heating radiator.
Claims (5)
1. dynamic computer chip radiator comprises:
One with the surperficial contacted heating radiator substrate of computer chip heater element (1) (3) to be cooled; Have radiated rib (4) on the surface, other end of described heating radiator substrate (3); With
Described heating radiator substrate (3) is implemented at least one fan (5) of forced convertion cooling;
It is characterized in that, also comprise:
Drive the micro driving mechanism that described heating radiator substrate (3) is done sliding motion with respect to the surface of heater element (1) or done the reciprocating type geneva motion that contacts/leave; And
Be coated on the heat-conducting medium layer between described heating radiator substrate (3) and the heater element (1).
2, by the described dynamic computer chip radiator of claim 1, it is characterized in that, described micro driving mechanism comprises: one is installed on turning axle (2) in the described heating radiator substrate (3) or fixture and driven in rotation axle (2) or fixture makees motor with respect to the translation motion on computer chip heater element (1) surface to be cooled.
3, by the described dynamic computer chip radiator of claim 1, it is characterized in that, described micro driving mechanism comprises: one is installed on turning axle (2) or the fixture in the described heating radiator substrate (3), makees motor with respect to the reciprocating type geneva motion that contacts/leave on computer chip heater element (1) surface to be cooled with driven in rotation axle (2) or fixture.
4, by the described dynamic computer chip radiator of claim 1, it is characterized in that, fast heating radiator substrate (3) and fin (4) be substrate and the fin that copper, aluminium, silver, graphite, carbon or their compound substance are made.
5, by the described dynamic computer chip radiator of claim 1, it is characterized in that, described fin (4) thickness be 10nm to 5cm, its rib spacing is that 10nm is to 20cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100836451A CN100524166C (en) | 2006-05-31 | 2006-05-31 | Dynamic computer chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100836451A CN100524166C (en) | 2006-05-31 | 2006-05-31 | Dynamic computer chip radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101082830A CN101082830A (en) | 2007-12-05 |
| CN100524166C true CN100524166C (en) | 2009-08-05 |
Family
ID=38912423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100836451A Expired - Fee Related CN100524166C (en) | 2006-05-31 | 2006-05-31 | Dynamic computer chip radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100524166C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102778154B (en) * | 2012-07-19 | 2013-11-27 | 中国科学院长春光学精密机械与物理研究所 | Small-temperature-difference efficient heat exchange device for movable assembly of space optical remote sensor |
| CN110307478B (en) * | 2019-06-20 | 2021-04-13 | 中山市华富圣照明有限公司 | LED lighting lamp and method for accelerating heat dissipation speed |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2456212Y (en) * | 2000-11-10 | 2001-10-24 | 简川富 | Radiator for CPU |
| CN2514397Y (en) * | 2001-10-29 | 2002-10-02 | 高朝枝 | Radiator |
| CN2517015Y (en) * | 2001-11-07 | 2002-10-16 | 爱美达股份有限公司 | Cooling module device |
| CN2594987Y (en) * | 2003-01-06 | 2003-12-24 | 威盛电子股份有限公司 | Passive radiator with variable flow direction |
-
2006
- 2006-05-31 CN CNB2006100836451A patent/CN100524166C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2456212Y (en) * | 2000-11-10 | 2001-10-24 | 简川富 | Radiator for CPU |
| CN2514397Y (en) * | 2001-10-29 | 2002-10-02 | 高朝枝 | Radiator |
| CN2517015Y (en) * | 2001-11-07 | 2002-10-16 | 爱美达股份有限公司 | Cooling module device |
| CN2594987Y (en) * | 2003-01-06 | 2003-12-24 | 威盛电子股份有限公司 | Passive radiator with variable flow direction |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101082830A (en) | 2007-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206073779U (en) | A kind of micro-nano compound structure surface is heat sink | |
| CN101770267B (en) | Heat radiator of notebook computer | |
| CN107816907A (en) | A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange | |
| CN208044515U (en) | A kind of gradient type radiator | |
| CN209590827U (en) | A kind of data transmission immediate backup device of external connected electronic communication computer | |
| TW551028B (en) | Dynamic heat exchange device | |
| CN100524166C (en) | Dynamic computer chip radiator | |
| CN110146956A (en) | A kind of inside thermotransport micro-structure of optical module | |
| CN206209568U (en) | A kind of energy-conserving and environment-protective computer installation | |
| JPH06151979A (en) | Thermoelectric device | |
| CN106981464B (en) | A kind of temperature equalization system for large scale radiator | |
| CN212936472U (en) | Novel chip heat dissipation device | |
| CN2561975Y (en) | Effective radiator | |
| CN208255798U (en) | Minitype radiator based on beetle elytrum microcosmic surface | |
| JP4325026B2 (en) | Cooling device and electronic equipment | |
| CN108762443B (en) | T-shaped heat dissipation device applied to computer | |
| CN207557858U (en) | A kind of radiator | |
| CN215529672U (en) | Radiator structure and electronic thermoregulator of combination fin | |
| CN105050371A (en) | High-heat-flux electronic equipment hot spot removing device | |
| CN101453860A (en) | Thermal conduction device, thermal conduction pipe and thermal conduction method | |
| CN215582430U (en) | Graphene heat dissipation device for inverter | |
| CN214226907U (en) | Cavity radiator with direct-contact heat source | |
| CN214225866U (en) | Cavity radiator with high-efficient initiative refrigeration module | |
| CN108536256A (en) | A kind of computer radiating apparatus | |
| CN208367620U (en) | A kind of cpu heat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20210531 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |