CN106981464B - A kind of temperature equalization system for large scale radiator - Google Patents
A kind of temperature equalization system for large scale radiator Download PDFInfo
- Publication number
- CN106981464B CN106981464B CN201710206046.2A CN201710206046A CN106981464B CN 106981464 B CN106981464 B CN 106981464B CN 201710206046 A CN201710206046 A CN 201710206046A CN 106981464 B CN106981464 B CN 106981464B
- Authority
- CN
- China
- Prior art keywords
- radiator
- flow tube
- equalization system
- temperature equalization
- large scale
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 32
- 238000002844 melting Methods 0.000 claims abstract description 32
- 230000008018 melting Effects 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ROXNIEULHPKYMP-UHFFFAOYSA-N [Cu].[Bi].[In] Chemical compound [Cu].[Bi].[In] ROXNIEULHPKYMP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000002572 peristaltic effect Effects 0.000 claims description 3
- 230000002277 temperature effect Effects 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of temperature equalization system for large scale radiator provided by the invention, is arranged in the base plate bottom of radiator, including transfer tube, flow tube and low melting point liquid metal；Circulation passage is provided in flow tube, and flow tube is distributed in the base plate bottom plane of radiator；Low melting point liquid metal is arranged in the circulation passage of flow tube；Transfer tube is connect with flow tube, and low melting point liquid metal can be driven to flow in the circulation passage of flow tube.Temperature equalization system provided by the invention has the advantage that by using low melting point liquid metal that as flow working medium, this temperature equalization system is suitable for the samming demand of large-sized cold plate or cooling fin, and even temperature effect is significant and stablizes.
Description
Technical field
The present invention relates to element radiating fields, and in particular to a kind of temperature equalization system for large scale radiator.
Background technique
The heat power consumption of IGBT module and large LED panel module has been up to Shang kilowatt in current industrial control product, to be effectively reduced
IGBT module or LED base temperature, are radiated or are conducted heat frequently with large-scale cooling fin or cold plate, cooling fin or cold plate
For size (length or width) often in 800mm or more, substrate or cold plate surface temperature distribution are extremely uneven.According to heat transfer
Basic principle, in the case of identical heat-transfer path, thermal resistance is smaller, and it is lower to transmit the identical heat temperature difference.Promote substrate or cold plate table
Face temperature uniformity reduces the thermal resistance in heat transfer process, can effectively reduce the temperature of heating device.
Currently, the mode of heat spreader substrate or cold plate frequently with heat pipe or VC temperature-uniforming plate as samming.Heat pipe and VC samming
Plate has the limitation of following two aspects for large scale cooling fin or cold plate samming:
1) capillary heat transfer limitation, when thermic load reaches a certain level, the fluid low that capillary force effect is drawn back is steamed with meeting
When amount needed for hair, cause evaporator section dry.At this point, evaporator section tube wall temperature can be gradually increasing, even burnt out when serious
The phenomenon that heat pipe or VC temperature-uniforming plate.
2) size limits, no matter heat pipe or VC temperature-uniforming plate, in the internal working medium course of work, by fluid viscosity and movement
The influence of inertia exists along journey and local resistance loss, and heat pipe or VC samming board size are bigger, and linear loss is higher, heat transfer effect
It can be poorer.General heat pipe length is more than 300mm, and heat-transfer effect decline is obvious；The heat transfer principle of VC temperature-uniforming plate and heat pipe phase
Together, there is also similar problems, while the manufacturing cost of VC temperature-uniforming plate is higher.
Therefore, it is necessary to a kind of temperature equalization systems for large scale radiator, have under large scale, high heat load environment
Even temperature effect is good, and even temperature effect is stablized, while the characteristics of good economy performance.
Summary of the invention
For above-mentioned the problems of the prior art, the purpose of the present invention is to provide a kind of for large scale radiator
Temperature equalization system.
To achieve the goals above, The technical solution adopted by the invention is as follows:
A kind of temperature equalization system for large scale radiator, is arranged in the base plate bottom of radiator, temperature equalization system
Including transfer tube, flow tube and low melting point liquid metal；Circulation passage is provided in flow tube, and flow tube is in the substrate of radiator
Distribution in bottom plane；Low melting point liquid metal is arranged in the circulation passage of flow tube；Transfer tube is connected or is contacted with flow tube, and
Low melting point liquid metal can be driven to flow in the circulation passage of flow tube.
Further, flow tube is uniformly distributed in the base plate bottom plane of radiator.
Further, flow tube is flat tube or round tube.
Further, temperature equalization system is embedded in the base plate bottom of radiator.
Further, the size of radiator is much larger than the size of heat source.
Further, low melting point liquid metal is gallium, gallium-indium alloy, gallium-indium-tin alloy, indium bismuth copper alloy.
Further, the circulation passage in flow tube is the circulation passage in circulation closed or flow tube and the transfer tube
Interior runner forms circulation closed runner.
Further, the material of flow tube is the metal material of thermal conductivity height and stable chemical performance.
Further, the material of flow tube is red copper.
Further, transfer tube is electromagnetic pump or peristaltic pump.
The present invention can obtain following advantageous effects by above technical scheme:
(1) by using low melting point liquid metal as flow working medium, this temperature equalization system be suitable for large-sized cold plate or
The samming demand of cooling fin, and even temperature effect is significant and stablizes；
(2) red copper is used by flow tube, that is, facilitates welding that can improve the heat exchange between flow tube and cold plate or heat spreader substrate again
Performance；
(3) good economy performance, it is easy to process.
Certainly, implementing any of the products of the present invention must be not necessarily required to reach all the above technical effect simultaneously.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the top view described in the embodiment of the present invention for the temperature equalization system of large scale radiator；
Fig. 2 is the side view described in the embodiment of the present invention for the temperature equalization system of large scale radiator.
In figure: 1. transfer tubes；2. flow tube；3. low melting point liquid metal；4. heat source；5. radiator.
Specific embodiment
As used some vocabulary to censure specific components in the specification and claims.Those skilled in the art answer
It is understood that hardware manufacturer may call the same component with different nouns.This specification and claims are not with name
The difference of title is as the mode for distinguishing component, but with the difference of component functionally as the criterion of differentiation.Such as logical
The " comprising " of piece specification and claim mentioned in is an open language, therefore should be construed to " including but do not limit
In ".Specification subsequent descriptions are to implement better embodiment of the invention, and so the description is to illustrate general original of the invention
For the purpose of then, the range that is not intended to limit the invention.Protection scope of the present invention when regard appended claims institute's defender as
It is quasi-.
Embodiment 1
As shown in Figs. 1-2, a kind of temperature equalization system for large scale radiator provided in this embodiment, the temperature equalization system
The base plate bottom of radiator 5 is set, which includes transfer tube 1, flow tube 2 and low melting point liquid metal 3；Flow tube 2
It is inside provided with circulation passage, and flow tube 2 is distributed in the base plate bottom plane of radiator 5；Low melting point liquid metal 3 is arranged
In the circulation passage of flow tube 2；Transfer tube 1 is connected or is contacted with flow tube 2, and low melting point liquid metal 3 can be driven in flow tube 2
Flowing in circulation passage.Wherein, flow tube 2 is flat tube, is also possible to round tube or other are suitble to shape, and in the base of radiator
Distribution form in board bottom facial planes is to be uniformly distributed；Temperature equalization system is the base plate bottom for being embedded in radiator 5, and is dissipated
The size of thermal 5 is larger relative to the size of heat source；Circulation passage in flow tube 2 is in circulation closed or flow tube 2
Runner in circulation passage and transfer tube 1 forms circulation closed runner.
Specifically, the material of flow tube 2 is the metal material of thermal conductivity height and stable chemical performance, it is therefore preferable to red copper, this
In stable chemical performance stable chemical performance when referring in particular to contact with low melting point liquid metal 3；The side that flow tube 2 passes through welding
Formula is embedded in the base plate bottom of radiator 5；Transfer tube 1 is electromagnetic pump or peristaltic pump and other applicable pumps or driving dress
It sets, when temperature equalization system is applied on the lesser radiator 5 of size, pony pump or micropump is can be used in transfer tube 1；Low melting point
Liquid metal 3 is the binary or ternaries alloys such as gallium, gallium-indium alloy, gallium-indium-tin alloy or indium bismuth copper alloy.Radiator 5 can be
Cold plate or cooling fin and other devices for being used to radiate.The large scale of radiator 5 can refer to based on normal domestic use
The size of the radiator of calculation machine processor is much bigger, such as area is the 10 of the area of computer processor radiator
Again, 20 times or bigger, it can also be that the size relative to heat source is larger or is much larger than, such as a high temperature heat point source, have
Large-sized radiator 5 of temperature equalization system carries out samming, heat dissipation to the high temperature heat point source.
Specifically, flow tube 2 has the part for being distributed as uniform continuous U-shaped, is bent connection, transfer tube 1 between U-shaped part
Positioned at the continuous U-shaped of flow tube 2 side and connected with flow tube 2.
Temperature equalization system drives the flowing of low melting point liquid metal 3 in flow tube 2 to constitute the samming circulatory system by transfer tube 1,
Using the efficient Convective Heat Transfer of liquid metal, by the radiator 5 of the heat transfer at local high spot to such as metallic cold plate
Surface, realize the samming of large-sized radiator 5.Since low melting point liquid metal 3 is good thermally conductive and mobile performance, and
And not received heat delivery threshold and the size limitation of the samming circulatory system average temperature performance of its composition, so that as large scale cooling fin is cold
The even temperature effect of the radiator 5 of plate or cold plate is significant.
The thermal coefficient (20-60W/mK) of low melting point liquid metal 3 is about 40 times of water thermal coefficient (0.6W/mK), phase
With under flow velocity, compared with water, high about 1 order of magnitude of convection transfer rate reaches 30000- to low melting point liquid metal 3
50000W/m2K, convective heat transfer resistance are even less than heat pipe and VC temperature-uniforming plate.Under conditions of flow control is appropriate, low melting point liquid
The temperature rise very little of metal 3 is a kind of good samming working medium, can effectively avoid the performance limitation of heat pipe or VC temperature-uniforming plate.This is
The flow tube 2 of warm device is more uniform in the distribution of the surface of radiator 5, and even temperature effect is better.The temperature of radiator 5 only with eutectic
The flow of point liquid metal 3 is related, and flow is bigger, and the temperature of radiator 5 is lower.When the elements/devices hot merit as heat source
When consuming higher, pipe-line layout can be optimized or change the number of coils and electrical current of the transfer tube 1 such as electromagnetic pump, to realize samming
With the purpose of cooling.Flow of the low melting point liquid metal 3 in the circulatory system can be adjusted by transfer tube 1, avoid temperature equalization system
The circulatory system there is working medium boiling phenomenon, thus effectively prevent heat transfer the limit limitation.Low melting point liquid metal 3 is right
The transmitting for flowing heat in heat transfer process is only related to flow velocity and circulating channel structure form, and unrelated with the length of flow tube 2.Flow tube
2 length only influences the flowing pressure loss of system, and flow tube 2 is longer, and the pressure loss in flow process is higher.Low melting point liquid
In 3 cyclic process of metal, power resources are provided by transfer tube 1, transfer tube 1 for example can be electromagnetic pump, on the one hand, can pass through increasing
It is powered on magnetic pumping number of coils or improves the mode of electrical current, enhance electromagnetic pump driving capability.On the other hand, by the pressure loss with
Known to the relationship of flow velocity (pressure loss is directly proportional to the quadratic power of flow velocity), pass through circulation passage sectional dimension in optimization flow tube 2
Mode, can also realize reduce system pressure loss purpose.Using the samming dress of the circulatory system of low melting point liquid metal 3
It sets, is not limited by the size of radiator 5.
A kind of temperature equalization system for large scale radiator provided in this embodiment is suitable for larger-size samming ring
Fan-free electronic product, such as fan-free notebook computer product can also be applied in border.
The operational process of temperature equalization system provided in this embodiment is as follows:
The substrate of radiator 5 contacted with heat source is embedded with the temperature equalization system, and the flow tube 2 of the temperature equalization system is uniformly distributed
In the base plan of radiator 5, there is low melting point liquid metal 3 in flow tube 2, transfer tube 1 is connect with flow tube 2, and can be driven
Low melting point liquid metal 3 flows in flow tube 2, and the flowing realization of low melting point liquid metal 3 is distributed to the even heat of heat source
Radiator 5 realizes samming.
A kind of temperature equalization system for large scale radiator provided in this embodiment, has the advantage that
(1) by using low melting point liquid metal as flow working medium, this temperature equalization system be suitable for large-sized cold plate or
The samming demand of cooling fin, and even temperature effect is significant and stablizes；
(2) red copper is used by flow tube, that is, facilitates welding that can improve the heat exchange between flow tube and cold plate or heat spreader substrate again
Performance；
(3) good economy performance, it is easy to process.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
It include so that the process, method, commodity or the equipment that include a series of elements not only include those elements, but also to wrap
Include other elements that are not explicitly listed, or further include for this process, method, commodity or equipment intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including described want
There is also other identical elements in the process, method of element, commodity or equipment.
The foregoing is merely several embodiments of the invention, are not intended to restrict the invention.For art technology
For personnel, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention,
Equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. a kind of temperature equalization system for large scale radiator, which is characterized in that the base in the radiator (5) is arranged in it
Board bottom portion, the temperature equalization system include transfer tube (1), flow tube (2) and low melting point liquid metal (3)；
Circulation passage is provided in flow tube (2), and flow tube (2) is flat in the base plate bottom of the radiator (5)
It is distributed in face；
The low melting point liquid metal (3) is arranged in the circulation passage of flow tube (2)；
The transfer tube (1) connects or contacts with flow tube (2), and the low melting point liquid metal (3) can be driven described
Flowing in the circulation passage of flow tube (2)；
The cooling fin of the large scale radiator or the length or width of cold plate are greater than 800mm；
Flow tube (2) is embedded in the base plate bottom of radiator (5) by welding.
2. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
Flow tube (2) is uniformly distributed in the base plate bottom plane of the radiator (5).
3. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
Flow tube (2) is flat tube or round tube.
4. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
The temperature equalization system is embedded in the base plate bottom of the radiator (5).
5. the temperature equalization system according to claim 1 or 2 for large scale radiator, which is characterized in that
The area of the radiator (5) is ten times or more of the area of computer processor radiator.
6. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
The low melting point liquid metal (3) is gallium, gallium-indium alloy, gallium-indium-tin alloy, indium bismuth copper alloy.
7. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
Circulation passage in flow tube (2) is circulation passage and the transfer tube in circulation closed or flow tube (2)
(1) runner in forms circulation closed runner.
8. the temperature equalization system according to claim 1-3 for large scale radiator, which is characterized in that
The material of flow tube (2) is the metal material of thermal conductivity height and stable chemical performance.
9. the temperature equalization system according to claim 8 for large scale radiator, which is characterized in that
The material of flow tube (2) is red copper.
10. the temperature equalization system according to claim 1 for large scale radiator, which is characterized in that
The transfer tube (1) is electromagnetic pump or peristaltic pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710206046.2A CN106981464B8 (en) | 2017-03-31 | 2017-03-31 | Temperature equalizing device for large-size heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710206046.2A CN106981464B8 (en) | 2017-03-31 | 2017-03-31 | Temperature equalizing device for large-size heat dissipation device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| CN106981464A CN106981464A (en) | 2017-07-25 |
| CN106981464B true CN106981464B (en) | 2019-11-19 |
| CN106981464B8 CN106981464B8 (en) | 2020-03-27 |
Family
ID=59338385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710206046.2A Active CN106981464B8 (en) | 2017-03-31 | 2017-03-31 | Temperature equalizing device for large-size heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106981464B8 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109375662A (en) * | 2018-10-31 | 2019-02-22 | 中国运载火箭技术研究院 | A kind of certainly maintenance Active thermal control system of the spacecraft based on liquid metal |
| CN113438868A (en) * | 2021-06-29 | 2021-09-24 | 云南靖创液态金属热控技术研发有限公司 | Ultrathin heat dissipation device and heat dissipation method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201463677U (en) * | 2009-06-08 | 2010-05-12 | 刘真 | Novel heat pipe heat radiator |
| CN202285109U (en) * | 2011-03-15 | 2012-06-27 | 范宏伟 | Heat pipe radiator for local area network server |
| CN104930890A (en) * | 2014-03-19 | 2015-09-23 | 海尔集团公司 | Heat exchanger and semi-conductor wine cabinet |
| CN106439756A (en) * | 2016-10-26 | 2017-02-22 | 广东合新材料研究院有限公司 | S-shaped loop heat pipe radiator for LED |
| CN206042666U (en) * | 2016-09-27 | 2017-03-22 | 北京态金科技有限公司 | Integral liquid metal heat transfer plate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2575847Y (en) * | 2002-10-10 | 2003-09-24 | 中国科学院理化技术研究所 | Heat radiator for chip heat dissipation |
| CN2736933Y (en) * | 2004-07-02 | 2005-10-26 | 中国科学院理化技术研究所 | Liquid metal chip radiator driven by thermoelectric-electromagnetic pump |
-
2017
- 2017-03-31 CN CN201710206046.2A patent/CN106981464B8/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201463677U (en) * | 2009-06-08 | 2010-05-12 | 刘真 | Novel heat pipe heat radiator |
| CN202285109U (en) * | 2011-03-15 | 2012-06-27 | 范宏伟 | Heat pipe radiator for local area network server |
| CN104930890A (en) * | 2014-03-19 | 2015-09-23 | 海尔集团公司 | Heat exchanger and semi-conductor wine cabinet |
| CN206042666U (en) * | 2016-09-27 | 2017-03-22 | 北京态金科技有限公司 | Integral liquid metal heat transfer plate |
| CN106439756A (en) * | 2016-10-26 | 2017-02-22 | 广东合新材料研究院有限公司 | S-shaped loop heat pipe radiator for LED |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106981464A (en) | 2017-07-25 |
| CN106981464B8 (en) | 2020-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8713957B2 (en) | Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s) | |
| CN102819303A (en) | Computer case | |
| CN108807313B (en) | Microelectronic device heat dissipation device | |
| CN105914189A (en) | Micro-fluidic chip heat abstractor | |
| CN106981464B (en) | A kind of temperature equalization system for large scale radiator | |
| CN105511577A (en) | High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling | |
| CN104882424A (en) | Liquid cooling radiator and corresponding IGBT module | |
| US20210195794A1 (en) | Novel mechanical pump liquid-cooling heat dissipation system | |
| Wang et al. | Experimental and numerical analysis on a compact liquid metal blade heat dissipator with twin stage electromagnetic pumps | |
| CN109287100B (en) | Liquid metal heat abstractor and electronic equipment | |
| CN107204562A (en) | A kind of high power laser heat abstractor | |
| CN205793895U (en) | Heat radiation assembly | |
| CN211063981U (en) | Intellectual property big data server rack | |
| US6971243B2 (en) | Heat sink | |
| CN219612082U (en) | Novel water-cooled LED driving power supply | |
| CN109462968A (en) | A kind of radiator of multi-surface heat-producing device | |
| CN209768050U (en) | liquid metal heat abstractor and electronic equipment | |
| US11197396B2 (en) | Cooling system with curvilinear air to liquid heat exchanger | |
| CN114901056A (en) | Heat dissipation device and electronic equipment | |
| CN209462872U (en) | A kind of radiator of multi-surface heat-producing device | |
| TWI648941B (en) | Water cooling radiator | |
| CN219068715U (en) | Device for cooling large heat flux device by using magnetic field | |
| CN100524166C (en) | Moving state computer chip radiator | |
| CN208008875U (en) | A kind of low-temperature vacuum coating device | |
| CN203288578U (en) | Dissipation sheet module with microgroove flat heat tubes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Huang Gang Inventor after: Sun Yongsheng Inventor after: Gong Zhenxing Inventor after: Feng Guirong Inventor after: Guo Linzhao Inventor before: Sun Yongsheng Inventor before: Gong Zhenxing Inventor before: Feng Guirong Inventor before: Guo Linzhao |
|
| CI03 | Correction of invention patent | ||
| CI03 | Correction of invention patent |
Correction item: Inventor Correct: Huang Gang|Sun Yongsheng|Gong Zhenxing|Feng Guirong|Guo Linzhao False: Sun Yongsheng|Gong Zhenxing|Feng Guirong|Guo Linzhao Number: 47-01 Page: The title page Volume: 35 Correction item: Inventor Correct: Huang Gang|Sun Yongsheng|Gong Zhenxing|Feng Guirong|Guo Linzhao False: Sun Yongsheng|Gong Zhenxing|Feng Guirong|Guo Linzhao Number: 47-01 Volume: 35 |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 250104, No. 2877, fairway, Sun Town, Ji'nan hi tech Zone, Shandong Patentee after: SHANDONG CHAOYUE DATA CONTROL ELECTRONICS Co.,Ltd. Address before: 250104, No. 2877, fairway, Sun Town, Ji'nan hi tech Zone, Shandong Patentee before: SHANDONG CHAOYUE NUMERICAL CONTROL ELECTRONIC Co.,Ltd. |