CN2594987Y - Passive radiator with variable flow direction - Google Patents
Passive radiator with variable flow direction Download PDFInfo
- Publication number
- CN2594987Y CN2594987Y CN 03202205 CN03202205U CN2594987Y CN 2594987 Y CN2594987 Y CN 2594987Y CN 03202205 CN03202205 CN 03202205 CN 03202205 U CN03202205 U CN 03202205U CN 2594987 Y CN2594987 Y CN 2594987Y
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- CN
- China
- Prior art keywords
- heat radiation
- variable flow
- radiation device
- passive heat
- rotating member
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a passive radiator with variable flow directions, and is suitable for being arranged on an electronic element and is used for dissipating the heat energy produced by the electronic element. The passive radiator with variable flow directions is provided with one rotary component and one heat dissipation component, wherein the rotary component is arranged on the electronic element. The heat dissipation component is connected with the rotary component, wherein the heat energy produced by the electronic element is conducted to the heat dissipation component through the rotary component first. Then, the heat energy is dissipated to the outside through the surface of the heat dissipation component. In addition, because the rotary component can be adapted to the flow direction of strong air currents provided by a system, and correspondingly rotates in a rotary-shaft direction, the forward direction of a channel of the heat dissipation component can be parallel to the flow direction of the strong air currents provided the system. Therefore, the radiator is easy to reach the optimal heat dissipation effect.
Description
Technical field
The utility model relates to a kind of passive heat radiation device, particularly a kind of variable flow to the passive heat radiation device.
Background technology
Integrated level along with the internal wiring of integrated circuit (IC) chip improves significantly in recent years, make the sectional area of wire of IC chip internal circuit constantly reduce, cause the interior resistance of IC chip internal circuit relatively to improve, the number of the electric crystal of IC chip internal significantly increases simultaneously.Therefore, when IC chip during at working at high speed, the interior resistance and the electric crystal of its internal circuit produce heat energy with correspondence, so will cause temperature of IC chip itself to raise gradually.It should be noted that when in a single day the temperature of IC chip itself exceeds its normal operating temperature range the internal circuit of IC chip may will the phenomenon of operation mistake take place, or temporarily loses efficacy.Therefore, in the electronic component that the IC Chip Packaging is formed, the central processing unit of personal computer for example, north bridge chips and drawing chip etc., the heat energy that is produced when the working at high speed for the IC chip that can remove electronic component rapidly, make that the IC chip of electronic component still can the long term maintenance normal operation when working at high speed, known technology is to utilize radiator directly to contact the surface of electronic component, so that bigger area of dissipation to be provided, and the cooling blast that radiator fan provided of coupled system inside, make radiator can promptly absorb the heat energy that electronic component is produced when working at high speed, and will be dissipated to extraneous atmospheric environment apace from the heat energy of electronic component IC chip.
With reference to Figure 1A, it represents the side schematic view of known heat sink applications in an electronic component.Known electronic component 10 can adopt a passive heat radiation member 100, and can be via elastic fastener 30, with the periphery of radiating component 100 directly and be fastened on the circuit board 20 at electronic component 10 places, make the bottom of radiating component 100 can contact the surface of electronic component 10 constantly simultaneously.In addition, radiating component 100 mainly is made of a radiating bottom plate 110 and a plurality of radiating fin 112, and wherein radiating fin 112 sequence arrangement are at the end face of radiating bottom plate 110, and constitutes multiple support channels 114 between two adjacent radiating fins 112.Therefore, the bottom surface of radiating bottom plate 110 can corresponding contact electronic component 10 the surface, in order to promptly to absorb the heat energy that electronic component 10 is produced when operating, and with the root edge of thermal energy conduction to each radiating fin 112, conduct to the surface of radiating fin again, so the cooling blast that the radiator fan (not shown) of internal system is provided can pass through these channels 114, and take away the heat energy on the surface of radiating fin 112 apace, so can reach the purpose of cooling electronic components 10 via the radiating effect of radiating component 100.In addition, also can on this passive heat radiation member 100, optionally set a radiator fan (not shown), in order to increase the heat dissipation of passive heat radiation member 100, wherein be equipped with the passive heat radiation member 100 of radiator fan to can be considered one active (active) heat abstractor.
With reference to Figure 1B, it shows the schematic top plan view of known radiating component.It should be noted that, design alteration when internal system, change in size such as plug-in card, or increase after other add-on modules, thereby change internal system surging air-flow flow to F1 the time, the surging air-flow of internal system flow to direction (advancing channeldirection) C1 that channel that F1 no longer is parallel to radiating component 100 advances, yet, known passive heat radiation member 100 but can not freely adapt to the F1 that flows to of surging air-flow, change the direction C1 that its channel advances, make to descend, thereby cause radiating component 100 not provide its best radiating effect to electronic component through the air-flow velocity between these radiating fins 112.
Novel content
Given this, the purpose of this utility model be to propose a kind of variable flow to the passive heat radiation device, it is fit to be provided on the electronic component, the flow direction of the surging air-flow that radiator fan provided of its adaptive system inside, and always adjust the direction of the channel that advances of radiating component along a rotating shaft, in order to the air-flow velocity between the radiating fin of relative raising radiating component, so can easily reach the heat dissipation of the best of this heat abstractor.
For reaching above-mentioned purpose of the present utility model, the utility model proposes a kind of variable flow to the passive heat radiation device, it is suitable for being provided on the electronic component, the heat energy that is produced in order to the runaway electron element.This variable flow to the passive heat radiation device comprise a rotating member and a radiating component at least, wherein rotating member is provided on the electronic component, and one second rotation end with one first rotation end and correspondence, rotating member contacts on the surface of electronic component via the first rotation end, and rotating member can relatively rotate the relative position of adjusting between the first rotation end and the second rotation end along an axial rotary.In addition, radiating component is connected the second rotation end, and after wherein the heat energy that electronic component produced conducted to radiating component via rotating member, the surface by radiating component was dissipated in the extraneous atmospheric environment again.
According to preferred embodiment of the present utility model, above-mentioned rotating member also comprises a pedestal, a disk, a cylinder and a fastener.Wherein, pedestal is provided on the electronic component, and pedestal has a manhole.In addition, the corresponding chimeric manhole of disk to pedestal, and as the surface of the first rotation end contact electronic component of rotating member, and can be along doing rotation relatively between axial rotary and the pedestal.In addition, cylinder has one first one second terminal and corresponding end, and wherein first end of cylinder is connected to disk, and second end of cylinder is as the second rotation end of rotating member, and cylinder is connected on the radiating component via second end.Have, fastener is provided on the pedestal again, but and elasticity push disk.
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Figure 1A and 1B represent to be applied to the side and the schematic top plan view of the known radiator of an electronic component;
A kind of variable flow that Fig. 2 represents preferred embodiment of the present utility model to the passive heat radiation device, it is applied to the side schematic view of an electronic component;
A kind of variable flow that Fig. 3 A～3C represents preferred embodiment of the present utility model to the passive heat radiation device, its radiating component is adjusted to the front and back schematic top plan view of best angle via rotating member;
Fig. 4 represents the three-dimensional exploded view of a kind of rotating member of the present utility model and utilizes the partial enlarged drawing of stepping rotating member; And
Fig. 5 represents the section of structure of another kind of rotating member of the present utility model.
Embodiment
With reference to Fig. 2, its expression according to a kind of variable flow of preferred embodiment of the present utility model to the passive heat radiation device, it is applied to the side schematic view of an electronic component.Variable flow to passive heat radiation device 200 comprise a rotating member 210 and a radiating component 200 at least, its material for example is copper, aluminium, its alloy and its combination.At first, rotating member 210 is provided on the electronic component 10, and can directly be fastened on the circuit board that is connected 20 of electronic component 10 via the periphery of elastic fastener 30 with rotating member 210.In addition, rotating member 210 has one first rotation end 212 and one second corresponding rotation end 214, rotating member 210 can directly contact the surface of electronic component 10 via the first rotation end 212, and can absorb the heat energy that electronic component 10 is produced apace, rotating member 210 can be connected to radiating component 200 via the second rotation end 214, and the thermal energy conduction that electronic component 10 is produced via the second rotation end 214 is to radiating component 220.In addition, the cooling blast that the radiator fan (not illustrating) of rotating member 210 adaptive system inside is provided, and roughly do rotation relatively along an axial rotary A, in order to pivotably to adjust the position of radiating component 220.
Simultaneously with reference to Fig. 2, radiating component 220 mainly is to be made of a radiating bottom plate 222 and a plurality of radiating fin 224, wherein radiating fin 224 is arranged in parallel within the end face of radiating bottom plate 222 haply, any two adjacent radiating fin 224 and the then common formation multiple support channels 226 of radiating bottom plate 222, the cooling blast that makes extraneous (or system) be provided can flow in these channels 226, and takes away heat energy by the dissipation of radiating fin 224 surperficial institutes via cooling blast.Yet, can be parallel to for the direction of advance C2 of the channel that makes radiating component 220 internal system surging air-flow flow to F2, can rotate the position of adjusting radiating component 220 via rotating member 210, so can easily reach the best radiating effect of heat abstractor 200, and it is provided to electronic component 10.
With reference to figure 3A～3C, its a kind of variable flow of representing preferred embodiment of the present utility model in proper order to the passive heat radiation device, radiating component is adjusted to the front and back schematic top plan view of best angle via rotating member.At first as shown in Figure 3A, be parallel to haply as the direction of advance C2 of the channel of radiating component 220 external world's (or internal system) surging air-flow flow to F2, make when air-flow velocity in channel 226 reaches maximum (with respect to the identical situation of the flow velocity of surging air-flow), so will obtain the best radiating effect of this heat abstractor 200.Then shown in Fig. 3 B, design alteration when internal system, change in size such as plug-in card, or increase other add-on modules, or increase cooling fan extraly in other positions, thereby change internal system surging air-flow flow to F2 the time, the flowing to F1 and will no longer be parallel to the direction of advance C2 of channel of the surging air-flow of internal system, so will significantly reduce the air-flow velocity in the channel 226, thereby can not obtain the heat dissipation of the best of heat abstractor 200.Therefore, shown in Fig. 3 C, can adjust the channel direction of advance C2 of radiating component 220 by rotation, make the F2 that flows to of its surging air-flow that is parallel to external world's (or internal system), make the air-flow velocity in channel 226 reach maximum (the same situation identical) again, so will obtain the radiating effect of the best of this heat abstractor 200 once more with respect to the flow velocity of surging air-flow.In addition, the flowing to F and can learn that this wind direction indicator 230 is the fine rule or the scraps of paper etc. for example of the surging air-flow of internal system by a wind direction indicator 230, it is configurable on radiating component 220, or is disposed at the close position of radiating component 220.Therefore, in case when the cooling blast of internal system changes to some extent, can judge the F2 that flows to of surging air-flow around the radiating component 220 by wind direction indicator 230, and corresponding rotation is adjusted the channel direction of advance C2 of radiating component 220.
In order to make those skilled in the art can more understand technology contents of the present utility model, hereinafter will further describe the correlation technique of rotating member, but this and unrestricted variable flow of the present utility model to the passive heat radiation device only can use the rotating member of this type, and can adopt the rotating member of other types, just this rotating member must have good heat-conducting effect simultaneously.
Fig. 4 represents the three-dimensional exploded view of rotating member, simultaneously with reference to figure 2 and Fig. 4, rotating member 300 mainly is made of a pedestal 310, a disk 320, a cylinder 330 and a fastener 340, wherein pedestal 310 is configured on the electronic component 10, and has a manhole 312, disk 320 can corresponding be fitted in the manhole 312 of pedestal 310, and contacting the surface of electronic component 10 as the first rotation end 212 shown in Figure 2, disk 320 can be along the relative rotation of do between an axial rotary A and the pedestal 310.In addition, cylinder 330 has first end 332 and the second corresponding end 334, wherein first end 332 of cylinder 330 is connected to disk 320, and second end 334 of cylinder 330 is as second rotary shaft 214, and cylinder 330 is connected to radiating component 220 via second end 334.In addition, fastener 340 is configured on the pedestal 310, and can flexibly push disk 320, breaks away to prevent disk 320.Have, for good heat-conducting effect is provided, the disk 320 of rotating member 300 and cylinder 330 can be one-body molded with radiating component 220 again, and its material for example is copper, aluminium, its alloy and its combination etc.
Equally with reference to figure 4, the into partial structurtes enlarged drawing of formula rotating member is shown in its expression utilization, wherein rotating member 300 can be a stepping rotating member, finishes this stepping rotating member by adding one ratchet mechanism 350 or other mechanisms on rotating member 300.Ratchet mechanism 350 mainly is made of a ratchet structure 350a and a pawl structures 350b.Wherein ratchet structure 350a can be formed on the periphery of disk 320, and pawl structures 350b then can be provided in the sidewall of the manhole 312 of pedestal 310, between adjacent two ratchets that flexibly are resisted against ratchet structure 350a.Therefore, can be by the engagement between ratchet structure 350a and the pawl structures 350b, along the relative position of axial rotary A fixed disc 320 with pedestal 310.In addition, when along axial rotary A rotating circular disk 320, pawl structures 350b is subjected to the pushing and pressing of ratchet structure 350a and outwards moves, at disk 320 after axial rotary A rotates certain angle, pawl structures 350b will be resisted against between the ratchet structure 350a once again, so can be along axial rotary A and stepping is adjusted the relative position between disk 320 and the pedestal 310.In addition, because the relative position between ratchet structure 350a and the pawl structures 350b is double replacement mutually also, make and have a pawl structures 350b on the sidewall of disk 320, then have a ratchet structure 350a on the circumference of the circular perforation 312 of pedestal 310, can reach the effect that disk 320 and pawl structures 350b are adjusted in the stepping rotation equally.
With reference to figure 5, it represents the section of structure of the another kind of rotating member of preferred embodiment of the present utility model.Compare with rotating member 300a shown in Figure 4, rotating member 300a is the surface that contacts electronic component 30 with pedestal 310a as the first rotation end 212, and pedestal 310a has a circular groove 312a, it is depressed in the upper surface of pedestal 310a, in order to replace the manhole 312 of Fig. 4, and the corresponding chimeric circular groove 312a of disk 320 to pedestal 310a, disk 320 also can be along axial rotary A and with pedestal 310a between do relative rotation.With regard to rotating member 300a, the material of pedestal 310a herein also must have good thermal conduction characteristic, and the part pedestal 310a between electronic component 10 and disk 320 must have good thermal conduction characteristic at least.
Based on above-mentioned, the utility model proposes a kind of variable flow to the passive heat radiation device, be suitable for being provided on the electronic component heat energy that is produced in order to the runaway electron element.This variable flow to the passive heat radiation device have a rotating member and a radiating component, after wherein the heat energy that electronic component produced conducts to radiating component via rotating member, again via the surperficial dissipation of radiating component.In addition, the flow direction of the surging air-flow that rotating member adaptive system inside is provided and do relative rotation, and make the channel direction of advance of radiating component can be parallel to the flow direction of surging air-flow, thereby reach the heat dissipation of the best of this heat abstractor easily, and it is provided to electronic component.
In sum, the utility model variable flow to the passive heat radiation device have following advantage at least:
1. variable flow of the present utility model to the flow direction of surging air-flow of passive heat radiation device adaptive system inside, and adjust the direction of advance of the channel of radiating component rotatably, design alteration when internal system, such as the plug-in card change in size or after increasing other add-on modules, thereby when changing the flowing to of surging air-flow of internal system, the position of radiating component that can be by adjusting this heat abstractor rotatably, make the direction of advance of channel of radiating component can be parallel to the flow direction of the surging air-flow of internal system, so can easily reach the best heat dissipation of this heat abstractor.
2. variable flow of the present utility model to can flexibly the arrange in pairs or groups design of various systems wind regime of passive heat radiation device, with the flow direction of the surging air-flow of adaptive system inside, so that provide the control of system of optimizing temperature to electronic component and adjacent domain thereof.
3. variable flow of the present utility model to the passive heat radiation device, its radiating component needn't redesign, and can adapt to the flow direction of the air-flow of various systems, thereby saves unnecessary die sinking and make the cost of new radiating component, and then makes cost fix.
Though the utility model discloses with a preferred embodiment; but it is not in order to limit the utility model; any those skilled in the art is not breaking away under essence of the present utility model and the range of condition; all can make various changes and remodeling, therefore protection range of the present utility model is when being defined with accompanying claims.
Claims (16)
- A variable flow to the passive heat radiation device, be suitable for being provided on the electronic component, the heat energy that is produced in order to the runaway electron element, described variable flow to the feature of passive heat radiation device be, it comprises at least: a rotating member, it is provided on the electronic component, and one second rotation end with one first rotation end and correspondence, described rotating member is via the surface of the first rotation end contact at electronic component, and rotating member is along an axial rotary, and the relative position between the first rotation end and the second rotation end is adjusted in rotation relatively; And a radiating component, it is connected the second rotation end.
- 2. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that described rotating member comprises at least: a pedestal, it is provided on the electronic component, and described pedestal has a manhole; One disk, corresponding chimeric manhole, and as the surface of the first rotation end contact electronic component to pedestal, and can be along axial rotary and with pedestal between do relative rotation; One cylinder, it has one first one second terminal and corresponding end, and first end of wherein said cylinder is connected to disk, and second end of described cylinder is as the second rotation end, and cylinder is connected in radiating component via second end; And a fastener, it is equipped on the pedestal, but and elasticity push disk.
- 3. variable flow as claimed in claim 2 to the passive heat radiation device, it is characterized in that disk, cylinder and radiating component are formed in one.
- 4. variable flow as claimed in claim 3 to the passive heat radiation device, the material that it is characterized in that radiating component is selected from by copper, aluminium, its alloy and its combination institute to be formed.
- 5. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that described rotating member comprises at least: a pedestal, it is provided on the electronic component, and as the surface of the first rotation end contact electronic component, and pedestal has a circular groove; One disk, corresponding chimeric circular groove to pedestal, and can be along described axial rotary and with pedestal between do relative rotation; One cylinder, it has one first one second terminal and corresponding end, and first end of wherein said cylinder is connected to disk, and second end of described cylinder is as the second rotation end, and cylinder is connected in radiating component via second end; And a fastener, it is equipped on the described pedestal, but and elasticity push disk.
- 6. variable flow as claimed in claim 5 to the passive heat radiation device, it is characterized in that disk, cylinder and radiating component are formed in one.
- 7. variable flow as claimed in claim 6 to the passive heat radiation device, the material that it is characterized in that radiating component is selected from by copper, aluminium, its alloy and its combination institute to be formed.
- 8. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that rotating member is a stepping rotating member.
- 9. variable flow as claimed in claim 8 to the passive heat radiation device, it is characterized in that described stepping rotating member comprises a ratchet mechanism.
- 10. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that described radiating component comprises at least: a radiating bottom plate, it has an end face and a corresponding bottom surface, and described radiating bottom plate is connected the second rotation end of rotating member via described bottom surface; And a plurality of radiating fins, it is configured in the end face of described radiating bottom plate.
- 11. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that these radiating fins are to be arranged in parallel.
- 12. variable flow as claimed in claim 1 to the passive heat radiation device, the material that it is characterized in that described radiating component is selected from by copper, aluminium, its alloy and its combination institute to be formed.
- 13. variable flow as claimed in claim 1 to the passive heat radiation device, it is characterized in that also comprising a wind direction indicator that it is provided on the radiating component.
- 14. variable flow as claimed in claim 13 to the passive heat radiation device, it is characterized in that described wind direction indicator comprises in the fine rule and the scraps of paper.
- 15. a variable flow to the passive heat radiation device, be suitable for being provided on the electronic component, the heat energy that is produced in order to the described electronic component of dissipation, it is characterized in that described variable flow to the passive heat radiation device comprise at least: a rotating member, it is provided on the electronic component, and one second rotation end with one first rotation end and correspondence, described rotating member is via the surface of the first rotation end contact at electronic component, and described rotating member is along an axial rotary, and the relative position between the first rotation end and the described second rotation end is adjusted in rotation relatively; One radiating component, it is connected in the second rotation end; And a wind direction indicator, it is provided on the radiating component.
- 16. variable flow as claimed in claim 15 to the passive heat radiation device, it is characterized in that described wind direction indicator comprises in the fine rule and the scraps of paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03202205 CN2594987Y (en) | 2003-01-06 | 2003-01-06 | Passive radiator with variable flow direction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03202205 CN2594987Y (en) | 2003-01-06 | 2003-01-06 | Passive radiator with variable flow direction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2594987Y true CN2594987Y (en) | 2003-12-24 |
Family
ID=33753507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03202205 Expired - Lifetime CN2594987Y (en) | 2003-01-06 | 2003-01-06 | Passive radiator with variable flow direction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2594987Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100524166C (en) * | 2006-05-31 | 2009-08-05 | 中国科学院理化技术研究所 | Dynamic computer chip radiator |
| US20130138262A1 (en) * | 2011-11-28 | 2013-05-30 | International Business Machines Corporation | Heat sink with orientable fins |
| CN103781324A (en) * | 2012-10-22 | 2014-05-07 | 英业达科技有限公司 | Heat radiation device and electronic device |
-
2003
- 2003-01-06 CN CN 03202205 patent/CN2594987Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100524166C (en) * | 2006-05-31 | 2009-08-05 | 中国科学院理化技术研究所 | Dynamic computer chip radiator |
| US20130138262A1 (en) * | 2011-11-28 | 2013-05-30 | International Business Machines Corporation | Heat sink with orientable fins |
| CN103135721A (en) * | 2011-11-28 | 2013-06-05 | 国际商业机器公司 | Heat sink with orientable fins |
| US9507391B2 (en) * | 2011-11-28 | 2016-11-29 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Heat sink with orientable fins |
| CN103781324A (en) * | 2012-10-22 | 2014-05-07 | 英业达科技有限公司 | Heat radiation device and electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20130106 Granted publication date: 20031224 |