CN100521019C - 开关阵列 - Google Patents

开关阵列 Download PDF

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Publication number
CN100521019C
CN100521019C CNB200680000146XA CN200680000146A CN100521019C CN 100521019 C CN100521019 C CN 100521019C CN B200680000146X A CNB200680000146X A CN B200680000146XA CN 200680000146 A CN200680000146 A CN 200680000146A CN 100521019 C CN100521019 C CN 100521019C
Authority
CN
China
Prior art keywords
wiring layer
wiring
connection
switch array
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB200680000146XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1942987A (zh
Inventor
林圣人
八壁正巳
长谷部铁也
原田宗生
奥村胜弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Octec Inc
Original Assignee
Tokyo Electron Ltd
Octec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Octec Inc filed Critical Tokyo Electron Ltd
Publication of CN1942987A publication Critical patent/CN1942987A/zh
Application granted granted Critical
Publication of CN100521019C publication Critical patent/CN100521019C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0054—For holding or placing an element in a given position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/46—Thermally-sensitive members actuated due to expansion or contraction of a solid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H67/00—Electrically-operated selector switches
    • H01H67/22—Switches without multi-position wipers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/014—Switches characterised by the shape having a cantilever fixed on one side connected to one or more dimples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/053—Translation according to an axis perpendicular to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/24—Contacts characterised by the manner in which co-operating contacts engage by abutting with resilient mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H2037/008—Micromechanical switches operated thermally

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Push-Button Switches (AREA)
  • Contacts (AREA)
  • Micromachines (AREA)
CNB200680000146XA 2005-03-22 2006-03-20 开关阵列 Expired - Fee Related CN100521019C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005082121A JP4498181B2 (ja) 2005-03-22 2005-03-22 スイッチアレイ
JP082121/2005 2005-03-22

Publications (2)

Publication Number Publication Date
CN1942987A CN1942987A (zh) 2007-04-04
CN100521019C true CN100521019C (zh) 2009-07-29

Family

ID=37023728

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200680000146XA Expired - Fee Related CN100521019C (zh) 2005-03-22 2006-03-20 开关阵列

Country Status (6)

Country Link
US (1) US7994443B2 (enExample)
EP (1) EP1863046A4 (enExample)
JP (1) JP4498181B2 (enExample)
CN (1) CN100521019C (enExample)
TW (1) TW200707489A (enExample)
WO (1) WO2006101067A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110102696A (ko) * 2010-03-11 2011-09-19 삼성전자주식회사 레버 버튼 및 이를 구비하는 전자 기기
PL2506282T3 (pl) * 2011-03-28 2014-02-28 Delfmems Przełącznik krzyżowy RF MEMS i matryca przełączników krzyżowych zawierająca przełączniki krzyżowe RF MEMS
DE102011103598B4 (de) * 2011-05-30 2017-04-06 Heraeus Deutschland GmbH & Co. KG Laminat zur Herstellung eines Schalters
US8779592B2 (en) * 2012-05-01 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Via-free interconnect structure with self-aligned metal line interconnections
FR2996352B1 (fr) * 2012-10-02 2014-10-31 Alstom Technology Ltd Dispositif de contact electrique de type doigt de contact a fort courant nominal
US9322764B2 (en) * 2013-06-10 2016-04-26 Xerox Corporation Adsorption material-based humidity sensor
WO2014199456A1 (ja) * 2013-06-12 2014-12-18 株式会社メイコー 放熱基板の製造方法
JP2017091917A (ja) * 2015-11-13 2017-05-25 レノボ・シンガポール・プライベート・リミテッド スイッチ装置及び電子機器
US11296437B1 (en) * 2020-10-12 2022-04-05 Pablo Oscar Olivera Brizzio Optimally interconnectable terminal matrix with circuit identification

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1285080A (zh) * 1998-12-22 2001-02-21 三菱电机株式会社 开关,开关用卡合板和开关用卡合板的固定方法
JP3127736U (ja) * 2006-08-31 2006-12-14 宇盟實業有限公司 アルミニウム型

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815957B2 (ja) * 1979-11-20 1983-03-28 松下電器産業株式会社 接点付プリント配線基板の製造方法
JPH03127736A (ja) 1989-10-13 1991-05-30 Koushindou:Kk 漢方薬特殊加味桂枝茯苓丸料製剤及び製法
JPH03127736U (enExample) * 1990-02-23 1991-12-24
JPH07161255A (ja) * 1993-12-03 1995-06-23 Fujikura Ltd メンブレンスイッチ
JPH07245034A (ja) * 1994-03-06 1995-09-19 Yokogawa Hewlett Packard Ltd スイッチの接点構造およびスイッチマトリックスの接点構造
US5723834A (en) * 1996-11-19 1998-03-03 Morton International, Inc. Horn membrane switch with rupturable strain relief bridging connector
JPH10283893A (ja) 1997-04-03 1998-10-23 Omron Corp 超小型リレー埋設基板
JP2000188049A (ja) * 1998-12-22 2000-07-04 Nec Corp マイクロマシンスイッチおよびその製造方法
US6307169B1 (en) * 2000-02-01 2001-10-23 Motorola Inc. Micro-electromechanical switch
WO2003017301A1 (en) * 2001-08-20 2003-02-27 Honeywell International Inc. Snap action thermal switch
ATE412611T1 (de) * 2001-11-09 2008-11-15 Wispry Inc Dreischichtige strahl-mems-einrichtung und diesbezügliche verfahren
US6717825B2 (en) * 2002-01-18 2004-04-06 Fci Americas Technology, Inc. Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
KR100467318B1 (ko) * 2002-06-04 2005-01-24 한국전자통신연구원 저항식 전자기계적 접촉을 이용하는 미세전자기계적 소자
JP4116420B2 (ja) * 2002-12-18 2008-07-09 富士通株式会社 電気接点装置およびその製造方法
US6859119B2 (en) * 2002-12-26 2005-02-22 Motorola, Inc. Meso-microelectromechanical system package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1285080A (zh) * 1998-12-22 2001-02-21 三菱电机株式会社 开关,开关用卡合板和开关用卡合板的固定方法
JP3127736U (ja) * 2006-08-31 2006-12-14 宇盟實業有限公司 アルミニウム型

Also Published As

Publication number Publication date
US20090045039A1 (en) 2009-02-19
EP1863046A4 (en) 2009-07-01
JP2006269120A (ja) 2006-10-05
TW200707489A (en) 2007-02-16
TWI298171B (enExample) 2008-06-21
US7994443B2 (en) 2011-08-09
CN1942987A (zh) 2007-04-04
WO2006101067A1 (ja) 2006-09-28
EP1863046A1 (en) 2007-12-05
JP4498181B2 (ja) 2010-07-07

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090729

Termination date: 20160320