TW200707489A - Switch array - Google Patents

Switch array

Info

Publication number
TW200707489A
TW200707489A TW095107873A TW95107873A TW200707489A TW 200707489 A TW200707489 A TW 200707489A TW 095107873 A TW095107873 A TW 095107873A TW 95107873 A TW95107873 A TW 95107873A TW 200707489 A TW200707489 A TW 200707489A
Authority
TW
Taiwan
Prior art keywords
wiring layer
cantilever
switch array
insulating film
connection state
Prior art date
Application number
TW095107873A
Other languages
English (en)
Chinese (zh)
Other versions
TWI298171B (enExample
Inventor
Masato Hayashi
Masami Yakabe
Tetsuya Hasebe
Muneo Harada
Katsuya Okumura
Original Assignee
Tokyo Electron Ltd
Octec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Octec Inc filed Critical Tokyo Electron Ltd
Publication of TW200707489A publication Critical patent/TW200707489A/zh
Application granted granted Critical
Publication of TWI298171B publication Critical patent/TWI298171B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0054—For holding or placing an element in a given position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/46—Thermally-sensitive members actuated due to expansion or contraction of a solid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H67/00—Electrically-operated selector switches
    • H01H67/22—Switches without multi-position wipers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/014—Switches characterised by the shape having a cantilever fixed on one side connected to one or more dimples
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/053—Translation according to an axis perpendicular to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
    • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
    • H01H1/24—Contacts characterised by the manner in which co-operating contacts engage by abutting with resilient mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H2037/008—Micromechanical switches operated thermally

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Push-Button Switches (AREA)
  • Contacts (AREA)
  • Micromachines (AREA)
TW095107873A 2005-03-22 2006-03-09 Switch array TW200707489A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005082121A JP4498181B2 (ja) 2005-03-22 2005-03-22 スイッチアレイ

Publications (2)

Publication Number Publication Date
TW200707489A true TW200707489A (en) 2007-02-16
TWI298171B TWI298171B (enExample) 2008-06-21

Family

ID=37023728

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107873A TW200707489A (en) 2005-03-22 2006-03-09 Switch array

Country Status (6)

Country Link
US (1) US7994443B2 (enExample)
EP (1) EP1863046A4 (enExample)
JP (1) JP4498181B2 (enExample)
CN (1) CN100521019C (enExample)
TW (1) TW200707489A (enExample)
WO (1) WO2006101067A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501716B (zh) * 2013-06-12 2015-09-21 名幸電子股份有限公司 放熱基板之製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110102696A (ko) * 2010-03-11 2011-09-19 삼성전자주식회사 레버 버튼 및 이를 구비하는 전자 기기
PL2506282T3 (pl) * 2011-03-28 2014-02-28 Delfmems Przełącznik krzyżowy RF MEMS i matryca przełączników krzyżowych zawierająca przełączniki krzyżowe RF MEMS
DE102011103598B4 (de) * 2011-05-30 2017-04-06 Heraeus Deutschland GmbH & Co. KG Laminat zur Herstellung eines Schalters
US8779592B2 (en) * 2012-05-01 2014-07-15 Taiwan Semiconductor Manufacturing Company, Ltd. Via-free interconnect structure with self-aligned metal line interconnections
FR2996352B1 (fr) * 2012-10-02 2014-10-31 Alstom Technology Ltd Dispositif de contact electrique de type doigt de contact a fort courant nominal
US9322764B2 (en) * 2013-06-10 2016-04-26 Xerox Corporation Adsorption material-based humidity sensor
JP2017091917A (ja) * 2015-11-13 2017-05-25 レノボ・シンガポール・プライベート・リミテッド スイッチ装置及び電子機器
US11296437B1 (en) * 2020-10-12 2022-04-05 Pablo Oscar Olivera Brizzio Optimally interconnectable terminal matrix with circuit identification

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815957B2 (ja) * 1979-11-20 1983-03-28 松下電器産業株式会社 接点付プリント配線基板の製造方法
JPH03127736A (ja) 1989-10-13 1991-05-30 Koushindou:Kk 漢方薬特殊加味桂枝茯苓丸料製剤及び製法
JPH03127736U (enExample) * 1990-02-23 1991-12-24
JPH07161255A (ja) * 1993-12-03 1995-06-23 Fujikura Ltd メンブレンスイッチ
JPH07245034A (ja) * 1994-03-06 1995-09-19 Yokogawa Hewlett Packard Ltd スイッチの接点構造およびスイッチマトリックスの接点構造
US5723834A (en) * 1996-11-19 1998-03-03 Morton International, Inc. Horn membrane switch with rupturable strain relief bridging connector
JPH10283893A (ja) 1997-04-03 1998-10-23 Omron Corp 超小型リレー埋設基板
WO2000038206A1 (en) * 1998-12-22 2000-06-29 Mitsubishi Denki Kabushiki Kaisha Switch, click for switches, and method of fixing click for switches
JP2000188049A (ja) * 1998-12-22 2000-07-04 Nec Corp マイクロマシンスイッチおよびその製造方法
US6307169B1 (en) * 2000-02-01 2001-10-23 Motorola Inc. Micro-electromechanical switch
WO2003017301A1 (en) * 2001-08-20 2003-02-27 Honeywell International Inc. Snap action thermal switch
ATE412611T1 (de) * 2001-11-09 2008-11-15 Wispry Inc Dreischichtige strahl-mems-einrichtung und diesbezügliche verfahren
US6717825B2 (en) * 2002-01-18 2004-04-06 Fci Americas Technology, Inc. Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
KR100467318B1 (ko) * 2002-06-04 2005-01-24 한국전자통신연구원 저항식 전자기계적 접촉을 이용하는 미세전자기계적 소자
JP4116420B2 (ja) * 2002-12-18 2008-07-09 富士通株式会社 電気接点装置およびその製造方法
US6859119B2 (en) * 2002-12-26 2005-02-22 Motorola, Inc. Meso-microelectromechanical system package
JP3127736U (ja) * 2006-08-31 2006-12-14 宇盟實業有限公司 アルミニウム型

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI501716B (zh) * 2013-06-12 2015-09-21 名幸電子股份有限公司 放熱基板之製造方法

Also Published As

Publication number Publication date
US20090045039A1 (en) 2009-02-19
EP1863046A4 (en) 2009-07-01
JP2006269120A (ja) 2006-10-05
TWI298171B (enExample) 2008-06-21
US7994443B2 (en) 2011-08-09
CN100521019C (zh) 2009-07-29
CN1942987A (zh) 2007-04-04
WO2006101067A1 (ja) 2006-09-28
EP1863046A1 (en) 2007-12-05
JP4498181B2 (ja) 2010-07-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees