CN100517786C - 氮化物基半导体发光二极管 - Google Patents
氮化物基半导体发光二极管 Download PDFInfo
- Publication number
- CN100517786C CN100517786C CNB2007101030428A CN200710103042A CN100517786C CN 100517786 C CN100517786 C CN 100517786C CN B2007101030428 A CNB2007101030428 A CN B2007101030428A CN 200710103042 A CN200710103042 A CN 200710103042A CN 100517786 C CN100517786 C CN 100517786C
- Authority
- CN
- China
- Prior art keywords
- type coating
- coating layer
- nitride
- based semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 91
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 86
- 239000011247 coating layer Substances 0.000 claims description 154
- 239000010410 layer Substances 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 27
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060048877 | 2006-05-30 | ||
KR1020060048877A KR100795179B1 (ko) | 2006-05-30 | 2006-05-30 | 질화물계 반도체 발광소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101083291A CN101083291A (zh) | 2007-12-05 |
CN100517786C true CN100517786C (zh) | 2009-07-22 |
Family
ID=38789060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007101030428A Active CN100517786C (zh) | 2006-05-30 | 2007-04-29 | 氮化物基半导体发光二极管 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7683389B2 (zh) |
JP (1) | JP4879820B2 (zh) |
KR (1) | KR100795179B1 (zh) |
CN (1) | CN100517786C (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101222015B (zh) * | 2008-01-19 | 2010-05-12 | 鹤山丽得电子实业有限公司 | 发光二极管、具有其的封装结构及其制造方法 |
JP5218117B2 (ja) * | 2008-03-18 | 2013-06-26 | 三菱電機株式会社 | 窒化物半導体積層構造及び光半導体装置並びにその製造方法 |
KR100986440B1 (ko) * | 2009-04-28 | 2010-10-08 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
TWI527261B (zh) * | 2009-09-11 | 2016-03-21 | 晶元光電股份有限公司 | 發光元件 |
CN102456826A (zh) * | 2010-11-01 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | 发光二极管导线架 |
CN102207534B (zh) * | 2011-03-18 | 2013-04-17 | 华南师范大学 | 利用pn结测量LED热阻的方法及其装置 |
CN105938864B (zh) * | 2016-06-22 | 2018-05-29 | 厦门乾照光电股份有限公司 | 一种ac-led芯片及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4982668A (zh) * | 1972-12-20 | 1974-08-08 | ||
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
JP3787202B2 (ja) * | 1997-01-10 | 2006-06-21 | ローム株式会社 | 半導体発光素子 |
JP2002185049A (ja) | 2000-11-08 | 2002-06-28 | Lumileds Lighting Us Llc | フリップチップ発光ダイオードおよびフリップチップ静電放電保護チップをパッケージにおける電極にダイレクトボンディングする方法 |
TW492202B (en) | 2001-06-05 | 2002-06-21 | South Epitaxy Corp | Structure of III-V light emitting diode (LED) arranged in flip chip configuration having structure for preventing electrostatic discharge |
KR100536709B1 (ko) | 2003-05-31 | 2005-12-14 | 주식회사 대우일렉트로닉스 | 비디오 신호처리 제어장치 |
US20050189552A1 (en) * | 2003-12-26 | 2005-09-01 | Nobuyuki Ikoma | Semiconductor light-emitting device |
-
2006
- 2006-05-30 KR KR1020060048877A patent/KR100795179B1/ko active IP Right Grant
-
2007
- 2007-04-29 CN CNB2007101030428A patent/CN100517786C/zh active Active
- 2007-05-03 US US11/797,491 patent/US7683389B2/en active Active
- 2007-05-24 JP JP2007137849A patent/JP4879820B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US7683389B2 (en) | 2010-03-23 |
KR100795179B1 (ko) | 2008-01-16 |
CN101083291A (zh) | 2007-12-05 |
US20070278499A1 (en) | 2007-12-06 |
KR20070115062A (ko) | 2007-12-05 |
JP4879820B2 (ja) | 2012-02-22 |
JP2007324591A (ja) | 2007-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG LED CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRO-MECHANICS CO., LTD. Effective date: 20100826 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100826 Address after: Gyeonggi Do, South Korea Patentee after: Samsung LED Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electro-Mechanics Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SAMSUNG LED CO., LTD. Effective date: 20121205 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121205 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Electronics Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung LED Co., Ltd. |