CN100509258C - Low-temperature welding material - Google Patents
Low-temperature welding material Download PDFInfo
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- CN100509258C CN100509258C CNB2005100277477A CN200510027747A CN100509258C CN 100509258 C CN100509258 C CN 100509258C CN B2005100277477 A CNB2005100277477 A CN B2005100277477A CN 200510027747 A CN200510027747 A CN 200510027747A CN 100509258 C CN100509258 C CN 100509258C
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- tin
- zinc
- solder
- low
- aluminium
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Abstract
A low-temp solder for soldering electric capacitors contains Sn (60-64 wt.%), Zn (35.891-39.891 wt.%) and the Cu, Pb, Fe, Sb, As, Al, Bi, Ni and Cd (rest). Its advantages are low smelting temp, no damage to polypropene film, and high adhesion to Al foil.
Description
Technical field
The present invention relates to a kind of scolder, relate in particular to a kind of solder.
Background technology
The element of capacitor is that pole plate protrudes form at present, adopts aluminium foil as pole plate, and polypropylene film is made medium.And drawing of pole plate adopts welding process of rotary solding iron to weld.Adopt common Zinc-tin alloy, its fusion temperature is understood the melt polypropylene film, and is had only 70% with the rate that combines of aluminium foil between 280～330 ℃ when welding, influence the quality of capacitor, and the condenser loss angle tangent value is 0.04%.Capacitor is poor with the ability to bear of harmonic current to shoving.
Summary of the invention
At the deficiency of prior art, put the solder prescription of the ability of performance and anti-overvoltage, big electric current to the polypropylene film not damaged and with the rate that the combines height of aluminium foil, the office of improving capacitor when the object of the present invention is to provide a kind of the welding.
The technical scheme that realizes goal of the invention of the present invention is as follows:
A kind of solder, its composition and proportioning (percetage by weight) are: tin 60～64%, zinc 35.891～39.891%, surplus is copper, lead, iron, antimony, arsenic, aluminium, bismuth, nickel and cadmium.
The composition of described solder and proportioning (percetage by weight) also can be:
Tin 60～64%
Copper 0.015%
Plumbous 0.03%
Iron 0.03%
Antimony 0.01%
Arsenic 0.01%
Aluminium 0.005%
Bismuth 0.005%
Nickel 0.003%
Cadmium 0.001%
Zinc 35.891～39.891%.
The solder that adopts above-mentioned prescription to make, its fusion temperature is 199 ℃, during welding polypropylene film is not had any damage, and reaches 90% with the rate that combines of aluminium foil, the loss tangent of capacitor is less than 0.02%, and the ability of performance and anti-overvoltage, big electric current is put in the office of improving capacitor.
The specific embodiment
How further specify the present invention below in conjunction with specific embodiment realizes:
Embodiment 1
Take by weighing 60 parts in tin, 0.015 part of copper, plumbous 0.03 part, 0.03 part of iron, 0.01 part in antimony, 0.01 part of arsenic, 0.005 part in aluminium, 0.005 part of bismuth, 0.003 part in nickel, 0.001 part of cadmium, 39.891 parts on zinc.
At first put into zinc in heating furnace, the control temperature after waiting to melt, adds tin about 400 ℃, make temperature remain on 200 ℃, wait the tin fusing after, stir, add other metal, promptly make solder of the present invention.
Embodiment 2
Take by weighing 61.991 parts in tin, 0.015 part of copper, plumbous 0.03 part, 0.03 part of iron, 0.01 part in antimony, 0.01 part of arsenic, 0.005 part in aluminium, 0.005 part of bismuth, 0.003 part in nickel, 0.001 part of cadmium, 37.9 parts on zinc.
At first put into zinc in heating furnace, the control temperature after waiting to melt, adds tin about 400 ℃, make temperature remain on 200 ℃, wait the tin fusing after, stir, add other metal, promptly make solder of the present invention.
Embodiment 3
Take by weighing 63 parts in tin, 0.015 part of copper, plumbous 0.03 part, 0.03 part of iron, 0.01 part in antimony, 0.01 part of arsenic, 0.005 part in aluminium, 0.005 part of bismuth, 0.003 part in nickel, 0.001 part of cadmium, 36.891 parts on zinc.
At first put into zinc in heating furnace, the control temperature after waiting to melt, adds tin about 400 ℃, make temperature remain on 200 ℃, wait the tin fusing after, stir, add other metal, promptly make solder of the present invention.
Embodiment 4
With 63.891 parts in tin, 0.015 part of copper, plumbous 0.03 part, 0.03 part of iron, 0.01 part in antimony, 0.01 part of arsenic, 0.005 part in aluminium, 0.005 part of bismuth, 0.003 part in nickel, 0.001 part of cadmium, 36 parts on zinc.
At first put into zinc in heating furnace, the control temperature after waiting to melt, adds tin about 400 ℃, make temperature remain on 200 ℃, wait the tin fusing after, stir, add other metal, promptly make solder of the present invention.
Claims (1)
1, a kind of solder, its composition and proportioning (percetage by weight) are as follows: tin is 61.991～63.891%, and zinc is 36～37.9%, and surplus is copper, lead, iron, antimony, arsenic, aluminium, bismuth, nickel and cadmium, wherein,
Copper 0.015%
Plumbous 0.03%
Iron 0.03%
Antimony 0.01%
Arsenic 0.01%
Aluminium 0.005%
Bismuth 0.005%
Nickel 0.003%
Cadmium 0.001%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100277477A CN100509258C (en) | 2005-07-14 | 2005-07-14 | Low-temperature welding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100277477A CN100509258C (en) | 2005-07-14 | 2005-07-14 | Low-temperature welding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1712175A CN1712175A (en) | 2005-12-28 |
| CN100509258C true CN100509258C (en) | 2009-07-08 |
Family
ID=35718067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100277477A Expired - Fee Related CN100509258C (en) | 2005-07-14 | 2005-07-14 | Low-temperature welding material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100509258C (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2451587C1 (en) * | 2010-10-29 | 2012-05-27 | Гатемсолтан Пулатович Раджабалиев | Solder for soldering aluminium and its alloys |
| JP6717559B2 (en) * | 2013-10-16 | 2020-07-01 | 三井金属鉱業株式会社 | Solder alloy and solder powder |
| CN105290638A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Cadmium-added soldering tin |
| CN106271184B (en) * | 2016-08-30 | 2018-08-31 | 中国航天科技集团公司川南机械厂 | It is a kind of to be used to weld soft solder, brazing flux of aluminium foil and stainless steel and preparation method thereof and welding method |
| WO2018189154A1 (en) * | 2017-04-10 | 2018-10-18 | Metallo Belgium | Improved process for the production of crude solder |
| CN111344106B (en) | 2017-11-24 | 2022-03-04 | 千住金属工业株式会社 | Solder material, solder paste, and solder joint |
| JP6521160B1 (en) * | 2018-07-20 | 2019-05-29 | 千住金属工業株式会社 | Solder alloy, solder powder, solder paste, and solder joint using them |
| JP6573019B1 (en) | 2018-10-25 | 2019-09-11 | 千住金属工業株式会社 | Flux and solder paste |
| CN109595972A (en) * | 2018-11-01 | 2019-04-09 | 广西瑞祺丰新材料有限公司 | A kind of aluminium alloy cooling tube |
| US11571770B2 (en) | 2019-05-27 | 2023-02-07 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, solder preform, and solder joint |
| JP6649596B1 (en) * | 2019-05-27 | 2020-02-19 | 千住金属工業株式会社 | Solder alloys, solder powders and solder joints |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718868A (en) * | 1995-11-30 | 1998-02-17 | Mitsui Mining & Smelting Co., Ltd. | Lead-free tin-zinc-based soldering alloy |
| CN1376556A (en) * | 2002-04-29 | 2002-10-30 | 戴国水 | Welding Sn-Zn material and its preparing process |
| US20030091462A1 (en) * | 2001-11-12 | 2003-05-15 | Tao-Kuang Chang | Method for fabricating leadless solder for IC packaging |
| CN1562553A (en) * | 2004-03-25 | 2005-01-12 | 戴国水 | Tin-zinc-copper solder with no lead |
-
2005
- 2005-07-14 CN CNB2005100277477A patent/CN100509258C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5718868A (en) * | 1995-11-30 | 1998-02-17 | Mitsui Mining & Smelting Co., Ltd. | Lead-free tin-zinc-based soldering alloy |
| US20030091462A1 (en) * | 2001-11-12 | 2003-05-15 | Tao-Kuang Chang | Method for fabricating leadless solder for IC packaging |
| CN1376556A (en) * | 2002-04-29 | 2002-10-30 | 戴国水 | Welding Sn-Zn material and its preparing process |
| CN1562553A (en) * | 2004-03-25 | 2005-01-12 | 戴国水 | Tin-zinc-copper solder with no lead |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1712175A (en) | 2005-12-28 |
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