CN100487385C - 胎压温度监测系统的多功能传感器集成芯片 - Google Patents
胎压温度监测系统的多功能传感器集成芯片 Download PDFInfo
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- CN100487385C CN100487385C CNB2005100260368A CN200510026036A CN100487385C CN 100487385 C CN100487385 C CN 100487385C CN B2005100260368 A CNB2005100260368 A CN B2005100260368A CN 200510026036 A CN200510026036 A CN 200510026036A CN 100487385 C CN100487385 C CN 100487385C
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CN1865864A CN1865864A (zh) | 2006-11-22 |
CN100487385C true CN100487385C (zh) | 2009-05-13 |
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Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7377156B1 (en) * | 2007-02-16 | 2008-05-27 | Lear Corporation | Tire pressure monitor system with side entry pressure port |
US7798010B2 (en) * | 2007-10-11 | 2010-09-21 | Honeywell International Inc. | Sensor geometry for improved package stress isolation |
CN101337652B (zh) * | 2008-08-11 | 2011-08-10 | 美新半导体(无锡)有限公司 | 传感器元件接触表面的封装结构及其封装方法 |
CN101551403B (zh) * | 2009-05-22 | 2012-09-05 | 中国科学院上海微系统与信息技术研究所 | 一种测试加速度,压力和温度的集成硅芯片及制作方法 |
US8618620B2 (en) * | 2010-07-13 | 2013-12-31 | Infineon Technologies Ag | Pressure sensor package systems and methods |
CN102680018A (zh) * | 2011-03-09 | 2012-09-19 | 刘胜 | 多功能组合传感器 |
US9608297B2 (en) | 2011-11-16 | 2017-03-28 | Datang Nxp Semiconductors Co., Ltd. | In-cell battery management device |
DE102012216563A1 (de) * | 2012-09-17 | 2014-03-20 | Robert Bosch Gmbh | Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung zur Unterbringung in einer galvanischen Zelle |
CN103063317B (zh) * | 2012-12-18 | 2017-03-01 | 上海集成电路研发中心有限公司 | 片上温度传感器 |
CN103968886A (zh) * | 2013-02-04 | 2014-08-06 | 刘胜 | 一种多自由度微传感器模块及其封装 |
CN103419577B (zh) * | 2013-08-20 | 2016-06-15 | 深圳市道通科技股份有限公司 | 一种可升级通用型胎压感测装置、系统及系统实现方法 |
CN103487175B (zh) * | 2013-09-02 | 2015-09-30 | 无锡慧思顿科技有限公司 | 一种塑料封装的压力传感器的制作方法 |
CN104236628A (zh) * | 2014-09-16 | 2014-12-24 | 武汉大学 | 一种四自由度组合传感器 |
CN104362144B (zh) * | 2014-09-22 | 2017-05-17 | 广东合微集成电路技术有限公司 | 胎压监测系统的封装结构及其封装方法 |
CN104649217B (zh) * | 2014-12-23 | 2016-03-23 | 北京时代民芯科技有限公司 | 一种多mems传感器的单芯片加工方法 |
FR3045498B1 (fr) * | 2015-12-18 | 2017-12-22 | Continental Automotive France | Procede d'adaptation de la strategie d'acquisition des mesures d'acceleration radiale des roues d'un vehicule |
EP3196952B1 (en) | 2016-01-21 | 2019-06-19 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Mems piezoelectric transducer formed at a pcb support structure |
CN107527874B (zh) * | 2016-06-20 | 2023-08-01 | 恩智浦美国有限公司 | 腔式压力传感器器件 |
CN107705529A (zh) * | 2017-09-28 | 2018-02-16 | 河南汇纳科技有限公司 | 一种基于LoRa的矿井用无线数据采集装置 |
EP4047337A4 (en) * | 2019-10-17 | 2023-11-22 | TDK Corporation | MEASURING DEVICE AND MEASURING SYSTEM |
CN111855076B (zh) * | 2020-07-24 | 2021-10-08 | 深圳信息职业技术学院 | 用于压力传感器芯片封装测试的封装机构及其封装方法 |
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Effective date of registration: 20130129 Address after: 14 building, 7 building, Optics Valley Pioneer Street, East Lake Development Zone, Wuhan, Hubei, 430074 Patentee after: Wuhan FineMEMS Inc. Address before: 201203. B, Room 309, block 518, blue wave road, Zhangjiang, Shanghai Patentee before: Feien Microelectronics Co., Ltd., Shanghai |