CN100469851C - 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 - Google Patents

可热固化的导电性粘合片、连接结构以及使用它们的连接方法 Download PDF

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Publication number
CN100469851C
CN100469851C CNB018154077A CN01815407A CN100469851C CN 100469851 C CN100469851 C CN 100469851C CN B018154077 A CNB018154077 A CN B018154077A CN 01815407 A CN01815407 A CN 01815407A CN 100469851 C CN100469851 C CN 100469851C
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CN
China
Prior art keywords
heat
adherend
adhesive sheet
bossing
binder layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB018154077A
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English (en)
Chinese (zh)
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CN1639290A (zh
Inventor
川手恒一郎
平泽雄二
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of CN1639290A publication Critical patent/CN1639290A/zh
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Publication of CN100469851C publication Critical patent/CN100469851C/zh
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Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)
CNB018154077A 2000-09-08 2001-09-07 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 Expired - Fee Related CN100469851C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000273119A JP2002097424A (ja) 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法
JP273119/00 2000-09-08
JP273119/2000 2000-09-08

Publications (2)

Publication Number Publication Date
CN1639290A CN1639290A (zh) 2005-07-13
CN100469851C true CN100469851C (zh) 2009-03-18

Family

ID=18759125

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018154077A Expired - Fee Related CN100469851C (zh) 2000-09-08 2001-09-07 可热固化的导电性粘合片、连接结构以及使用它们的连接方法

Country Status (6)

Country Link
EP (1) EP1315780A2 (fr)
JP (1) JP2002097424A (fr)
KR (1) KR100617410B1 (fr)
CN (1) CN100469851C (fr)
AU (1) AU2001288925A1 (fr)
WO (1) WO2002020686A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624187B1 (en) 2000-06-12 2003-09-23 Health Research, Inc. Long wave length absorbing bacteriochlorin alkyl ether analogs
JP2007005640A (ja) 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
EP2146355A1 (fr) * 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Élément de liaison conducteur, structure de liaison et module de cellule solaire
EP2200093A1 (fr) * 2007-09-26 2010-06-23 Hitachi Chemical Company, Ltd. Element pour la connexion d'un conducteur, procede pour fabriquer cet element, structure de connexion et module de cellule solaire
KR101108862B1 (ko) * 2007-09-26 2012-01-31 히다치 가세고교 가부시끼가이샤 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈
CN102007647B (zh) * 2008-03-19 2015-03-18 皇家飞利浦电子股份有限公司 用于建立与传导带的电连接的连接器
DE102011100457A1 (de) * 2011-05-04 2012-11-08 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit einem Trägerelement, einer Verbindungsstruktur und einem Halbleiterchip
JP5952078B2 (ja) * 2011-06-23 2016-07-13 日東電工株式会社 導電性熱硬化型接着テープ
JP2013116929A (ja) * 2011-12-01 2013-06-13 Nitto Denko Corp 導電性接着シート、その製造方法、集電電極および太陽電池モジュール
WO2013148967A1 (fr) * 2012-03-30 2013-10-03 Adhesives Research, Inc. Ruban de collecte de charges
JP6920412B2 (ja) 2016-07-28 2021-08-18 スリーエム イノベイティブ プロパティズ カンパニー 電気ケーブル
WO2018147426A1 (fr) * 2017-02-13 2018-08-16 タツタ電線株式会社 Film de blindage, carte de circuit imprimé blindée et procédé de fabrication d'une carte de circuit imprimé blindée
KR20210094195A (ko) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1247016A (en) * 1967-08-22 1971-09-22 Minnesota Mining & Mfg Electrically conductive adhesive tape

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A3 (fr) * 1986-02-07 1988-12-28 Minnesota Mining And Manufacturing Company Connecteur comportant des pistes conductrices à pas fin
JPS62227986A (ja) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd 導電性両面テ−プ
WO1994024704A1 (fr) * 1993-04-12 1994-10-27 Bolger Justin C Preformes de surfaces conductrices et adhesives de liaison

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1247016A (en) * 1967-08-22 1971-09-22 Minnesota Mining & Mfg Electrically conductive adhesive tape

Also Published As

Publication number Publication date
AU2001288925A1 (en) 2002-03-22
CN1639290A (zh) 2005-07-13
JP2002097424A (ja) 2002-04-02
WO2002020686A2 (fr) 2002-03-14
KR100617410B1 (ko) 2006-09-01
KR20040030406A (ko) 2004-04-09
EP1315780A2 (fr) 2003-06-04
WO2002020686A3 (fr) 2002-06-06

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090318

Termination date: 20120907