CN100447573C - 微电子弹簧触点上的基准对准标记 - Google Patents

微电子弹簧触点上的基准对准标记 Download PDF

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Publication number
CN100447573C
CN100447573C CNB028295919A CN02829591A CN100447573C CN 100447573 C CN100447573 C CN 100447573C CN B028295919 A CNB028295919 A CN B028295919A CN 02829591 A CN02829591 A CN 02829591A CN 100447573 C CN100447573 C CN 100447573C
Authority
CN
China
Prior art keywords
contact
alignment mark
contact tip
weld pad
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB028295919A
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English (en)
Chinese (zh)
Other versions
CN1668928A (zh
Inventor
罗伯特·C·马丁
埃里克·T·沃特杰
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FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN1668928A publication Critical patent/CN1668928A/zh
Application granted granted Critical
Publication of CN100447573C publication Critical patent/CN100447573C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNB028295919A 2002-07-15 2002-07-15 微电子弹簧触点上的基准对准标记 Expired - Fee Related CN100447573C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/022477 WO2004015432A1 (fr) 2002-07-15 2002-07-15 Marques d'alignement de repere sur des contacts a ressort micro-electroniques

Publications (2)

Publication Number Publication Date
CN1668928A CN1668928A (zh) 2005-09-14
CN100447573C true CN100447573C (zh) 2008-12-31

Family

ID=31713782

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028295919A Expired - Fee Related CN100447573C (zh) 2002-07-15 2002-07-15 微电子弹簧触点上的基准对准标记

Country Status (6)

Country Link
EP (1) EP1523684A1 (fr)
JP (1) JP2005533263A (fr)
KR (1) KR100880088B1 (fr)
CN (1) CN100447573C (fr)
AU (1) AU2002368160A1 (fr)
WO (1) WO2004015432A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7602200B2 (en) 2006-03-15 2009-10-13 Kabushiki Kaisha Nihon Micronics Probe for electrical test comprising a positioning mark and probe assembly
CN100399532C (zh) * 2006-07-24 2008-07-02 友达光电股份有限公司 对位精度检测装置
US7836587B2 (en) * 2006-09-21 2010-11-23 Formfactor, Inc. Method of repairing a contactor apparatus
JP5113392B2 (ja) 2007-01-22 2013-01-09 株式会社日本マイクロニクス プローブおよびそれを用いた電気的接続装置
KR101324284B1 (ko) 2007-05-25 2013-11-01 주식회사 코리아 인스트루먼트 프로브 카드용 전기 연결 어셈블리, 이를 가지는 프로브카드, 프로브 카드용 전기 연결 어셈블리의 제조 방법 및이를 이용한 프로브 카드의 제조 방법
JP5416986B2 (ja) 2009-02-19 2014-02-12 株式会社日本マイクロニクス 電気的接続装置
JP5412685B2 (ja) * 2009-07-24 2014-02-12 日本電子材料株式会社 プローブ、およびプローブの製造方法
KR101638228B1 (ko) * 2014-05-15 2016-07-11 주식회사 코리아 인스트루먼트 파인 피치에 대응되는 프로브 핀의 제조 방법
US9804196B2 (en) * 2016-01-15 2017-10-31 Cascade Microtech, Inc. Probes with fiducial marks, probe systems including the same, and associated methods
US11205670B2 (en) 2016-04-15 2021-12-21 Teledyne Digital Imaging, Inc. Alignment of multiple image dice in package
SG11202002097UA (en) * 2017-09-08 2020-04-29 Enplas Corp Electric connection socket

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154044A (ja) * 1984-12-26 1986-07-12 Toyo Electric Mfg Co Ltd プロ−バ−のプロ−ブカ−ド
JPH0265150A (ja) * 1988-08-30 1990-03-05 Fujitsu Ltd プローブカードの自動位置合せ方法
JPH10160793A (ja) * 1996-12-02 1998-06-19 Hitachi Cable Ltd ベアチップ検査用プローブ基板及びその製造方法、及びベアチップ検査システム
US5864946A (en) * 1993-11-16 1999-02-02 Form Factor, Inc. Method of making contact tip structures
CN1045693C (zh) * 1993-11-16 1999-10-13 佛姆法克特股份有限公司 用于互联、插件和半导体组件的接触结构及其方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06209033A (ja) * 1993-01-12 1994-07-26 Hitachi Ltd マーク付きプローブ
JPH08327658A (ja) * 1995-03-31 1996-12-13 Tokyo Electron Ltd 基板検査装置
JP3562166B2 (ja) * 1996-09-25 2004-09-08 凸版印刷株式会社 検査電極を有する配線回路基板の形成方法
JPH10213597A (ja) * 1997-01-31 1998-08-11 Hitachi Ltd プローブカード
JP3378259B2 (ja) * 1997-05-15 2003-02-17 フォームファクター，インコーポレイテッド 接触構造体の作成方法
WO2000016107A1 (fr) * 1998-09-16 2000-03-23 Hitachi, Ltd. Procede de fabrication d'un substrat d'inspection d'un dispositif a semi-conducteurs
TW589453B (en) * 1998-12-02 2004-06-01 Formfactor Inc Lithographic contact elements
US7189077B1 (en) * 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154044A (ja) * 1984-12-26 1986-07-12 Toyo Electric Mfg Co Ltd プロ−バ−のプロ−ブカ−ド
JPH0265150A (ja) * 1988-08-30 1990-03-05 Fujitsu Ltd プローブカードの自動位置合せ方法
US5864946A (en) * 1993-11-16 1999-02-02 Form Factor, Inc. Method of making contact tip structures
CN1045693C (zh) * 1993-11-16 1999-10-13 佛姆法克特股份有限公司 用于互联、插件和半导体组件的接触结构及其方法
JPH10160793A (ja) * 1996-12-02 1998-06-19 Hitachi Cable Ltd ベアチップ検査用プローブ基板及びその製造方法、及びベアチップ検査システム

Also Published As

Publication number Publication date
EP1523684A1 (fr) 2005-04-20
WO2004015432A1 (fr) 2004-02-19
JP2005533263A (ja) 2005-11-04
CN1668928A (zh) 2005-09-14
KR100880088B1 (ko) 2009-01-23
AU2002368160A1 (en) 2004-02-25
KR20050019870A (ko) 2005-03-03

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SE01 Entry into force of request for substantive examination
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081231

Termination date: 20120715