AU2002368160A1 - Fiducial alignment marks on microelectronic spring contacts - Google Patents

Fiducial alignment marks on microelectronic spring contacts

Info

Publication number
AU2002368160A1
AU2002368160A1 AU2002368160A AU2002368160A AU2002368160A1 AU 2002368160 A1 AU2002368160 A1 AU 2002368160A1 AU 2002368160 A AU2002368160 A AU 2002368160A AU 2002368160 A AU2002368160 A AU 2002368160A AU 2002368160 A1 AU2002368160 A1 AU 2002368160A1
Authority
AU
Australia
Prior art keywords
alignment marks
spring contacts
microelectronic spring
fiducial alignment
fiducial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002368160A
Inventor
Robert C. Martin
Eric T. Watje
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU2002368160A1 publication Critical patent/AU2002368160A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2002368160A 2002-07-15 2002-07-15 Fiducial alignment marks on microelectronic spring contacts Abandoned AU2002368160A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/022477 WO2004015432A1 (en) 2002-07-15 2002-07-15 Fiducial alignment marks on microelectronic spring contacts

Publications (1)

Publication Number Publication Date
AU2002368160A1 true AU2002368160A1 (en) 2004-02-25

Family

ID=31713782

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002368160A Abandoned AU2002368160A1 (en) 2002-07-15 2002-07-15 Fiducial alignment marks on microelectronic spring contacts

Country Status (6)

Country Link
EP (1) EP1523684A1 (en)
JP (1) JP2005533263A (en)
KR (1) KR100880088B1 (en)
CN (1) CN100447573C (en)
AU (1) AU2002368160A1 (en)
WO (1) WO2004015432A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7602200B2 (en) 2006-03-15 2009-10-13 Kabushiki Kaisha Nihon Micronics Probe for electrical test comprising a positioning mark and probe assembly
CN100399532C (en) * 2006-07-24 2008-07-02 友达光电股份有限公司 Para-position precision detecting device
US7836587B2 (en) * 2006-09-21 2010-11-23 Formfactor, Inc. Method of repairing a contactor apparatus
JP5113392B2 (en) 2007-01-22 2013-01-09 株式会社日本マイクロニクス Probe and electrical connection device using the same
KR101324284B1 (en) 2007-05-25 2013-11-01 주식회사 코리아 인스트루먼트 Electrical connecting assembly for probe card, probe card having the electrical connecting assembly, manufacturing method of electrical connecting assembly for probe card and manufacturing method of having the electrical connecting assembly
JP5416986B2 (en) 2009-02-19 2014-02-12 株式会社日本マイクロニクス Electrical connection device
JP5412685B2 (en) * 2009-07-24 2014-02-12 日本電子材料株式会社 Probe and probe manufacturing method
KR101638228B1 (en) * 2014-05-15 2016-07-11 주식회사 코리아 인스트루먼트 Fabrication method of probe pin capable of being used for fine pitch
US9804196B2 (en) * 2016-01-15 2017-10-31 Cascade Microtech, Inc. Probes with fiducial marks, probe systems including the same, and associated methods
EP3443586B1 (en) * 2016-04-15 2021-01-20 Teledyne Digital Imaging, Inc. Alignment of multiple image dice in package
JP7125408B2 (en) * 2017-09-08 2022-08-24 株式会社エンプラス Socket for electrical connection

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61154044A (en) * 1984-12-26 1986-07-12 Toyo Electric Mfg Co Ltd Probe card of prober
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
JPH0265150A (en) * 1988-08-30 1990-03-05 Fujitsu Ltd Automatic alignment method for probe card
JPH06209033A (en) * 1993-01-12 1994-07-26 Hitachi Ltd Probe with mark
JPH08327658A (en) * 1995-03-31 1996-12-13 Tokyo Electron Ltd Inspection equipment for substrate
JP3562166B2 (en) * 1996-09-25 2004-09-08 凸版印刷株式会社 Method of forming printed circuit board having inspection electrode
JPH10160793A (en) * 1996-12-02 1998-06-19 Hitachi Cable Ltd Probe substrate for bare-chip inspection and its manufacture as well as bare-chip inspection system
JPH10213597A (en) * 1997-01-31 1998-08-11 Hitachi Ltd Probe card
JP3378259B2 (en) * 1997-05-15 2003-02-17 フォームファクター，インコーポレイテッド How to create a contact structure
WO2000016107A1 (en) * 1998-09-16 2000-03-23 Hitachi, Ltd. Method for manufacturing substrate for inspecting semiconductor device
EP1135690B1 (en) * 1998-12-02 2003-06-04 Formfactor, Inc. Lithographic contact elements
US7189077B1 (en) * 1999-07-30 2007-03-13 Formfactor, Inc. Lithographic type microelectronic spring structures with improved contours

Also Published As

Publication number Publication date
JP2005533263A (en) 2005-11-04
EP1523684A1 (en) 2005-04-20
KR100880088B1 (en) 2009-01-23
CN100447573C (en) 2008-12-31
WO2004015432A1 (en) 2004-02-19
KR20050019870A (en) 2005-03-03
CN1668928A (en) 2005-09-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase