CN100446642C - 壳体及制作方法 - Google Patents

壳体及制作方法 Download PDF

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CN100446642C
CN100446642C CNB2005100354187A CN200510035418A CN100446642C CN 100446642 C CN100446642 C CN 100446642C CN B2005100354187 A CNB2005100354187 A CN B2005100354187A CN 200510035418 A CN200510035418 A CN 200510035418A CN 100446642 C CN100446642 C CN 100446642C
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chromium
housing
metal
carbide film
alloy
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CN1829421A (zh
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林知本
李永明
张以林
张成国
任乃娟
罗先锋
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Shenzhen Futaihong Precision Industry Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T428/31504—Composite [nonstructural laminate]
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Abstract

本发明是关于一种壳体，包括一基体、一铬金属层及一碳化铬膜，该基体的材料为金属或合金，该铬金属层沉积于所述基体的表面，该碳化铬膜沉积于所述铬金属层的表面，所述铬金属层的厚度为0.6-0.8微米，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5。一种壳体的制作方法，包括以下步骤：提供一金属或合金基体；于该基体表面沉积一铬金属层，所述铬金属层的厚度为0.6-0.8微米；于该铬金属层表面沉积一碳化铬膜，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5。

Description

壳体及制作方法
技术领域
本发明是关于一种壳体及制作方法，尤其是一种金属或合金的壳体及制作方法。
背景技术
随着移动通讯技术的发展，各式各样的便携式电子装置如移动电话、PDA、数码相机、笔记本电脑等竞相涌现，令消费者可随时随地充分享受移动技术带来的种种便利，由此便携式电子装置愈来愈为广大消费者所青睐。
现有的便携式电子装置外壳一般采用塑料(如ABS塑料)作为其主要材料，随着金属成型技术的发展，近年来出现了以金属或其合金制成的便携式电子装置外壳，如不锈钢、铝合金、镁铝合金、钛合金等。
其中钛合金材料较强的表面硬度作为便携式电子装置外壳，然由于钛合金材料本身价格昂贵，只能采用于部分高端产品。而不锈钢、铝合金、镁铝合金等材料的表面硬度较低，如不锈钢的维氏硬度通常为200HV。相对较低的表面硬度导致在日常使用中，不锈钢、铝合金、镁铝合金等易于被刮伤或损坏，从而破坏了便携式电子装置的外观及吸引力，也进一步影响了便携式电子装置等产品的价值。
为增加不锈钢的硬度，可采用渗碳或渗氮法。渗碳法是通过使不锈钢表面接触含碳物质从而将不锈钢表面变成高碳不锈钢。而渗氮法是于不锈钢表面形成氮化物而使不锈钢材料表面硬度提高，一般是通过在氨气中加热不锈钢的方式从而将氮原子渗入不锈钢中。渗碳法及渗氮法均可显著提高不锈钢材料的表面硬度，如经过渗碳处理的不锈钢的表面硬度可达到维氏硬度800HV，经过渗氮处理的不锈钢的表面硬度可达到维氏硬度600HV。但是，渗碳法及渗氮法均需要于高温下进行，如渗碳要求于1000℃的高温下进行20小时，而渗氮要求于524-549℃的高温下进行24-48小时。因此，渗碳及渗氮法需要较长的处理时间和较高的处理温度，从而降低了生产能力及生产效率，增加了生产成本。
此外，铝合金、镁铝合金、钛合金等金属或合金既不能渗碳，又不能渗氮。这些金属或合金可以通过电镀法沉积一层硬膜，但是铝合金、镁铝合金、钛合金等金属或合金在电解液中氧化很快，并且变成不导电体，从而阻止了电镀。
发明内容
鉴于上述状况，有必要提供一种成本较低、制造简单且具有较高的表面硬度的壳体。
另，有必要提供一种壳体的制作方法。
一种壳体，包括一基体、一铬金属层及一碳化铬膜，该基体的材料为金属或合金，该铬金属层沉积于所述基体的表面，该碳化铬膜沉积于所述铬金属层的表面，所述铬金属层的厚度为0.6-0.8微米，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5。
一种壳体的制作方法，包括以下步骤：
提供一金属或合金基体；
于该基体表面沉积一铬金属层，所述铬金属层的厚度为0.6-0.8微米；
于该铬金属层表面沉积一碳化铬膜，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5。
相较现有技术，该壳体采用于金属或合金基体上沉积铬金属层及碳化铬膜来增强金属或合金材料的表面硬度。铬金属层位于金属或合金基体与碳化铬膜之间，且所述铬金属层的厚度为0.6-0.8微米，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5，如此，可有效增强碳化铬膜于金属或合金基体上的附着力，同时铬金属层及碳化铬膜均具有很高的硬度，其维氏硬度可达600HV。
附图说明
图1是本发明壳体的较佳实施例的结构示意图。
具体实施方式
本发明的壳体是用于便携式电子装置外壳、钟表表带、钟表外壳或眼镜框架等常受外力摩擦的壳体。
请参阅图1所示，本发明较佳实施例的壳体1，包括一基体10、一铬金属层12及一碳化铬膜14，该基体10的材料为金属或合金，该铬金属层12沉积于所述基体10的表面，该碳化铬膜14沉积于所述铬金属层12的表面。
基体10的金属或合金材料优选为不锈钢、铝合金、镁铝合金或钛合金，亦可为其它常见的金属壳体所采用的金属或合金。铬金属层12的厚度优选为0.6-0.8微米，而碳化铬膜14的厚度优选为2.5-3.0微米。其中碳化铬膜14中碳原子与铬原子的原子比优选为0.4-0.5。
该壳体1采用于金属或合金基体10上沉积铬金属层12及碳化铬膜14来增强金属或合金材料的表面硬度。铬金属层12位于金属或合金基体10与碳化铬膜14之间，可有效增强碳化铬膜14于金属或合金基体10上的附着力，同时铬金属层12及碳化铬膜14均具有很高的硬度，使得该壳体1的维氏硬度可达600HV。而且，当基体10金属为不锈钢时，该壳体1的颜色与不锈钢基体10的颜色保持一致。
本发明较佳实施例的壳体1的制作方法包括以下步骤：
提供一金属或合金基体10，该基体10的合金材料可采用不锈钢、铝合金或钛合金；
以铬金属为靶材，通过溅射法于该基体10表面沉积一铬金属层12，该铬金属层12的厚度应控制在0.6-0.8微米之间；
以铬金属为靶材，以气态烃为溅射气源，通过溅射法于该铬金属层12表面沉积一碳化铬膜14，该碳化铬膜14的厚度应控制在2.5-3.0微米之间，同时控制碳化铬膜14中碳原子与铬原子的原子比为0.4-0.5。
其中所述气态烃可为甲烷、乙烷或丙烷等。

Claims (8)

1.一种壳体，该壳体包括一基体、一铬金属层及一碳化铬膜，该基体的材料为金属或合金，该铬金属层沉积于所述基体的表面，该碳化铬膜沉积于所述铬金属层的表面，其特征在于：所述铬金属层的厚度为0.6-0.8微米，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬膜中碳原子与铬原子的原子比为0.4-0.5。
2.如权利要求1所述的壳体，其特征在于：所述合金材料为不锈钢、铝合金或钛合金。
3.如权利要求1所述的壳体，其特征在于：该壳体是用于便携式电子装置外壳、钟表表带、钟表外壳或眼镜框架。
4.一种壳体的制作方法，其特征在于：该方法包括以下步骤：
提供一金属或合金基体；
于该基体表面沉积一铬金属层，所述铬金属层的厚度为0.6-0.8微米；
于该铬金属层表面沉积一碳化铬膜，所述碳化铬膜的厚度为2.5-3.0微米，所述碳化铬中碳原子与铬原子的原子比为0.4-0.5。
5.如权利要求4所述的壳体的制作方法，其特征在于：所述合金材料为不锈钢、铝合金或钛合金。
6.如权利要求5所述的壳体的制作方法，其特征在于：所述铬金属层是通过溅射法沉积，所述溅射法以铬金属为靶材。
7.如权利要求5所述的壳体的制作方法，其特征在于：所述碳化铬膜是通过溅射法沉积，所述溅射法以铬金属为靶材，以气态烃为溅射气源。
8.如权利要求7所述的壳体的制作方法，其特征在于：所述气态烃为甲烷、乙烷或丙烷。
CNB2005100354187A 2005-06-17 2005-06-17 壳体及制作方法 Expired - Fee Related CN100446642C (zh)

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US11/396,838 US20060286392A1 (en) 2005-06-17 2006-04-03 Housing and method for making the same

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CN101760740B (zh) * 2008-12-26 2012-07-25 及成企业股份有限公司 结合物理气相沉积及电着沉积的制作方法
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