CN100426479C - 搭接方法及其搭接装置 - Google Patents

搭接方法及其搭接装置 Download PDF

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Publication number
CN100426479C
CN100426479C CNB2004100858875A CN200410085887A CN100426479C CN 100426479 C CN100426479 C CN 100426479C CN B2004100858875 A CNB2004100858875 A CN B2004100858875A CN 200410085887 A CN200410085887 A CN 200410085887A CN 100426479 C CN100426479 C CN 100426479C
Authority
CN
China
Prior art keywords
substrate
resin
heater
installation component
installation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100858875A
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English (en)
Chinese (zh)
Other versions
CN1614760A (zh
Inventor
小林繁隆
大冢洋
山内朗
小池滋人
滨川健史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
International Display Technology Co Ltd
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Display Technology Co Ltd, Toray Engineering Co Ltd filed Critical International Display Technology Co Ltd
Publication of CN1614760A publication Critical patent/CN1614760A/zh
Application granted granted Critical
Publication of CN100426479C publication Critical patent/CN100426479C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/81005—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving a temporary auxiliary member not forming part of the bonding apparatus being a temporary or sacrificial substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
CNB2004100858875A 2003-11-07 2004-11-05 搭接方法及其搭接装置 Expired - Fee Related CN100426479C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003-378048 2003-11-07
JP2003378048 2003-11-07
JP2003378048A JP4001341B2 (ja) 2003-11-07 2003-11-07 ボンディング方法およびその装置

Publications (2)

Publication Number Publication Date
CN1614760A CN1614760A (zh) 2005-05-11
CN100426479C true CN100426479C (zh) 2008-10-15

Family

ID=34688561

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100858875A Expired - Fee Related CN100426479C (zh) 2003-11-07 2004-11-05 搭接方法及其搭接装置

Country Status (4)

Country Link
JP (1) JP4001341B2 (ja)
KR (1) KR101189290B1 (ja)
CN (1) CN100426479C (ja)
TW (1) TWI373078B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4687273B2 (ja) * 2005-06-23 2011-05-25 住友電気工業株式会社 電子部品の実装方法
JP4872291B2 (ja) * 2005-09-27 2012-02-08 住友電気工業株式会社 電極接続方法、電極接続装置、および配線板接合体の製造方法
KR100691810B1 (ko) 2006-02-17 2007-03-12 주식회사 나래나노텍 개선된 패턴 전극 본딩 장치
KR100734422B1 (ko) * 2006-03-08 2007-07-03 삼성전자주식회사 엘씨디용 본딩장치
CN102057475B (zh) * 2008-06-05 2013-01-02 住友电木株式会社 半导体装置的制造方法以及半导体装置
CN102204419A (zh) * 2008-10-31 2011-09-28 东丽株式会社 电子部件和挠性薄膜基板的接合方法及接合装置
KR101119541B1 (ko) * 2009-11-30 2012-02-22 (주)멜파스 Ａｃｆ본딩을 위한 압착 장치 및 상기 압착 장치의 동작 방법
JP2011199184A (ja) * 2010-03-23 2011-10-06 Fujifilm Corp 基板実装装置及び基板実装方法
US20160059201A1 (en) * 2013-03-15 2016-03-03 Nikon Corporation Biochip fixing method, biochip fixing device, and screening method for biomolecule array
TWI692044B (zh) * 2017-05-29 2020-04-21 日商新川股份有限公司 封裝裝置以及半導體裝置的製造方法
CN108475484B (zh) * 2017-06-22 2022-02-15 深圳市柔宇科技股份有限公司 承载装置和压合设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444918A (en) * 1987-08-13 1989-02-17 Konishiroku Photo Ind Production of liquid crystal display device
JPH07130795A (ja) * 1993-11-04 1995-05-19 Matsushita Electric Ind Co Ltd 半導体素子接続方法および半導体素子接続装置
JPH09297318A (ja) * 1996-03-06 1997-11-18 Seiko Epson Corp 液晶装置、液晶装置の製造方法および電子機器
CN1295265A (zh) * 1999-11-04 2001-05-16 精工爱普生株式会社 部件安装方法和电光装置的制造方法
JP2003303853A (ja) * 2002-02-05 2003-10-24 Toray Eng Co Ltd チップ実装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303851A (ja) * 2002-02-05 2003-10-24 Toray Eng Co Ltd チップ実装方法およびそれを用いた装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6444918A (en) * 1987-08-13 1989-02-17 Konishiroku Photo Ind Production of liquid crystal display device
JPH07130795A (ja) * 1993-11-04 1995-05-19 Matsushita Electric Ind Co Ltd 半導体素子接続方法および半導体素子接続装置
JPH09297318A (ja) * 1996-03-06 1997-11-18 Seiko Epson Corp 液晶装置、液晶装置の製造方法および電子機器
CN1295265A (zh) * 1999-11-04 2001-05-16 精工爱普生株式会社 部件安装方法和电光装置的制造方法
JP2003303853A (ja) * 2002-02-05 2003-10-24 Toray Eng Co Ltd チップ実装方法

Also Published As

Publication number Publication date
KR20050044257A (ko) 2005-05-12
CN1614760A (zh) 2005-05-11
TWI373078B (en) 2012-09-21
KR101189290B1 (ko) 2012-10-15
JP2005142397A (ja) 2005-06-02
JP4001341B2 (ja) 2007-10-31
TW200522238A (en) 2005-07-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: Kanagawa

Patentee after: Japanese Innolux Limited by Share Ltd of Japan

Patentee after: Tourara Engineering Co., Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: International Display Technology Co., Ltd.

Patentee before: Tourara Engineering Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081015

Termination date: 20161105