CN100412997C - Resin size used for chip resistor - Google Patents
Resin size used for chip resistor Download PDFInfo
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- CN100412997C CN100412997C CNB02149780XA CN02149780A CN100412997C CN 100412997 C CN100412997 C CN 100412997C CN B02149780X A CNB02149780X A CN B02149780XA CN 02149780 A CN02149780 A CN 02149780A CN 100412997 C CN100412997 C CN 100412997C
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- resin
- filler
- resin slurry
- chip resistor
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Abstract
The present invention relates to resin slurry used for a chip resistor, which comprises adhesive and filler, wherein the adhesive is a mixture formed in the organic solvent of phenolic resin and epoxy resin; the filler is one kind of white filler, black filler or precious metal powder. The resin slurry can be used for the secondary coating body, the marking body and the end electrode of the chip resistor, and can be completely cured under the condition of 160 to 250 DEG C without generating influence on the chip resistor body. In addition, a chip resistor with high resistance value and high accuracy can be manufactured.
Description
Technical field
The present invention relates to a kind of resin slurry, more particularly, the present invention relates to a kind of chip resistor low temperature curing resin slurry.
Background technology
Along with the skill upgrading of IT, 3C industries such as (communication, consumption, computers), more and more higher to the required precision of chip resistor.In the prior art, the slurry of secondary encapsulated member and signage and the slurry of termination electrode all adopt vitreum as bonding phase (being called glass paste), and wherein, the slurry of secondary encapsulated member and signage is formed and comprised inorganic pigment, frit and organic carrier; The slurry of termination electrode is formed and is comprised silver powder or other metal powders, frit and organic carrier.In order to increase adhesive force and to improve processing characteristics, must contain lead usually in the above-mentioned frit.When preparing these slurries, can evenly disperse through equipment such as three-high mills more earlier with its each component blending.
In the manufacture process of chip resistor, print secondary encapsulated member, signage and soak end-blocking electrode three process all after laser resistor trimming.Because existing glass paste need carry out sintering between 580～620 ℃, under this condition, the infiltration of secondary encapsulated member (vitreum) and high temperature make the internal structure of resistive element be affected, thereby resistance value is drifted about, thus at present the resistance accuracy of chip resistor be difficult to reach ± 1%.In addition, existing is that the slurry of bonding phase need be at sintering under the higher temperature with vitreum, and cost is higher, and contains the Pb element usually in the glass, does not meet environmental requirement.
Summary of the invention
At being that the slurry of bonding phase can cause the bigger problem of resistance value drift in making the process of chip resistor with vitreum in the prior art, the invention provides a kind of resin slurry that can solidify at low temperatures.This resin slurry can be used for secondary encapsulated member, signage and the termination electrode of chip resistor, and will full solidification under 160～250 ℃ condition, can not exert an influence to the internal structure of plate resistor body, thereby can produce the very high sheet resistance of resistance accuracy.
The low temperature curing resin slurry that is used for chip resistor provided by the invention comprises filler and adhesive, wherein, filler is to be selected from a kind of in white filler, black filler or the noble metal powder, and adhesive is the mixture that phenolic resins and epoxy resin form in organic solvent.In resin slurry of the present invention, by weight percentage, the content of each component is: phenolic resins 2-16%, epoxy resin 1-14%, organic solvent 10-55%, filler 25-75%.
Above-mentioned epoxy resin is meant the compound that contains two or more epoxide groups in the molecule.So-called epoxide group is by an oxygen atom and two rings that carbon atom is formed, the activity that it has height, make epoxy resin can with polytype curing agent generation cross-linking reaction, form the high polymer of tridimensional network.In the present invention, the main purpose of using epoxy resin is to improve adhesion, and increases the antiacid alkali ability of chip resistor.
Above-mentioned phenolic resins is phenol and the aldehyde product that condensation generates in the presence of catalyst.Wherein, the phenolic resins of heat cured butanol etherification is the condensation voluntarily by the methylol of unetherified methylol and hexyl etherization (separating out butanols), or with other contain hydroxyl resin condensation reaction and make.Among the present invention, the main purpose of using phenolic resins is to improve the processing performance of resin slurry, makes it easy to processing.
Stick performance and processing characteristics for what improve resin slurry, in resin slurry of the present invention, can also add other thermosetting or the thermoplastic resin of 2-16%.
After preferred, contain the composition of following percentage by weight in the resin slurry of the present invention: phenolic resins 4-12%, epoxy resin 2-10%, other thermosetting or thermoplastic resin filler 4-14%, organic solvent 12-52%, filler 30-70%.
Other thermosetting or thermoplastic resin recited above comprises: acrylic resin, mylar, polyvinyl butyral resin, organic siliconresin, amino resins, polyurethane etc., preferably polyethylene butyral resin, organic siliconresin and/or amino resins.
Black filler used in the resin slurry of the present invention comprises carbon black and Al
2O
3, SiO
2, in the talcum powder, mica powder one or more, described carbon black can be a colour black; Used white filler comprises TiO
2And CaCO
3, Al
2O
3, SiO
2, in the talcum powder, mica powder one or more; Used noble metal powder is the powder of gold, silver, platinum, palladium or its alloy.Described white filler is mainly used in signage; Described black filler is mainly used in the secondary encapsulated member; Described noble metal powder is mainly used in termination electrode.
Among the present invention used organic solvent can be arbitrarily, solvent that can dissolving resin.But in order to make above-mentioned resin slurry have suitable rheological property, to satisfy the technological requirement in the chip resistor production process, simultaneously also in order to reduce the raising of resin slurry in operation of rolling medium viscosity, to improve processing characteristics, therefore, preferentially select those to have the organic solvent of excellent dissolution performance for various resins in the present invention.For example, the organic solvent that is adopted in the resin slurry of the present invention can be an esters solvent, as: ethyl acetate, butyl acetate, ethylene glycol ether acetate, 2-Butoxyethyl acetate, diethylene glycol monobutyl ether acetate etc.; Alcohols solvent is as butanols, hexanol, terpinol etc.; And ketones solvent, as acetone, butanone, cyclohexanone etc.Preferred 2-Butoxyethyl acetate and/or diethylene glycol monobutyl ether acetate.
Resin slurry provided by the present invention can be used in the existing manufacturing technique.Be each component in the resin slurry after mixing, utilize three-roll grinder fully to grind, reach certain fineness requirement and get final product.In producing the chip resistor process, adopt resin slurry of the present invention and adopt existing glass paste to have one significantly different, be that resin slurry of the present invention does not need sintering, only need under 160～250 ℃ of conditions, to solidify to get final product, preferably solidify down at 180～220 ℃; Other technological requirement is basically identical then.Wherein, secondary packaging slurry and sign slurry can adopt mode, the terminal electrode paste of silk screen printing can adopt the dip coating mode to finish.
Adopt resin slurry of the present invention than adopting existing resin slurry to have lot of advantages.Because resin slurry of the present invention does not need hot setting, thereby its chip resistor that makes has higher resistance accuracy; Simultaneously, low-temperature setting also helps energy savings, can reduce the production cost of chip resistor.In addition, poisonous element such as not leaded in the resin slurry of the present invention, cadmium can satisfy environmental protection requirement better.Having listed the performance that adopts common glass paste (need carry out high temperature sintering) and the chip resistor that adopts resin slurry of the present invention to make to carry out in the table 1 compares.As seen from Table 1, adopt low-temperature setting, avoided of the influence of sintering slurry, can produce high-precision product the resistive element resistance; And the chip resistor that adopts resin slurry of the present invention to make to electroplate the back outward appearance good, the termination pulling force, can, performance such as soldering resistance all satisfies instructions for use.
Table 1
| Project name | The chip resistor that existing glass paste is made | The chip resistor that resin slurry of the present invention is made |
| Technological temperature | 580～620 ℃ | 160～250 ℃ |
| Plating back outward appearance | Well | Well |
| Termination pulling force (the Al2O3 substrate: 2 * 2mm figure is surveyed pulling force) | 〉=4LB | 〉=4LB |
| Solderability (235 ± 5 ℃, 2 ± 0.5 seconds) | Qualified. | Qualified. |
| Soldering resistance (260 ± 5 ℃, 10 ± 1 seconds) | Qualified. | Qualified. |
| The resistance deviation | ± 1%～± 5% | ＜± 1% |
Embodiment
Existing associative list 2 and table 3 explanation most preferred execution mode of the present invention, in the table 2, thermosetting or thermoplastic resin that embodiment 1,2,7,8,13,14 adopts are polyvinyl butyral resins, the black filler is colour black and Al
2O
3Mix and make by 1: 4 weight ratio, white filler is TiO
2And CaCO
3Mix and make by 1: 2 weight ratio; Thermosetting or thermoplastic resin that embodiment 3,4,9,10,15,16 adopts are organic siliconresins, and the black filler is colour black and SiO
2Mix and make by 1: 4 weight ratio, white filler is TiO
2And Al
2O
3Mix and make by 1: 2 weight ratio; Thermosetting or thermoplastic resin that embodiment 5,11,17 adopts are amino resins, and the black filler is that colour black and talcum powder mix by 1: 4 weight ratio and make, and white filler is TiO
2And SiO
2Mix and make by 1: 2 weight ratio.
Mixture, the solvent of phenolic resins, epoxy resin, thermosetting or thermoplastic resin are mixed with percentage by weight by the prescription in the table 2 with black filler, white filler, silver powder respectively, and fully grind, make resin slurry with three-roll grinder.Wherein the secondary encapsulated member is seen embodiment 1-6 with resin slurry; Signage is seen embodiment 7-12 with resin slurry; Termination electrode is seen embodiment 13-18 with resin slurry.
In the resin slurry that makes by above-mentioned prescription, make chip resistor respectively, and check its performance (not comprising embodiment 6,12 and 18 prepared products) as shown in table 3.
Table 2
Table 3
| Production code member | Plating back outward appearance | The resistance deviation | But soldering resistance after the plating | The termination pulling force |
| 1 | Well | ＜±1％ | Qualified | ≥5.0LB |
| 2 | Generally | ＜±1％ | Qualified | ≥5.3LB |
| 3 | Well | ＜±1％ | Defective | ≥4.0LB |
| 4 | Well | ＜±1％ | Qualified | ≥4.2LB |
| 5 | Generally | ＜±1％ | Qualified | ≥4.0LB |
| 7 | Well | ＜±1％ | Qualified | ≥4.0LB |
| 8 | Well | ＜±1％ | Qualified | ≥5.3LB |
| 9 | Well | ＜±1％ | Qualified | ≥4.9LB |
| 10 | Generally | ＜±1％ | Qualified | ≥4.2LB |
| 11 | Well | ＜±1％ | Defective | ≥6.0LB |
| 13 | Well | ＜±1％ | Qualified | ≥4.5LB |
| 14 | Well | ＜±1％ | Qualified | ≥4.8LB |
| 15 | Well | ＜±1％ | Qualified | ≥5.0LB |
| 16 | Well | ＜±1％ | Qualified | ≥5.2LB |
| 17 | Well | ＜±1％ | Qualified | ≥5.5LB |
Claims (11)
1. resin slurry that is used for chip resistor, comprise adhesive and filler, it is characterized in that: described adhesive is the mixture that phenolic resins and epoxy resin form in organic solvent, and described filler is a kind of in white filler, black filler or the noble metal powder; Each component is respectively by weight percentage in the described resin slurry: phenolic resins 2-16%, epoxy resin 1-14%, organic solvent 10-55%, filler 25-75%.
2. resin slurry according to claim 1 is characterized in that: by weight percentage, also contain in the described resin slurry 3-16%, other thermosetting or thermoplastic resin.
3. resin slurry according to claim 2, it is characterized in that: by weight percentage, consisting of of described resin slurry: described phenolic resins 4-12%, described epoxy resin 3-10%, described other thermosetting or thermoplastic resin filler 4-14%, described organic solvent 14-50%, described filler 30-70%.
4. resin slurry according to claim 2 is characterized in that: described other thermosetting or thermoplastic resin is in acrylic resin, mylar, polyvinyl butyral resin, organic siliconresin, amino resins, the polyurethane one or more.
5. resin slurry according to claim 4 is characterized in that: described other thermosetting or thermoplastic resin is polyvinyl butyral resin, organic siliconresin and/or amino resins.
6. resin slurry according to claim 1 is characterized in that: described black filler is by carbon black and Al
2O
3, SiO
2, the mixture that forms of one or more compounds in the talcum powder, mica powder.
7. resin slurry according to claim 1 is characterized in that: described white filler is by TiO
2With CaCO
3, Al
2O
3, SiO
2, the mixture that forms of one or more compounds in the talcum powder, mica powder.
8. resin slurry according to claim 1 is characterized in that: described noble metal powder is the powder of a kind of or its alloy formation in gold, silver, platinum, the palladium.
9. resin slurry according to claim 1 is characterized in that: described organic solvent is ester class, alcohols or ketones solvent.
10. resin slurry according to claim 9 is characterized in that: described organic solvent is 2-Butoxyethyl acetate and/or diethylene glycol monobutyl ether acetate.
11. according to the described resin slurry of aforementioned arbitrary claim, it is characterized in that: described resin slurry can be 160～250 ℃ of curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB02149780XA CN100412997C (en) | 2002-12-30 | 2002-12-30 | Resin size used for chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB02149780XA CN100412997C (en) | 2002-12-30 | 2002-12-30 | Resin size used for chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1512522A CN1512522A (en) | 2004-07-14 |
| CN100412997C true CN100412997C (en) | 2008-08-20 |
Family
ID=34233790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB02149780XA Expired - Fee Related CN100412997C (en) | 2002-12-30 | 2002-12-30 | Resin size used for chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100412997C (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864251B (en) * | 2010-06-28 | 2013-01-02 | 彩虹集团公司 | Organic adhesive for electrode paste of silicon solar cell and preparation method thereof |
| CN102757755B (en) * | 2012-07-17 | 2013-12-04 | 湖南高华环保股份有限公司 | Preparation method for high-temperature resistant, leak-proof and corrosion-resistant adhesive |
| CN103059512B (en) * | 2013-01-28 | 2015-06-17 | 肇庆风华元器件配套有限公司 | Resin protective sizing agent and preparation method thereof |
| CN103632781B (en) * | 2013-12-13 | 2016-08-24 | 深圳顺络电子股份有限公司 | Slice component termination packaging slurry and the preparation method of slice component |
| CN106560489A (en) * | 2016-07-14 | 2017-04-12 | 西安英诺维特新材料有限公司 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
| CN107275018A (en) * | 2017-05-16 | 2017-10-20 | 东莞市晴远电子有限公司 | A kind of noninductive resistance and the High-heat-conductiviinsulation insulation material for the noninductive resistance |
| CN107331624B (en) * | 2017-05-27 | 2021-01-22 | 广东风华高新科技股份有限公司 | Packaging method and packaging equipment for chip component |
| CN108500856B (en) * | 2018-03-28 | 2021-01-08 | 江苏瑞和磨料磨具有限公司 | Desizing-free slurry for abrasive cloth base cloth, abrasive cloth and preparation method thereof |
| CN108912611A (en) * | 2018-07-09 | 2018-11-30 | 西安英诺维特新材料有限公司 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
| CN109036637B (en) * | 2018-09-17 | 2020-05-19 | 湖南利德电子浆料股份有限公司 | Low-temperature resistance silver paste, and preparation method and application thereof |
| CN111056772A (en) * | 2019-12-09 | 2020-04-24 | 广东意杰科技有限公司 | High-strength cement resistance encapsulating material and processing technology thereof |
| CN113913132A (en) * | 2021-07-06 | 2022-01-11 | 深圳博林新材料科技有限公司 | General plastic elastomer in-mold forming adhesive |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1132771A (en) * | 1995-04-06 | 1996-10-09 | 张宝砚 | Quick drying resin putty |
| JP2000322933A (en) * | 1999-05-14 | 2000-11-24 | Hitachi Chem Co Ltd | Conductive paste and its manufacture |
-
2002
- 2002-12-30 CN CNB02149780XA patent/CN100412997C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1132771A (en) * | 1995-04-06 | 1996-10-09 | 张宝砚 | Quick drying resin putty |
| JP2000322933A (en) * | 1999-05-14 | 2000-11-24 | Hitachi Chem Co Ltd | Conductive paste and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1512522A (en) | 2004-07-14 |
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