CN106560489A - Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof - Google Patents
Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof Download PDFInfo
- Publication number
- CN106560489A CN106560489A CN201610553889.5A CN201610553889A CN106560489A CN 106560489 A CN106560489 A CN 106560489A CN 201610553889 A CN201610553889 A CN 201610553889A CN 106560489 A CN106560489 A CN 106560489A
- Authority
- CN
- China
- Prior art keywords
- organic
- slurry
- percentage
- viscosity
- plate resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to an organic secondary encapsulation slurry for sheet-type resistors, and a preparation method thereof, wherein the organic secondary encapsulation slurry at least contains, by weight, 10-30% of a black pigment, 30-50% of an oxide, 5-10% of an organic resin, and 30-50% of an organic resin, and mixing stirring and rolling with a three-roller grinder are performed to obtain the product. According to the present invention, the organic encapsulation slurry has advantages of good adhesion, good chemical stability, good stability, room temperature storage, and strong competitiveness and broad market prospects in the sheet-type resistor industry.
Description
Technical field
The invention belongs to electric slurry and preparation method, more particularly to a kind of plate resistor secondary packaging slurry and preparation
Method.
Background technology
Electric slurry is one of basic material of electronic component products, and the core for being also electronic devices and components constitutes part,
Decisive role is played to electronic product performance, and plate resistor has developed very swift and violent row since being electronic devices and components 21 century
One of industry, due to its it is light, little, thin the characteristics of, lead electronic product to miniaturization, precise treatment, Intellectualized Tendency development.
The composition of plate resistor as shown in figure 1, as seen from the figure, Core Feature layer --- resistance of the encapsulated layer to plate resistor
Layer serves protection, therefore, the performance of the product serves key effect to the stability of plate resistor components and parts.It is secondary in early days
Packaging slurry adopts unorganic glass slurry, stable performance, but due to increased the sintering number of plate resistor, so as to increased product
Product cost, due to cost in terms of demand, with development in science and technology, gradually replaced by organic ink, organic ink only need 200 DEG C baking
Solidization, energy saving is cost-effective.In addition, secondary encapsulated layer is determined in plate resistor production resistance（Laser resistor trimming）
Printing afterwards is got on, therefore, in the product drying course impact can not be produced on the resistance of plate resistor, otherwise, will produce
Go out the scrap that cannot be repaired, so as to bring massive losses to plate resistor production.
Because secondary packaging slurry requires higher to technical, each big owners of private enterprises of current chip industry will adopt Korea
The product of NAMICS, Technical comparing of the said firm in terms of organic ink product is ripe, should early in the involved sixties in last century
Industry, and quickly grow, with monopolistic advantage.
The present invention is researched and developed for the two major features of secondary packaging slurry, specific as follows：
（1）The product belongs to organic ink, and its solvent, resin are that low temperature is used, so, product need to be stored at low temperature, and one
As -10 DEG C of storage temperature～0 DEG C, normal temperature Use Limitation is relatively low, therefore, the present invention is studied for storage temperature；
（2）After the 200 DEG C of solidifications of secondary packaging slurry, wet-hot aging performance need to meet requirement：90 DEG C of temperature, humidity 90%.
The content of the invention
It is an object of the present invention to provide one kind can be in normal temperature（5 DEG C～20 DEG C）The organic secondary packaging slurry of lower storage, the product
The characteristics of product have environmental protection, excellent performance, prepare simple.
A kind of plate resistor of the present invention, with organic secondary packaging slurry, is 10～30% black including at least percentage by weight
Color pigment, 30～50% oxides, 5～10% organic resins, 30～50% organic solvents, through mixing, three-roll grinder roller
Roll and form.
Described organic ink, the also filler including percentage by weight less than 2%, typically using ultra-fine carbon dust, granularity one
As in 100nm or less；
When in use, its fineness should be controlled in no more than 15 m described organic ink；
In described organic ink, black pigment is inorganic black pigments conventional on the market, and content is not more than 30%；
In described organic ink, oxide is generally one or two in silica and aluminum oxide, and its total content is not more than
50%；
In described organic ink, organic resin is generally one kind in phenolic resin, epoxy resin and resin curing agent or many
Plant content and be less than 10%；
In described organic ink, organic solvent is typically using in butyl carbitol, butyl carbitol acetate, terpinol etc.
One or more.
The organic ink preparation method of the present invention, comprises the following steps：
（1）Percentage by weight according to each component weighs each raw material, is thoroughly mixed；
（2）It is using three-roll grinder, the powder body material in proportioning is dispersed in organic carrier, it is general using progressively upper pressure
Rolling method；
（3）The slurry that rolling is completed is crossed into 200 eye mesh screens, tinning is detected.
The fineness of described organic secondary packaging slurry is 10～15 m, and viscosity is 40～90Pas.
In the present invention black pigment primarily serve cover functional layer effect, the too high cost that increased product of its content,
Can also harmful effect be produced to the intensity of solidifying film layer, content is too low, then cannot play the effect of covering simultaneously.
The effect that oxide and filler in the present invention has to be increased solidification film-strength, support film layer, oxide content is too
Less, thicknesses of layers and intensity are difficult to meet and require, it is impossible to play covering and defencive function layer（Resistive layer）Effect, content is too
Height, easy product powder after solidification affects film layer outward appearance, increases film layer roughness, and film strength can be affected on the contrary.Therefore,
Outside control oxide content can reach film strength, filling effect can be played to film layer by adding filler, so that
Film layer reaches required thickness.
Organic resin in the present invention can make powder body material and matrix material（Generally glassy layer）Combine well, make film
Layer adhesive force reaches necessary requirement, while moisture-proof thermal environment（90 DEG C of temperature, humidity 90%）Corrode.
Organic solvent in the present invention can be such that powder body material and resin mixes well, dispersed, and plate resistor is produced
Product printing effect serves good effect.The selection of organic solvent and resin, it is not only steady to product printing and physical chemistry
It is qualitative to serve key effect and significant to the storage of product.
The advantage and feature of the present invention：
（1）Not only there is the organic secondary packaging slurry of plate resistor in the present invention good adhesive force and moisture-proof thermal environment to invade
Erosion ability, and its storage temperature is 5～20 DEG C, and more traditional organic ink is high（Generally -10 DEG C～0 DEG C）, this is for piece
Formula resistance production cost and production operation have obvious improvement；
（2）As ordinary electronic slurry production process, process is simple is easy to operate；
（3）Encapsulate suitable for traditional Chip-R, be equally applicable to the electronic devices and components such as chip exclusion, thick film circuit；
（4）After the product solidification, cured film is in moisture-proof thermal environment（90 DEG C of temperature, humidity 90%）Middle long-time（Generally 1000h）
Storage, its adhesive force still keeps good.
Description of the drawings
Fig. 1. plate resistor cross-sectional view；
Fig. 2. preparation process figure of the present invention.
Specific embodiment
Below by instantiation, the present invention is expanded on further.It should be understood that following examples are merely to illustrate the present invention,
Rather than restriction the scope of the present invention.
Slurry will be prepared into according to the flow process of accompanying drawing 2 with spreading mass, through detection packaging, you can use for client.
Experimental performance method of testing：
1. substrate prepares：The printed glass slurry on 96% aluminum oxide substrate（Generally packaging slurry of plate resistor）, dry
It is standby after dry, 600 DEG C of sintering；
2. on above-mentioned 1 substrate for preparing, slurry prepared by the printing present invention dries 10min, 200 DEG C of solidification 30min in 110,
Prepare testing sample；
3. the print to be measured in above-mentioned 2 is put into into 90 DEG C of temperature, in the environment of humidity 90%, after 1000h, is taken out, be dried moisture, used
Whether 3M tape pulls, observation film layer comes off；
4. the slurry sealing for being prepared by the present invention, is placed in 55 DEG C of environment lower three days（Simulation logistics transportation harsh conditions）, test specimens
Whether product viscosity changes；
5. slurry prepared by the present invention is placed in into that 5～20 DEG C of environment are lower 3 months, whether test sample viscosity changes.
Experimental test result is contrasted：
By the slurry sample prepared by the present invention and NAMICS companies of Korea production main product --- 1036 carry out performance survey
Examination contrast, it is specific as follows：
By contrast as can be seen that the plate resistor of present invention development is with organic secondary packaging slurry, not only on basic property
It is consistent with import main product performance, also surmount in terms of ambient storage.
Claims (5)
1. a kind of plate resistor is with organic secondary packaging slurry, including at least percentage by weight be 10～30% black pigments, 30～
50% oxide, 5～10% organic resins, 30～50% organic solvents, through mixing, three-roll grinder rolling is formed.
2. with organic secondary packaging slurry, its feature is a kind of plate resistor according to claim 1：Also include also wrapping
Include filler of the percentage by weight less than 2%.
3. the organic ink preparation method of the present invention, comprises the following steps：
Percentage by weight according to each component weighs each raw material, is thoroughly mixed；
It is using three-roll grinder, the powder body material in proportioning is dispersed in organic carrier, it is general to adopt what is progressively above pressed
Rolling method；
The slurry that rolling is completed is crossed into 200 eye mesh screens, tinning is detected.
4. the organic ink according to prepared by claim 3, its feature is：Fineness be 10～15 m, viscosity be 40～
90Pa·s。
5. the slurry for being prepared according to claim 3, in use（After 200 DEG C of solidifications）, the feature that should have is as follows：
5～20 DEG C of the organic ink storage temperature is stored 3 months, and viscosity, outward appearance should be unchanged；
The organic ink is stored three days under 55 DEG C of environment, and viscosity, outward appearance should be unchanged；
Its solidifying film layer places 1000h in 90 DEG C of temperature under the environment of humidity 90%, adhesive force, outward appearance should be unchanged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553889.5A CN106560489A (en) | 2016-07-14 | 2016-07-14 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553889.5A CN106560489A (en) | 2016-07-14 | 2016-07-14 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106560489A true CN106560489A (en) | 2017-04-12 |
Family
ID=58485667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610553889.5A Pending CN106560489A (en) | 2016-07-14 | 2016-07-14 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106560489A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108117665A (en) * | 2017-12-19 | 2018-06-05 | 西安宏星电子浆料科技有限责任公司 | Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof |
| CN108912611A (en) * | 2018-07-09 | 2018-11-30 | 西安英诺维特新材料有限公司 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
| CN111223620A (en) * | 2020-01-10 | 2020-06-02 | 广东风华高新科技股份有限公司 | Sheet type precision film exclusion and manufacturing method thereof |
| CN114464347A (en) * | 2022-04-13 | 2022-05-10 | 西安宏星电子浆料科技股份有限公司 | Temperature-resistant anti-aging insulating medium slurry and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101217067A (en) * | 2007-12-27 | 2008-07-09 | 广州市儒兴科技开发有限公司 | A lead free aluminum electrode slurry of PTC thermo-sensitive resistor and preparation method |
| CN101615637A (en) * | 2009-07-08 | 2009-12-30 | 西安交通大学苏州研究院 | Electrode of solar battery forms with slurry and preparation method thereof |
| CN102558764A (en) * | 2010-12-14 | 2012-07-11 | 西安布瑞斯电子科技有限责任公司 | High-adhesion humidity-resistant organic polymer slurry |
-
2016
- 2016-07-14 CN CN201610553889.5A patent/CN106560489A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101217067A (en) * | 2007-12-27 | 2008-07-09 | 广州市儒兴科技开发有限公司 | A lead free aluminum electrode slurry of PTC thermo-sensitive resistor and preparation method |
| CN101615637A (en) * | 2009-07-08 | 2009-12-30 | 西安交通大学苏州研究院 | Electrode of solar battery forms with slurry and preparation method thereof |
| CN102558764A (en) * | 2010-12-14 | 2012-07-11 | 西安布瑞斯电子科技有限责任公司 | High-adhesion humidity-resistant organic polymer slurry |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108117665A (en) * | 2017-12-19 | 2018-06-05 | 西安宏星电子浆料科技有限责任公司 | Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof |
| CN108912611A (en) * | 2018-07-09 | 2018-11-30 | 西安英诺维特新材料有限公司 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
| CN111223620A (en) * | 2020-01-10 | 2020-06-02 | 广东风华高新科技股份有限公司 | Sheet type precision film exclusion and manufacturing method thereof |
| CN111223620B (en) * | 2020-01-10 | 2022-04-22 | 广东风华高新科技股份有限公司 | Sheet type precision film exclusion and manufacturing method thereof |
| CN114464347A (en) * | 2022-04-13 | 2022-05-10 | 西安宏星电子浆料科技股份有限公司 | Temperature-resistant anti-aging insulating medium slurry and preparation method thereof |
| CN114464347B (en) * | 2022-04-13 | 2022-07-08 | 西安宏星电子浆料科技股份有限公司 | Temperature-resistant anti-aging insulating medium slurry and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106560489A (en) | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof | |
| Tybrandt et al. | Fast and efficient fabrication of intrinsically stretchable multilayer circuit boards by wax pattern assisted filtration | |
| CN101570662B (en) | High-temperature and high-moisture resistant coating for metalster and preparation method thereof | |
| CN106833113B (en) | Ink suitable for glass hot bending forming and application of ink in mobile phone | |
| TW201943809A (en) | Conductive composition for molding film, molding film, molded body and method of manufacturing molded body | |
| CN106661345A (en) | Thermal control coatings | |
| RU2011127065A (en) | PIGMENT-FORMING FILMS AND COATING SYSTEM INCLUDING THEM | |
| CN105764701A (en) | Rotary printing method | |
| CN108039225A (en) | Environment-friendly type low resistance graphene carbon fiber conductive carbon paste and preparation method thereof | |
| CN103865423B (en) | A kind of two-step preparation of high-performance conductive Pressuresensitive Tape | |
| CN109003699A (en) | A kind of plate resistor resistance slurry and preparation method thereof | |
| CN104559880B (en) | A kind of low cost nano-silver conductive glue of crystal oscillator encapsulation and preparation method thereof | |
| CN102324265A (en) | Single-layer silver paste for annular varistor and method for preparing single-layer silver paste | |
| CN107622809A (en) | A kind of copper electrode paste and preparation method thereof | |
| CN105706189B (en) | Electronic component and its manufacturing method | |
| CN107849371A (en) | Transparent conducting coating | |
| Philip et al. | The impact of solvent characteristics on performance and process stability of printed carbon resistive materials | |
| CN110444316A (en) | A kind of highly conductive, low silver content low-temperature cured conductive silver paste and preparation method thereof | |
| CN201736486U (en) | Antistatic release film | |
| CN104464992B (en) | Method for preparing functional slurry of chip-type static suppressor | |
| CN109192396A (en) | A kind of preparation method of anti-oxidative conductive silver paste thick-film material | |
| CN114231126A (en) | Secondary encapsulation slurry for small micro chip resistor and preparation method of encapsulation layer of secondary encapsulation slurry | |
| CN104774512B (en) | A kind of preparation method of high-performance environment protection type electrically-conducting paint | |
| CN109036635A (en) | High dispersive conductive silver paste | |
| CN109535938A (en) | A kind of antistatic powdery paints |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170412 |
|
| WD01 | Invention patent application deemed withdrawn after publication |