CN108912611A - A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage - Google Patents
A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage Download PDFInfo
- Publication number
- CN108912611A CN108912611A CN201810744394.XA CN201810744394A CN108912611A CN 108912611 A CN108912611 A CN 108912611A CN 201810744394 A CN201810744394 A CN 201810744394A CN 108912611 A CN108912611 A CN 108912611A
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- China
- Prior art keywords
- organic
- slurry
- room temperature
- temperature storage
- plate resistor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The present invention relates to a kind of plate resistor organic packaging slurry and preparation methods suitable for room temperature storage to be made by weight percentage of following raw materials according：5%-10% black pigment, 10%-20% superfine silicon dioxide, 10%-20% ultra-fine alumina, 1%-5% adhesion promoter, 0.5%-1% defoaming agent, 0.5%-1% levelling agent, the first organic carrier of 20%-40%, the second organic carrier of 30%-40%.A kind of organic packaging slurry of plate resistor suitable for room temperature storage of the invention, adds adhesion promoter in the feed, the adhesive force of slurry can be improved；Modified resin favorable solubility in commonly using low solvent flashing, there is promotion to the performance of slurry, such as cured film adhesive force, wet-hot aging performance is good, and low voc solvent is added in raw material, it is more preferably than solvent used by traditional organic packaging slurry to be stored in room temperature, meanwhile simultaneously no significant difference, heat resistance are excellent for traditional performance and traditional slurry, after slurry curing of the invention, film layer consistency is obviously excellent.
Description
Technical field
The present invention relates to technical field of electrical components, in particular to a kind of organic packet of plate resistor suitable for room temperature storage
Slurry seal material.
Background technique
Encapsulated layer to plate resistor core function layer --- resistive layer plays a protective role, therefore, the property of packaging slurry
Key effect can be played to the stability of plate resistor component.Existing packaging slurry is cryo-conservation, storage temperature
Generally at 0 DEG C hereinafter, mainly volatilizing at normal temperature comparatively fast due to preparing the organic carrier of slurry.Therefore, existing encapsulating slurry
Material needs mating special refrigeration equipment in storage, storage condition and condition of storage are required it is high, and then cause storage at
This is big, such as encounters temperature change, will lead to slurry failure and is not available.
Summary of the invention
For the defect and problem in the presence of above-mentioned background technique, the purpose of the present invention is to provide one kind to be suitable for room temperature
The organic packaging slurry of the plate resistor of storage, the product can be stored at normal temperature, and storage cost is low, and properties of product are excellent
It is different.
In order to achieve the above object, the present invention provides the following technical solutions：
A kind of organic packaging slurry of plate resistor suitable for room temperature storage of the invention, by weight percentage, by following
Raw material is made：5%-10% black pigment, 10%-20% superfine silicon dioxide, 10%-20% ultra-fine alumina, 1%-5% are attached
Adhesion promoter, 0.5%-1% defoaming agent, 0.5%-1% levelling agent, the first organic carrier of 20%-40%, 30%-40%
Two organic carriers.Adhesion promoter is added in the feed, and the adhesive force of slurry can be improved.
Further, first organic carrier and the second organic carrier are made of modified resin and organic solvent.
Further, the modified resin be modified epoxy, o-cresol modified epoxy or phenol-formaldehyde resin modified,
Modified resin favorable solubility in commonly using low solvent flashing has promotion to the performance of slurry, such as cured film adhesive force, wet-heat resisting
It is functional.
Further, the organic solvent is that butanol, butyl carbitol, terpinol, ethylene glycol ether acetate, butyl are molten
One of fine agent acetate, butyl carbitol acetate are a variety of.Above-mentioned solvent belongs to low voc solvent, than traditional
Solvent used by organic packaging slurry is preferably to be stored in room temperature.
Further, the preparation method of first organic carrier and the second organic carrier is as follows：Raw material is placed in glass
In container, be stirred at 60 DEG C -80 DEG C, mix 60-90min, it is to be mixed uniformly after, it is cooling, stand.
The present invention also provides a kind of preparation method of organic packaging slurry of plate resistor suitable for room temperature storage, preparations
Step includes：
After mixing by the raw material of formula ratio, it is fully ground uniformly through three-roll grinder, the fineness after grinding is 15 micro-
Rice.
Compared with the prior art, the present invention has the following advantages：
One of present invention is suitable for the organic packaging slurry of plate resistor of room temperature storage, adds adhesive force in the feed
Promotor, can be improved the adhesive force of slurry, and modified resin favorable solubility in commonly using low solvent flashing has the performance of slurry
It is promoted, such as cured film adhesive force, wet-hot aging performance is good；Low voc solvent is added in raw material, is starched than traditional organic encapsulating
Solvent used by expecting is preferably to be stored in room temperature, meanwhile, simultaneously no significant difference, heat resistance are excellent for traditional performance and traditional slurry
Different, after slurry curing of the invention, film layer consistency is obviously excellent.
Detailed description of the invention
Fig. 1 is the microscope figure of packaging slurry cured film of the present invention；
Fig. 2 is the microscope figure of tradition slurry encapsulating material cured film figure.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution of the present invention is clearly and completely described, it is clear that
Described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the implementation in the present invention
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The scope of protection of the invention.
Embodiment 1
A kind of organic packaging slurry of plate resistor suitable for room temperature storage of the embodiment of the present invention 1, by weight percentage,
It is made of following raw materials according：8% black pigment, 20% micro silica, 15% ultra-fine alumina, 1% adhesion promoter,
0.5% defoaming agent, 0.5% levelling agent, the 25% the first organic carriers, the first organic carrier by 85% butyl carbitol acetate and
15% modified epoxy is made, and the 30% the second organic carriers, the second organic carrier is by 28% terpinol, 22% butyl carbitol
Acetate and 50% o-cresol modified epoxy are made.
The preparation method of first organic carrier is as follows：Weigh the butyl carbitol acetate and modified epoxy of formula ratio
Resin is placed in glass container, and 70 DEG C are heated in water bath, is stirred, mix 70min, it is to be mixed uniformly after, it is cold
But, stand, dissolution finished product is faint yellow translucent viscous liquid.
The preparation method of second organic carrier is as follows：Weigh the terpinol of formula ratio, butyl carbitol acetate and
O-cresol modified epoxy is placed in glass container, and 80 DEG C are heated in water bath, is stirred, and mixes 80min, to
After mixing, cooling, standing, dissolution finished product are the translucent viscous liquid of brown color.
The plate resistor suitable for room temperature storage is as follows with the preparation method of organic packaging slurry：By the raw material of formula ratio
After mixing, it is fully ground uniformly through three-roll grinder, the fineness after grinding is 15 microns.
Embodiment 2
A kind of organic packaging slurry of plate resistor suitable for room temperature storage of the embodiment of the present invention 1, by weight percentage,
It is made of following raw materials according：8% black pigment, 15% micro silica, 20% ultra-fine alumina, 2% adhesion promoter,
0.5% defoaming agent, 1% levelling agent, the 25% the first organic carriers, the first organic carrier by 85% butyl carbitol acetate and
15% modified epoxy is made, and the 28.5% the second organic carriers, the second organic carrier must by 28% terpinol, 22% butyl card
Alcohol acetate and 50% o-cresol modified epoxy are made.
The preparation method of first organic carrier is as follows：Weigh the butyl carbitol acetate and modified epoxy of formula ratio
Resin is placed in glass container, and 80 DEG C are heated in water bath, is stirred, mix 80min, it is to be mixed uniformly after, it is cold
But, stand, dissolution finished product is faint yellow translucent viscous liquid.
The preparation method of second organic carrier is as follows：Weigh the terpinol of formula ratio, butyl carbitol acetate and
O-cresol modified epoxy is placed in glass container, and 80 DEG C are heated in water bath, is stirred, and mixes 90min, to
After mixing, cooling, standing, dissolution finished product are the translucent viscous liquid of brown color.
The plate resistor suitable for room temperature storage is as follows with the preparation method of organic packaging slurry：By the raw material of formula ratio
After mixing, it is fully ground uniformly through three-roll grinder, the fineness after grinding is 15 microns.
Embodiment 3
A kind of organic packaging slurry of plate resistor suitable for room temperature storage of the embodiment of the present invention 1, by weight percentage,
It is made of following raw materials according：8% black pigment, 20% micro silica, 20% ultra-fine alumina, 4% adhesion promoter, 1%
Defoaming agent, 0.5% levelling agent, the 26.5% the first organic carriers, the first organic carrier by 85% butyl carbitol acetate and
15% modified epoxy is made, and the 20% the second organic carriers, the second organic carrier is by 28% terpinol, 22% butyl carbitol
Acetate and 50% o-cresol modified epoxy are made.
The preparation method of first organic carrier is as follows：Weigh the butyl carbitol acetate and modified epoxy of formula ratio
Resin is placed in glass container, and 60 DEG C are heated in water bath, is stirred, mix 60min, it is to be mixed uniformly after, it is cold
But, stand, dissolution finished product is faint yellow translucent viscous liquid.
The preparation method of second organic carrier is as follows：Weigh the terpinol of formula ratio, butyl carbitol acetate and
O-cresol modified epoxy is placed in glass container, and 80 DEG C are heated in water bath, is stirred, and mixes 70min, to
After mixing, cooling, standing, dissolution finished product are the translucent viscous liquid of brown color.
The plate resistor suitable for room temperature storage is as follows with the preparation method of organic packaging slurry：By the raw material of formula ratio
After mixing, it is fully ground uniformly through three-roll grinder, the fineness after grinding is 15 microns.
The performance comparison situation of product and traditional slurry of the invention is as shown in table 1.
Table 1
It can be seen that after having adjusted slurry storage temperature, traditional performance and traditional slurry and no significant difference.
The comparison of product temperature tolerance：Sample is placed under 55 DEG C of environment and (simulates extreme storage condition) three days, tested viscosity becomes
Change, the results are shown in Table 2.
Table 2
| Sample | Initial viscosity (Pa.s) | Viscosity (Pa.s) after 3 days |
| Slurry of the present invention | 70 | 65 |
| Traditional slurry | 95 | 260 |
It can be seen that the storage performance of slurry is improved, viscosity change is larger in the present context for traditional slurry, tradition
The viscosity of the 260Pas of slurry will be unable to printing and use.
As shown in Figure 1, 2, slurry curing film of the present invention and comparison of the traditional slurry cured film under 500 power microscopes, this
After the slurry curing of invention, film layer consistency is obviously excellent.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (6)
1. a kind of organic packaging slurry of plate resistor suitable for room temperature storage, which is characterized in that by weight percentage, by following
Raw material is made：5%-10% black pigment, 10%-20% superfine silicon dioxide, 10%-20% ultra-fine alumina, 1%-5% are attached
Adhesion promoter, 0.5%-1% defoaming agent, 0.5%-1% levelling agent, the first organic carrier of 20%-40%, 30%-40%
Two organic carriers.
2. a kind of organic packaging slurry of plate resistor suitable for room temperature storage according to claim 1, which is characterized in that
First organic carrier and the second organic carrier are made of modified resin and organic solvent.
3. a kind of organic packaging slurry of plate resistor suitable for room temperature storage according to claim 2, which is characterized in that
The modified resin is modified epoxy, o-cresol modified epoxy or phenol-formaldehyde resin modified.
4. a kind of organic packaging slurry of plate resistor suitable for room temperature storage according to claim 2, which is characterized in that
The organic solvent is butanol, butyl carbitol, terpinol, ethylene glycol ether acetate, butyl cellosolve acetate, butyl card
It must one of alcohol acetate or a variety of.
5. a kind of organic packaging slurry of plate resistor suitable for room temperature storage described in any one of -4 according to claim 1,
It is characterized in that, the preparation method of first organic carrier and the second organic carrier is as follows：Raw material is placed in glass container,
Be stirred at 60 DEG C -80 DEG C, mix 60-90min, it is to be mixed uniformly after, it is cooling, stand.
6. a kind of system of organic packaging slurry of plate resistor suitable for room temperature storage according to any one of claims 1 to 5
Preparation Method, which is characterized in that preparation step includes：
After mixing by the raw material of formula ratio, it is fully ground uniformly through three-roll grinder, the fineness after grinding is 15 microns and is
It can.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744394.XA CN108912611A (en) | 2018-07-09 | 2018-07-09 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744394.XA CN108912611A (en) | 2018-07-09 | 2018-07-09 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108912611A true CN108912611A (en) | 2018-11-30 |
Family
ID=64425553
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810744394.XA Pending CN108912611A (en) | 2018-07-09 | 2018-07-09 | A kind of plate resistor organic packaging slurry and preparation method suitable for room temperature storage |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114231126A (en) * | 2022-02-15 | 2022-03-25 | 西安英诺维特新材料有限公司 | Secondary encapsulation slurry for small micro chip resistor and preparation method of encapsulation layer of secondary encapsulation slurry |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN105802346A (en) * | 2016-05-23 | 2016-07-27 | 无锡市嘉邦电力管道厂 | Composite electrically-conductive printing ink film and preparation method thereof |
| CN106560489A (en) * | 2016-07-14 | 2017-04-12 | 西安英诺维特新材料有限公司 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
-
2018
- 2018-07-09 CN CN201810744394.XA patent/CN108912611A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN105802346A (en) * | 2016-05-23 | 2016-07-27 | 无锡市嘉邦电力管道厂 | Composite electrically-conductive printing ink film and preparation method thereof |
| CN106560489A (en) * | 2016-07-14 | 2017-04-12 | 西安英诺维特新材料有限公司 | Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114231126A (en) * | 2022-02-15 | 2022-03-25 | 西安英诺维特新材料有限公司 | Secondary encapsulation slurry for small micro chip resistor and preparation method of encapsulation layer of secondary encapsulation slurry |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181130 |
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| RJ01 | Rejection of invention patent application after publication |