CN103059512B - Resin protective sizing agent and preparation method thereof - Google Patents
Resin protective sizing agent and preparation method thereof Download PDFInfo
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- CN103059512B CN103059512B CN201310032274.4A CN201310032274A CN103059512B CN 103059512 B CN103059512 B CN 103059512B CN 201310032274 A CN201310032274 A CN 201310032274A CN 103059512 B CN103059512 B CN 103059512B
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Abstract
The invention is applicable to the technical field of electronic materials and provides a resin protective sizing agent. The resin protective sizing agent comprises the following components in percentage by weight: 20%-60% of modified epoxy resin, 8%-12% of organic solvent, 30%-60% of aluminum silicon powder and 2%-8% of dispersing agent, wherein the organic solvent is butyl carbitol. The invention further provides a preparation method for the resin protective sizing agent.
Description
Technical field
The invention belongs to field of material technology, relate to a kind of resin protective paste and preparation method thereof.
Background technology
Along with electronics is constantly towards short and small frivolous direction design, surface installation technique (SMT) and surface-assembled components and parts (SMC) are encouraged to develop rapidly, communication especially nearly ten years, computer, network high-speed development.As the chip resistor of one of three large passive elements, its demand rapid growth, is widely used in electronics instrument and household electrical appliance series products.According to statistics, current China chip resistor yearly capacity has reached 5,000 hundred million, very huge to the demand of resin protective paste.
Because technical reason, the technology leader of current resin slurry is Japan and Taiwan mainly, and domestic chip resistor manufacturing enterprise monthly purchases their product in a large number, if we succeed in developing, can be domestic element manufacturing enterprise and significantly reduce production cost, improve market competition advantage; Also can be that country saves a large amount of foreign exchange.
The modified epoxy overwhelming majority of domestic production is all formed by the organic solvent dissolution such as toluene, dimethylbenzene, and resin smell is large, and pungency is strong, have injury sharply to human body, is not therefore suitable for people intensive mass production.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of resin protective paste and preparation method thereof, and aim to provide a kind of smell little, pungency is weak, to resin protective paste that human body does not injure and preparation method thereof.
The present invention realizes like this; a kind of resin protective paste; it comprises modified epoxy, organic solvent, aluminum silicon powder and dispersion agent; the mass percentage of described modified epoxy is 20%-60%; the mass percentage of described organic solvent is 8%-12%; the mass percentage of described aluminum silicon powder is 30%-60%, and the mass percentage of described dispersion agent is 2%-8%, and described organic solvent is diethylene glycol monobutyl ether.
The present invention also provides a kind of preparation method of resin protective paste, comprises step:
Take modified epoxy, organic solvent, aluminum silicon powder and dispersion agent, wherein, the quality of described modified epoxy is the 20%-60% for preparing resin protective paste quality, the quality of described organic solvent is the 8%-12% for preparing resin protective paste quality, the quality of described aluminum silicon powder is the 30%-60% for preparing resin protective paste quality, the quality of described dispersion agent is the 2%-8% for preparing resin protective paste quality, and described organic solvent is diethylene glycol monobutyl ether;
The modified epoxy taken, organic solvent, aluminum silicon powder and dispersion agent are disperseed, forms mixing material;
Slurry is rolled to described mixing material, thus obtains resin protective paste.
Compared with prior art, beneficial effect is in the present invention: resin protective paste provided by the invention and preparation method thereof, adopts diethylene glycol monobutyl ether as organic solvent; there is stronger solvability, can dissolved epoxy, and smell is little; pungency is weak, does not injure human body.
Accompanying drawing explanation
Fig. 1 is the schema of the preparation method that the present invention is to provide a kind of resin protective paste.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with accompanying drawing and case study on implementation, the present invention is further elaborated.Should be appreciated that concrete case study on implementation described herein is only in order to explain the present invention, is not intended to limit the present invention.
A kind of resin protective paste; it comprises modified epoxy, organic solvent, aluminum silicon powder and dispersion agent; the mass percentage of described modified epoxy is 20%-60%; the mass percentage of described organic solvent is 8%-12%; the mass percentage of described aluminum silicon powder is 30%-60%, and the mass percentage of described dispersion agent is 2%-8%.
Its epoxy resin is as function phase, and it is the homogeneous powder of white, has good physics, chemical stability, after solidification with substrate bonding ability by force, good insulating, cured layer shrinking percentage is little, acid-and base-resisting, scrapes, and outward appearance densification is smooth.
Organic solvent adopts diethylene glycol monobutyl ether (Diethylene glycol monobutyl ehter), and the boiling point of diethylene glycol monobutyl ether, at 231 DEG C, is a kind of solvent of applicable printing coatings.Dry moderate in printing process, dry slurry is unlikely to block mesh, the process of impact batch productionization.And under the furnace temperature of 120 DEG C, most solvent can vapor away easily, all very large help can be brought to the solidification in element later stage.Diethylene glycol monobutyl ether has stronger solvability, can soluble modified epoxy resin.
Aluminum silicon powder is as packing material.Only using resin as printed medium, printing thickness does not often reach the requirement of manufacturers, so need to add aluminum silicon powder as packing material in the resin dissolved, also utilize the acid resistance of aluminum silicon powder to reach the effect of common acid and alkali-resistance while improving thickness, aluminum silicon powder will be beneficial to dispersion, after rete solidification after rolling, compactness is good, and insulation strength is high.
Dispersion agent mainly plays powder dispersion.Aluminum silicon powder can be made to be dispersed in the organic solvent of modified epoxy.
Described resin protective paste can also comprise colorant.Described colorant is used for painted, and the mass percentage of described colorant shared by described resin protective paste is 1%-3%.
In the preferred embodiment that the technical program provides; the quality of described modified epoxy be for prepare resin protective paste quality 30%; the quality of described organic solvent be for prepare resin protective paste quality 12%; the quality of described aluminum silicon powder be for prepare resin protective paste quality 50%; the quality of described dispersion agent is that the mass percentage of described colorant shared by described resin protective paste is 2% for prepare resin protective paste quality 6%.
The average fineness of the material in described epoxy resin slurry is 6 microns to 8 microns.
The technical program also provides a kind of preparation method of described resin protective paste, comprises step:
The first step; take modified epoxy, organic solvent, aluminum silicon powder and dispersion agent; wherein; the quality of described modified epoxy is the 20%-60% for preparing resin protective paste quality; the quality of described organic solvent is the 8%-12% for preparing resin protective paste quality; the quality of described aluminum silicon powder is the 30%-60% for preparing resin protective paste quality, and the quality of described dispersion agent is the 2%-8% for preparing resin protective paste quality, and described organic solvent is diethylene glycol monobutyl ether.
In this step, can by the modified epoxy, organic solvent, aluminum silicon powder and the dispersion agent that take in a container.
Second step, disperses the modified epoxy taken, organic solvent, aluminum silicon powder and dispersion agent, forms mixing material.
In this step, adopt high speed dispersor to disperse material in container, make it mix.
3rd step, rolls slurry to described mixing material.
In this step, adopt three-roll grinder to grind and make for more than 5 times the average fineness of slurry reach 6 microns-8 microns.
The preparation method of the resin protective paste that the present embodiment provides can also comprise:
4th step, filters the slurry rolled.
In this step, impurity removed by the slurry adopting 500 order stainless steel filtering nets to filter to have rolled.
5th step, detects the slurry after filtering.
In this step, to the inorganic solid content in the slurry after filtration and viscosity measurements.
6th step, according to the detected result to the slurry after filtration, adjusts solvent in filtration disposed slurry.According to the numerical value detected, with organic solvent, slurry is adjusted, namely supplement and roll the solvent vapored away in slurry process.
7th step, detects again to the slurry after adjustment, to determine the fineness, viscosity, the inorganic solid content that adjust disposed slurry.
8th step, packs the slurry after detecting.
Resin protective paste provided by the invention and preparation method thereof, adopts diethylene glycol monobutyl ether as organic solvent, has stronger solvability, can dissolved epoxy, and smell is little, and pungency is weak, does not injure human body.
The starting material that the technical program is selected are through strictly selecting, detecting, produce, meet Europe parliaments in 2002 and EU Council completely and have passed regulation (WEEE/RoHS) about " restriction uses some Hazardous Substances Directive in electrical equipment and electronics " and " scrapping electronic and electrical equipment instruction ", reach the level of international slurry.The resin protective paste that the technical program provides in addition has the advantage that normal temperature is preserved, and can store 6 months within the scope of 5--30 degree, without the need to refrigerator storage, can be client and saves operation cost, avoid the drawback that most of slurry needs cryopreservation.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. can the preparation method of resin protective paste that preserves of normal temperature, comprise step:
Take modified epoxy, organic solvent, aluminum silicon powder and dispersion agent, wherein, the quality of described modified epoxy is the 20%-60% for preparing resin protective paste quality, the quality of described organic solvent is the 8%-12% for preparing resin protective paste quality, the quality of described aluminum silicon powder is the 30%-60% for preparing resin protective paste quality, the quality of described dispersion agent is the 2%-8% for preparing resin protective paste quality, and described organic solvent is diethylene glycol monobutyl ether;
The modified epoxy taken, organic solvent, aluminum silicon powder and dispersion agent are disperseed, forms mixing material; And
Slurry is rolled to described mixing material, again the slurry rolled filtered and carry out inorganic solid content and viscosity measurements, then according to detected result organic solvent, slurry is adjusted, again the slurry after adjustment is detected again, to determine the fineness, viscosity, the inorganic solid content that adjust disposed slurry.
2. the preparation method of resin protective paste as claimed in claim 1, is characterized in that, the average fineness rolling slurry disposed slurry is 6 microns to 8 microns.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310032274.4A CN103059512B (en) | 2013-01-28 | 2013-01-28 | Resin protective sizing agent and preparation method thereof |
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| CN201310032274.4A CN103059512B (en) | 2013-01-28 | 2013-01-28 | Resin protective sizing agent and preparation method thereof |
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| CN103059512A CN103059512A (en) | 2013-04-24 |
| CN103059512B true CN103059512B (en) | 2015-06-17 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101864251A (en) * | 2010-06-28 | 2010-10-20 | 彩虹集团公司 | Organic adhesive for electrode paste of silicon solar cell and preparation method thereof |
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2013
- 2013-01-28 CN CN201310032274.4A patent/CN103059512B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101864251A (en) * | 2010-06-28 | 2010-10-20 | 彩虹集团公司 | Organic adhesive for electrode paste of silicon solar cell and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| "片式电阻用有机聚合物电子浆料研制";周蓉等;《电子元件与材料》;20070531;第26卷(第5期);第49-52页 * |
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Effective date of registration: 20201021 Address after: 9 / F, building 1, Fenghua Electronic Industry City, 18 Fenghua Road, Duanzhou District, Zhaoqing City, Guangdong Province 526000 Patentee after: Guangdong Fenghua special components Co., Ltd Address before: 526000, Fenghua City, Fenghua Road, Fenghua City, Guangdong province 18 building, third floor, Zhaoqing Patentee before: ZHAOQING FENGHUA COMPONENT SUPPORTING Co.,Ltd. |
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