CN107731342A - A kind of chip resistor resistance slurry - Google Patents
A kind of chip resistor resistance slurry Download PDFInfo
- Publication number
- CN107731342A CN107731342A CN201710809570.9A CN201710809570A CN107731342A CN 107731342 A CN107731342 A CN 107731342A CN 201710809570 A CN201710809570 A CN 201710809570A CN 107731342 A CN107731342 A CN 107731342A
- Authority
- CN
- China
- Prior art keywords
- palladium
- resistance slurry
- chip resistor
- powder
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a kind of chip resistor resistance slurry, and comprising metal powder, the metal powder is the mixture of palladium-silver powder and palladium powder；In the resistance slurry, the weight/mass percentage composition of the palladium-silver powder is 10 30%, and the weight/mass percentage composition of the palladium powder is 30 55%.Resistance slurry resistance of the present invention is in the range of 0.01 10 Ω, in low-resistance chip resistor, has environmental protection, good dispersion, the advantage such as stability is good, reliability is high, cost is low, printing performance is excellent, and obtained chip resistor performance is good.Compared with import resistance slurry, there is the advantage green, stability is good, cost is low, there is preferable application prospect.
Description
Technical field
The present invention relates to a kind of resistance slurry, especially a kind of chip resistor resistance slurry.
Background technology
With electronic apparatus application popularization and production technology automaticity it is increasingly complete, resistance military affairs, aerospace,
The fields such as communication, computer, automobile obtain extensive use, and resistance slurry is also most widely used one kind in electric slurry.
Resistance also receives much concern as the critical elements in circuit, the resistance slurry of its important component, and resistance slurry is mainly by work(
Can phase, Binder Phase and organic carrier three parts composition.Resistance slurry is complicated, and with high content of technology, domestic resistance slurry has skill
Art Performance And Reliability is relatively low, the poor compatibility of resistance, conductor and dielectric paste, and raw material, intermediate production technology means fall
Afterwards, the shortcomings of high-quality raw material difficulty needed for slurry is sought；Although external resistance slurry quality better, price is high, the supply of material when
Between it is long, service not in time.
In order to meet the market requirement, the development for resistance is no longer that resistance is the higher the better, the resistance of low resistance is increasingly
Required for production.Based on above mentioned problem, a kind of low resistance is researched and developed, compatibility is good, reliability is high, the suitable low-resistance chip of price
Resistor resistance slurry is most important.
The content of the invention
Based on this, a kind of low resistance is provided it is an object of the invention to overcome in place of above-mentioned the deficiencies in the prior art, can
By the chip resistor resistance slurry that property is high, cost is low.
To achieve the above object, the technical solution used in the present invention is：A kind of chip resistor resistance slurry, comprising
Metal powder, the metal powder are the mixture of palladium-silver powder and palladium powder；In the resistance slurry, the quality percentage of the palladium-silver powder
Content is 10-30%, and the weight/mass percentage composition of the palladium powder is 30-55%.
As the Main Ingredients and Appearance of resistance slurry, content, ratio conduction directly with resistance of the metal powder in resistance slurry
Performance, resistance size, temperature coefficient are relevant, and the palladium in metal powder and silver provide electric conductivity, and the electrical conductivity of silver is bigger than palladium,
Therefore the content of palladium-silver in the slurry is how many directly related to the electric conductivity and resistance size of slurry, and palladium content number together
When it is relevant with temperature-coefficient of electrical resistance size.Metal powder good dispersion of the present invention, stability are high, oxidation resistance is strong.
Preferably, the ratio surface of the palladium-silver powder is 0.6-1.8m2/ g, the ratio surface of the palladium powder is 0.8-2.0m2/g。
It is highly preferred that the palladium-silver powder, palladium powder are spherical palladium-silver powder, spherical palladium powder, and the palladium-silver powder, the particle diameter of palladium powder
No more than 5 μm.Palladium-silver powder and palladium powder under above-mentioned condition can guarantee that slurry is uniformly dispersed, and printed pattern is smooth, smooth.
Preferably, the palladium-silver powder includes the composition of following parts by weight：Palladium 10-30 parts, silver-colored 70-90 parts.Under this ratio with
Inorganic additive, which is arranged in pairs or groups, can provide below the Ω of chip resistor 10 sheet resistance.
Preferably, weight/mass percentage composition of the metal powder in the resistance slurry is 50~78%.
Inventor passes through a large amount of exploration discoveries, and the metal powder dispersiveness of above-mentioned content is more preferable, stability is higher, anti-oxidant energy
Power is stronger.
Preferably, the resistance slurry also includes organic carrier, quality of the organic carrier in the resistance slurry
Percentage composition is 12~20%, and the organic carrier includes the composition of following parts by weight：85~90 parts of organic solvent, high score subtree
10~15 parts of fat.
It is highly preferred that the organic solvent is at least one of isooctanol, terpinol, butyl acetate,
The macromolecule resin is at least one of ethyl cellulose, rosin resin.
Organic solvent in the application has the advantage that：1) macromolecule resin is dissolved, makes electrically conductive particles in the polymer
It is sufficiently scattered；2) viscosity of conductive paste and the stability of viscosity are adjusted；3) rate of drying is determined, is made in slurry printing process not
As for quick-drying；4) improve the surface state of base material, slurry and matrix, face electrode slurry is had good adhesion property.
Preferably, the organic carrier is prepared by the following method gained：Macromolecule resin is added in organic solvent,
Stirring and dissolving 1~2 hour at 70~90 DEG C, obtains the organic carrier.
The present invention, by organic solvent and macromolecule resin stirring and dissolving, is formed uniform according to above-mentioned content and preparation method
Fluid transparent, that there is certain viscosity.Before impression shape, silver paste is set to form the print material for having certain viscosity by this fluid, it is complete
Into with the pattern transfer of screen printing mode；After printing, by sintering process, make between the particulate of conductive silver paste and particulate, be micro-
Stable combination is formed between grain and base material.
Preferably, the resistance slurry also includes the composition of following weight/mass percentage composition：Inorganic additive 5.5-22.5%,
Organic additive 0.5-1.5%, organic solvent 3-7%.Above-mentioned organic solvent is identical with the solvent in organic carrier.
It is highly preferred that the inorganic additive is ZnO, CuO, ZrO2、SrO、BaO、SiO2, in MgO at least two, and
The particle diameter of the inorganic additive is not more than 5 μm.
The composition of inorganic additive, content, granularity etc. influence whether the parameters such as sheet resistance, the temperature coefficient of slurry.The present invention
Selected inorganic additive, there is good stability, the contraction of slurry can be controlled, have interior slurry preferably successional
Can preferably it be matched with base material, face electrode slurry simultaneously.
Preferably, the organic additive is the polysiloxanes of polyester modification.
Organic additive of the present invention, can preferably control rheological behavior, the dispersive property of solvent-borne type body, and increase is covered
Gai Xing, make film forming uniformly, naturally, further improve slurry stability.
Meanwhile the present invention also provides a kind of preparation method of the resistance slurry, methods described is：By metal powder, inorganic
Additive, organic additive, organic solvent, organic carrier are sufficiently mixed, and gained mixture is using three-roll grinder grinding 6~8
Time, after being fully ground, obtain the resistance slurry.
Scale≤5.0 μm of fineness requirement second of resistance slurry of the present invention, at 90%≤4.0 μm of (Hegman grind gages
Direct measurement), viscosity is 200PaS/25 DEG C~300PaS/25 DEG C, and inorganic solid content is 70~85%.
Relative to prior art, beneficial effects of the present invention are：
Resistance slurry resistance of the present invention is in the range of 0.01-10 Ω, in low-resistance chip resistor, having environmental protection, dividing
The advantages such as property is good, stability is good, reliability is high, cost is low, printing performance is excellent are dissipated, and obtained chip resistor performance is good.
Compared with import resistance slurry, resistance slurry raw materials of the present invention are through strictly selecting, detecting, producing, completely
Meet European Parliaments in 2002 and EU Council passed through on《Limitation uses some harmful substances in electrical equipment and electronic equipment
Instruction》With《Scrap electronic and electrical equipment instruction》Regulation, there is green advantage；And the present invention is in the metal powder
On the basis of, appropriate organic carrier, inorganic, organic additive are added, makes resistance slurry that there is more preferable stability, meets slurry
The matching that material sinters with base material, face electrode, while the parameters such as sheet resistance, temperature coefficient reach requirement, cost obtains greatly
It is big to reduce, there is preferable application prospect.
Embodiment
To better illustrate the object, technical solutions and advantages of the present invention, below in conjunction with specific embodiment to the present invention
It is described further, palladium-silver powder in embodiment, palladium powder are spherical palladium-silver powder, spherical palladium powder, excessively negative in short-term in the embodiment of the present invention
Load, Steadydamp-heat, temperature quickly change and low temperature loading test conditions are as shown in table 1：
The overload in short-term of table 1, Steadydamp-heat, temperature quickly changes and low temperature loading test conditions
Embodiment 1
A kind of embodiment of chip resistor resistance slurry of the present invention, chip resistor electricity consumption described in the present embodiment
Resistance paste includes the composition of following weight/mass percentage composition：
Metal powder (palladium-silver powder 23%, palladium powder 55%) 78%, organic carrier 12%, organic additive 0.5%, inorganic addition
Agent 5.5%, organic solvent 4%；
In the metal powder, the ratio surface of the palladium-silver powder is 0.6m2/ g, the ratio surface of the palladium powder is 1.2m2/ g, institute
State the composition that palladium-silver powder includes following parts by weight：20 parts of palladium, 80 parts of silver.
The organic carrier includes：90 parts of organic solvent (60 parts of isooctanol, 30 parts of butyl acetate), high score
10 parts of subtree fat (1 part of rosin resin, 9 parts of ethyl cellulose)；Macromolecule resin is added in organic solvent, stirred at 70 DEG C
Dissolving 2 hours is mixed, obtains the organic carrier.
The inorganic additive is ZnO, CuO mixture, and the particle diameter of the inorganic additive is not more than 5 μm；It is described
Organic additive is the polysiloxanes of polyester modification.
Above-mentioned metal powder, inorganic additive, organic additive, organic solvent, organic carrier are sufficiently mixed, gained mixing
Thing is ground 6~8 times using three-roll grinder, after being fully ground, obtains the resistance slurry.
Each performance data that the present embodiment prepares gained resistance slurry is as shown in table 2：
The embodiment 1 of table 2 prepares each performance data of gained resistance slurry
As can be seen from the above data, slurry sheet resistance, TCR and the requirement of reliable sexual satisfaction Client Enterprise standard, size performance
Stable, printing process does not fill in net, sticky net.
Embodiment 2
A kind of embodiment of chip resistor resistance slurry of the present invention, chip resistor electricity consumption described in the present embodiment
Resistance paste includes the composition of following weight/mass percentage composition：
Metal powder (palladium-silver powder 20%, palladium powder 44%) 64%, organic carrier 16%, organic additive 1%, inorganic additive
14%th, organic solvent 5%；
In the metal powder, the ratio surface of the palladium-silver powder is 1.8m2/ g, the ratio surface of the palladium powder is 2.0m2/ g, institute
State the composition that palladium-silver powder includes following parts by weight：10 parts of palladium, 90 parts of silver.
The organic carrier includes：87 parts of organic solvent (57 parts of isooctanol, 30 parts of butyl acetate), high score
13 parts of subtree fat (1 part of rosin resin, 12 parts of ethyl cellulose)；Macromolecule resin is added in organic solvent, at 80 DEG C
Stirring and dissolving 1.5 hours, obtains the organic carrier.
The inorganic additive is ZrO2, SrO, BaO mixture, and the particle diameter of the inorganic additive be not more than 5 μm；
The organic additive is the polysiloxanes of polyester modification.
Above-mentioned metal powder, inorganic additive, organic additive, organic solvent, organic carrier are sufficiently mixed, gained mixing
Thing is ground 6~8 times using three-roll grinder, after being fully ground, obtains the resistance slurry.
Each performance data that the present embodiment prepares gained resistance slurry is as shown in table 3：
The embodiment 2 of table 3 prepares each performance data of gained resistance slurry
As can be seen from the above data, slurry sheet resistance, TCR and the requirement of reliable sexual satisfaction Client Enterprise standard, size performance
Stable, printing process does not fill in net, sticky net.
Embodiment 3
A kind of embodiment of chip resistor resistance slurry of the present invention, chip resistor electricity consumption described in the present embodiment
Resistance paste includes the composition of following weight/mass percentage composition：
Metal powder (palladium-silver powder 10%, palladium powder 40%) 50%, organic carrier 20%, organic additive 1.5%, inorganic addition
Agent 22.5%, organic solvent 6%；
In the metal powder, the ratio surface of the palladium-silver powder is 1.8m2/ g, the ratio surface of the palladium powder is 0.8m2/ g, institute
State the composition that palladium-silver powder includes following parts by weight：30 parts of palladium, 70 parts of silver.
The organic carrier includes：85 parts of organic solvent (50 parts of isooctanol, 35 parts of butyl acetate), high score
15 parts of subtree fat (2 parts of rosin resin, 13 parts of ethyl cellulose)；Macromolecule resin is added in organic solvent, at 90 DEG C
Stirring and dissolving 1 hour, obtains the organic carrier.
The inorganic additive is SiO2, mixture in MgO, and the particle diameter of the inorganic additive is not more than 5 μm；Institute
State the polysiloxanes that organic additive is polyester modification.
Above-mentioned metal powder, inorganic additive, organic additive, organic solvent, organic carrier are sufficiently mixed, gained mixing
Thing is ground 6~8 times using three-roll grinder, after being fully ground, obtains the resistance slurry.
Each performance data that the present embodiment prepares gained resistance slurry is as shown in table 4：
The embodiment 3 of table 4 prepares each performance data of gained resistance slurry
As can be seen from the above data, slurry sheet resistance, TCR and the requirement of reliable sexual satisfaction Client Enterprise standard, size performance
Stable, printing process does not fill in net, sticky net.
Embodiment 4
A kind of embodiment of chip resistor resistance slurry of the present invention, chip resistor electricity consumption described in the present embodiment
Resistance paste includes the composition of following weight/mass percentage composition：
Metal powder (palladium-silver powder 30%, palladium powder 30%) 60%, organic carrier 18%, organic additive 1%, inorganic additive
14%th, organic solvent 7%；
In the metal powder, the ratio surface of the palladium-silver powder is 1.2m2/ g, the ratio surface of the palladium powder is 1.5m2/ g, institute
State the composition that palladium-silver powder includes following parts by weight：20 parts of palladium, 80 parts of silver.
The organic carrier includes：90 parts of organic solvent (60 parts of isooctanol, 30 parts of terpinol), 10 parts of macromolecule resin
(1 part of rosin resin, 9 parts of ethyl cellulose)；Macromolecule resin is added in organic solvent, stirring and dissolving 2 is small at 70 DEG C
When, obtain the organic carrier.
The inorganic additive is CuO, ZrO2Mixture, and the particle diameter of the inorganic additive be not more than 5 μm；It is described
Organic additive is the polysiloxanes of polyester modification.
Above-mentioned metal powder, inorganic additive, organic additive, organic solvent, organic carrier are sufficiently mixed, gained mixing
Thing is ground 6~8 times using three-roll grinder, after being fully ground, obtains the resistance slurry.
Each performance data that the present embodiment prepares gained resistance slurry is as shown in table 5：
The embodiment 4 of table 5 prepares each performance data of gained resistance slurry
As can be seen from the above data, slurry sheet resistance, TCR and the requirement of reliable sexual satisfaction Client Enterprise standard, size performance
Stable, printing process does not fill in net, sticky net.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected
The limitation of scope is protected, although being explained in detail with reference to preferred embodiment to the present invention, one of ordinary skill in the art should
Understand, technical scheme can be modified or equivalent substitution, without departing from the essence of technical solution of the present invention
And scope.
Claims (10)
1. a kind of chip resistor resistance slurry, it is characterised in that comprising metal powder, the metal powder is palladium-silver powder and palladium powder
Mixture；In the resistance slurry, the weight/mass percentage composition of the palladium-silver powder is 10-30%, the quality hundred of the palladium powder
It is 30-55% to divide content.
2. chip resistor resistance slurry as claimed in claim 1, it is characterised in that the ratio surface of the palladium-silver powder is
0.6-1.8m2/ g, the ratio surface of the palladium powder is 0.8-2.0m2/g。
3. chip resistor resistance slurry as claimed in claim 1, it is characterised in that the palladium-silver powder includes following weight
The composition of part：Palladium 10-30 parts, silver-colored 70-90 parts.
4. chip resistor resistance slurry as claimed in claim 1, it is characterised in that the metal powder is starched in the resistance
Weight/mass percentage composition in material is 50~78%.
5. the chip resistor resistance slurry as described in any one of Claims 1 to 4, it is characterised in that also include airborne
Body, weight/mass percentage composition of the organic carrier in the resistance slurry are 12~20%, and the organic carrier includes following
The composition of parts by weight：85~90 parts of organic solvent, 10~15 parts of macromolecule resin.
6. chip resistor resistance slurry as claimed in claim 5, it is characterised in that the organic solvent be isooctanol,
At least one of terpinol, butyl acetate, the macromolecule resin are in ethyl cellulose, rosin resin
It is at least one.
7. chip resistor resistance slurry as claimed in claim 5, it is characterised in that the organic carrier passes through with lower section
Method prepares gained：Macromolecule resin is added in organic solvent, stirring and dissolving 1~2 hour at 70~90 DEG C, obtained described
Organic carrier.
8. the chip resistor resistance slurry as described in any one of Claims 1 to 4, it is characterised in that also comprising following matter
Measure the composition of percentage composition：Inorganic additive 5.5-22.5%, organic additive 0.5-1.5%, organic solvent 3-7%.
9. chip resistor resistance slurry as claimed in claim 8, it is characterised in that the inorganic additive be ZnO,
CuO、ZrO2、SrO、BaO、SiO2, in MgO at least two, and the particle diameter of the inorganic additive is not more than 5 μm.
10. chip resistor resistance slurry as claimed in claim 8, it is characterised in that the organic additive is polyester
Modified polysiloxanes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710809570.9A CN107731342A (en) | 2017-09-08 | 2017-09-08 | A kind of chip resistor resistance slurry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710809570.9A CN107731342A (en) | 2017-09-08 | 2017-09-08 | A kind of chip resistor resistance slurry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731342A true CN107731342A (en) | 2018-02-23 |
Family
ID=61205075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710809570.9A Pending CN107731342A (en) | 2017-09-08 | 2017-09-08 | A kind of chip resistor resistance slurry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107731342A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550416A (en) * | 2018-05-18 | 2018-09-18 | 苏州天鸿电子有限公司 | A kind of chip resistor resistance slurry |
| CN108766696A (en) * | 2018-06-08 | 2018-11-06 | 肇庆市安捷电子有限公司 | A kind of slice type piezoresistor palladium-silver slurry |
| CN109378105A (en) * | 2018-08-28 | 2019-02-22 | 深圳市汇北川电子技术有限公司 | A kind of preparation method of NTC chip electrode slurry and the NTC chip using the slurry |
| CN111898270A (en) * | 2020-07-31 | 2020-11-06 | 广东风华高新科技股份有限公司 | Slurry-blocking accurate proportioning method, medium and terminal equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5345212A (en) * | 1993-07-07 | 1994-09-06 | National Starch And Chemical Investment Holding Corporation | Power surge resistor with palladium and silver composition |
| CN104795128A (en) * | 2015-05-14 | 2015-07-22 | 刘飞全 | Lead-free resistance paste as well as manufacturing process and application of lead-free resistance paste |
| CN107068238A (en) * | 2016-12-09 | 2017-08-18 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of aluminium alloy base plate full silver electrode paste of thick film circuit intermediate sintering temperature and preparation method thereof |
-
2017
- 2017-09-08 CN CN201710809570.9A patent/CN107731342A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5345212A (en) * | 1993-07-07 | 1994-09-06 | National Starch And Chemical Investment Holding Corporation | Power surge resistor with palladium and silver composition |
| CN104795128A (en) * | 2015-05-14 | 2015-07-22 | 刘飞全 | Lead-free resistance paste as well as manufacturing process and application of lead-free resistance paste |
| CN107068238A (en) * | 2016-12-09 | 2017-08-18 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of aluminium alloy base plate full silver electrode paste of thick film circuit intermediate sintering temperature and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550416A (en) * | 2018-05-18 | 2018-09-18 | 苏州天鸿电子有限公司 | A kind of chip resistor resistance slurry |
| CN108766696A (en) * | 2018-06-08 | 2018-11-06 | 肇庆市安捷电子有限公司 | A kind of slice type piezoresistor palladium-silver slurry |
| CN109378105A (en) * | 2018-08-28 | 2019-02-22 | 深圳市汇北川电子技术有限公司 | A kind of preparation method of NTC chip electrode slurry and the NTC chip using the slurry |
| CN111898270A (en) * | 2020-07-31 | 2020-11-06 | 广东风华高新科技股份有限公司 | Slurry-blocking accurate proportioning method, medium and terminal equipment |
| CN111898270B (en) * | 2020-07-31 | 2023-11-21 | 广东风华高新科技股份有限公司 | Slurry blocking accurate proportioning method, medium and terminal equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107731342A (en) | A kind of chip resistor resistance slurry | |
| CN105873248B (en) | A kind of heating film low-temperature sintering slurry and preparation method thereof | |
| CN108133768A (en) | A kind of high conductivity low temperature curing type electrocondution slurry and preparation method thereof | |
| CN114267473B (en) | Easily-printed chip resistor paste with stable viscosity and thixotropic value | |
| CN106128555A (en) | A kind of high connductivity crystal silicon solar batteries front electrode silver slurry and preparation method thereof | |
| CN102097183B (en) | Process for preparing conductive slurry for crystalline silicon solar cell front electrode | |
| CN105264614A (en) | Photonic sintering of polymer thick film copper conductor compositions | |
| CN103555067B (en) | Electrically conductive ink of a kind of regulating power and its preparation method and application | |
| CN108770194A (en) | The preparation method of conductive silver paste used for printed circuit | |
| CN108039225A (en) | Environment-friendly type low resistance graphene carbon fiber conductive carbon paste and preparation method thereof | |
| CN108172322A (en) | Conductive consent slurry and its preparation method and application | |
| CN104538083A (en) | High adhesive force and low-temperature setting conductive silver paste and preparing method thereof | |
| CN108962425A (en) | A kind of preparation method of graphene conductive slurry | |
| CN108117665A (en) | Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof | |
| CN105694594A (en) | An aqueous graphene conductive printing ink suitable for screen printing and a preparing method thereof | |
| CN109003699A (en) | A kind of plate resistor resistance slurry and preparation method thereof | |
| CN108766696A (en) | A kind of slice type piezoresistor palladium-silver slurry | |
| CN112053796B (en) | Silver sulfide resistant electrode paste and preparation method thereof | |
| CN107622809A (en) | A kind of copper electrode paste and preparation method thereof | |
| Hsiang et al. | Rheological behaviors of silver conductive pastes with ethyl cellulose | |
| CN105304161A (en) | Low-temperature environment-friendly conductive silver paste and preparation method and application thereof | |
| CN114171255A (en) | Composite conductive functional silver paste and preparation method thereof | |
| CN106830691B (en) | A kind of graphene doping type electric slurry glass powder and preparation method thereof | |
| CN103413591B (en) | A kind of paster fuse fuse-link electric slurry and preparation method thereof | |
| CN106211379A (en) | A kind of carborundum ruthenium resistance slurry and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
|
| RJ01 | Rejection of invention patent application after publication |