CN102903422B - Silk print full-silver-end electrode slurry for capacitor - Google Patents
Silk print full-silver-end electrode slurry for capacitor Download PDFInfo
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- CN102903422B CN102903422B CN201210404703.1A CN201210404703A CN102903422B CN 102903422 B CN102903422 B CN 102903422B CN 201210404703 A CN201210404703 A CN 201210404703A CN 102903422 B CN102903422 B CN 102903422B
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Abstract
The invention discloses silk print full-silver-end electrode slurry for a capacitor. The silk print full-silver-end electrode slurry for the capacitor comprises the following components in percentage by weight: 75-79% of silver powder, 2-4% of glass powder and the balance of organic carriers, wherein the organic carriers consist of 2-4% of resin in percentage by weight of the whole slurry, 13-21% of an organic solvent in percentage by weight of the whole slurry and an organic additive. The fineness of the slurry can reach 4-5mu m, and the slurry is suitable for a silk-screen printing technology, and is widely applied to the production of wafer capacitors, core penetration capacitors and the like.
Description
Technical field
The present invention relates to a kind of electric slurry, particularly relate to a kind of silk print full-silver-end electrode slurry for capacitor.
Background technology
Ceramic capacitor is one of electronic component that current chip rate is the highest.In low-voltage field, chip multilayer ceramic capacitor replaces Disk Ceramic Capacitors.But the demand of minitype high voltage, interchange Disk Ceramic Capacitors is still very powerful, and the application in telecommunications and audio/video devices progressively expands.China, Southeast Asia, Korea S, Brazil waited, and had become the main grown place of world's Disk Ceramic Capacitors.This patent is intended to introduce a kind of Disk Ceramic Capacitors silver slurry, this silver slurry is by the size matching to silver powder in slurry system, the appropriate interpolation of flake silver powder, adopt bismuth borated silicate glass powder and the good organic carrier of rheological characteristic simultaneously, applicable craft is extensive, can print, can spray, and electrical property is good after burning, solderability is excellent.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of good dispersion, superior performance, silk print full-silver-end electrode slurry for capacitor that the feature of environmental protection is good.
The technical problem to be solved in the present invention is achieved through the following technical solutions: a kind of silk print full-silver-end electrode slurry for capacitor, and percentage by weight consists of: silver powder 75-79%, glass dust 2-4%, surplus are organic carriers; Described organic carrier by account for whole slurry weight percentage be 2-4% resin and account for whole slurry weight percentage be 13-21% organic solvent and organic additive form.
Further: in above-mentioned silk print full-silver-end electrode slurry for capacitor, described silver powder comprises flake silver powder and ball shape silver powder, and described glass dust is bismuth borosilicate system, and its percentage by weight consists of and comprises Bi
2o
370%, SiO
210%, B
2o
315%, also have 5% to be other materials that those skilled in the art commonly use.Described resin is one or both in abietic resin, ethyl cellulose.Described organic solvent is one or both in terpinol, isooctanol.Described organic additive is one or both in castor oil, lecithin.
Compared with prior art, silk print full-silver-end electrode slurry for capacitor of the present invention, its percentage by weight consists of: silver powder 75-79%, glass dust 2-4%, surplus are organic carriers; Described organic carrier by account for whole slurry weight percentage be 2-4% resin and account for whole slurry weight percentage be 13-21% organic solvent form.The effect of organic carrier is for slurry provides necessarily good silk screen printing performance, to meet the manufacturing technique requirent of wafer capacitance silk-screen.Glass dust adopts bismuth borated silicate glass powder, and its Main Function contributes to silver powder sintering, provides an adhesive force between silver layer and substrate simultaneously.Silver powder is the key component of slurry, is also functional material.Silver powder in the present invention adopts size particles mix and match; the particle diameter of silver powder is (0.05-0.6) μm; also add the percentage accounting for silver powder total weight is the flake silver powder of 0-50% simultaneously, is all to burn till rear electrode compactness to increase, and improves solderability.In slurry manufacturing process of the present invention, owing to adopting multiple silver powder, therefore, various silver powder, before preparation slurry, is first mixed with slurry, then mixes by component design by separately, finally make finished product slurry, ensure slurry dispersing uniformity, stability.The fineness of finished product slurry of the present invention can reach 4 ~ 5 μm, and is applicable to silk-screen printing technique; Be widely used in the production of wafer capacitance, feedthrough capacitor etc.
Embodiment
Purport of the present invention is by the proportioning of each component in adjustment all-silver electronic paste, selects suitable silver powder, organic solvent, macromolecule resin, inorganic additive, obtains superior performance, all-silver electronic paste that the feature of environmental protection is good.Below in conjunction with embodiment, content of the present invention is described in further detail, content mentioned in embodiment is not limitation of the invention, and in preparation method, the selection of the process conditions such as temperature, time and material prescription can be suited measures to local conditions and there is no substantial effect to result.
Embodiment
The formulation Example formula composition of the best of the present invention is as shown in table 1:
Table 1
The present invention according to above formula obtained can the complete silver-colored terminal electrode paste of silk-screen, then the performance making wafer capacitance device is shown in Table 2.
Table 2
| Production code member | Outward appearance | Classical electrical energy | Solderability | Product hierarchy |
| 1 | Generally | Generally | Generally | Generally |
| 2 | Generally | Well | Generally | Generally |
| 3 | Generally | Generally | Difference | Difference |
| 4 | Excellent | Excellent | Excellent | Excellent |
| 5 | Excellent | Excellent | Excellent | Excellent |
| 6 | Excellent | Excellent | Generally | Generally |
| 7 | Generally | Generally | Generally | Generally |
By above-mentioned experimental result, experiment numbers 4 and 5 design the silver prepared starch sinter after electrical property, equal OK in solderability, but taking cost into account, final choice experiment numbering 4 is preferred plan.
The electric performance test data of experiment numbers 4 capacitor
Claims (3)
1. a silk print full-silver-end electrode slurry for capacitor, its percentage by weight consists of: silver powder 78-79%, glass dust 3%, surplus are organic carriers; Described organic carrier by account for whole slurry weight percentage be 3% ethyl cellulose and account for whole slurry weight percentage be 15-16% organic solvent and organic additive form;
Described silver powder comprises flake silver powder and ball shape silver powder, and the particle diameter of silver powder is 0.05-0.6 μm; Described glass dust is bismuth borosilicate system, and its percentage by weight consists of and comprises Bi
2o
370%, SiO
210%, B
2o
315%.
2. silk print full-silver-end electrode slurry for capacitor according to claim 1, is characterized in that: described organic solvent is one or both in terpinol, isooctanol.
3. silk print full-silver-end electrode slurry for capacitor according to claim 2, is characterized in that: described organic additive is one or both in castor oil, lecithin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210404703.1A CN102903422B (en) | 2012-10-23 | 2012-10-23 | Silk print full-silver-end electrode slurry for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210404703.1A CN102903422B (en) | 2012-10-23 | 2012-10-23 | Silk print full-silver-end electrode slurry for capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102903422A CN102903422A (en) | 2013-01-30 |
| CN102903422B true CN102903422B (en) | 2015-06-17 |
Family
ID=47575621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210404703.1A Active CN102903422B (en) | 2012-10-23 | 2012-10-23 | Silk print full-silver-end electrode slurry for capacitor |
Country Status (1)
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| CN (1) | CN102903422B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103390444A (en) * | 2013-07-31 | 2013-11-13 | 广东风华高新科技股份有限公司 | Lead-free electrode slurry used for chip resistor |
| CN109346322A (en) * | 2018-10-17 | 2019-02-15 | 成都宏明电子科大新材料有限公司 | A kind of pulse power ceramic capacitor, termination electrode and preparation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101206939A (en) * | 2007-12-14 | 2008-06-25 | 广东风华高新科技股份有限公司 | Method for manufacturing piece type base metal resistor |
| CN101692410A (en) * | 2009-08-21 | 2010-04-07 | 广东风华高新科技股份有限公司 | Silver paste of MLCC terminal electrode |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102157221A (en) * | 2011-03-28 | 2011-08-17 | 彩虹集团公司 | Method for preparing electrode silver paste for environment-friendly semiconductor capacitor |
-
2012
- 2012-10-23 CN CN201210404703.1A patent/CN102903422B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101206939A (en) * | 2007-12-14 | 2008-06-25 | 广东风华高新科技股份有限公司 | Method for manufacturing piece type base metal resistor |
| CN101692410A (en) * | 2009-08-21 | 2010-04-07 | 广东风华高新科技股份有限公司 | Silver paste of MLCC terminal electrode |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102157221A (en) * | 2011-03-28 | 2011-08-17 | 彩虹集团公司 | Method for preparing electrode silver paste for environment-friendly semiconductor capacitor |
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| CN102903422A (en) | 2013-01-30 |
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