CN103390444A - Lead-free electrode slurry used for chip resistor - Google Patents
Lead-free electrode slurry used for chip resistor Download PDFInfo
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- CN103390444A CN103390444A CN2013103302831A CN201310330283A CN103390444A CN 103390444 A CN103390444 A CN 103390444A CN 2013103302831 A CN2013103302831 A CN 2013103302831A CN 201310330283 A CN201310330283 A CN 201310330283A CN 103390444 A CN103390444 A CN 103390444A
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Abstract
A lead-free electrode slurry used for a chip resistor comprises components in percentage by weight as follows: 70%-75% of silver powder, 4%-6% of glass powder and 19%-26% of an organic carrier, wherein the silver powder comprises components in percentage by weight as follows: 40%-60% of sub-micro silver powder and 40%-60% of flake silver powder; and the organic carrier comprises components in percentage by weight as follows: 5%-20% of polymer resin, 1%-5% of an organic addition agent and 75%-94% of an organic solvent. According to the lead-free electrode slurry used for the chip resistor, the sub-micro silver powder and the flake silver powder are matched to serve as a conducting phase and are mutually stacked and filled after sintered, so that gaps in the silver powder are effectively filled up, a silver layer is compact after the electrode slurry is sintered, the promotion of the electrical conductivity is facilitated, and the electrical conductivity is better.
Description
Technical field
The present invention relates to a kind of electrode slurry, particularly relate to a kind of chip resistor with unleaded electrode slurry.
Background technology
The chip resistor main application fields is computer, communication, household electrical appliances, mobile phone, the digital consumer goods, automotive electronics, illumination etc., the most of annual growth that keeps more than 10% of these industries.
The electrode silver plasm that present chip resistor uses, mainly from abroad, also do not have at home ripe product to apply in the field, and the silver slurry is with high content of technology, and added value is high; Therefore ripe electrode silver plasm is one of crucial raw material of being badly in need of production domesticization.
Chip resistor commonly used is mainly unleaded electrode slurry with unleaded electrode slurry at present, and the composition of unleaded electrode slurry mainly comprises silver powder, organic carrier and glass dust, but most chip resistor is not good enough with the conductivity of unleaded electrode slurry.
Summary of the invention
Based on this, be necessary to provide a kind of conductivity preferably chip resistor with unleaded electrode slurry.
A kind of chip resistor is with unleaded electrode slurry, and percentage composition, comprise following component: silver powder 70%～75%, glass dust 4%～6%, organic carrier 19%～26% by weight;
Wherein, described silver powder is percentage composition by weight, comprises following component: submicron silver powder 40%～60%, flake silver powder 40%～60%;
Described organic carrier is percentage composition by weight, comprises following component: macromolecule resin 5%～20%, organic additive 1%～5%, organic solvent 75%～94%.
In embodiment, also comprise inorganic additive therein, it is 1%～5% with the percentage by weight of unleaded electrode slurry that described inorganic additive accounts for described chip resistor.
In embodiment, described inorganic additive is the oxide of zinc or zinc therein.
In embodiment, described glass dust is Si-Bi-Zn system glass dust therein.
In embodiment, described Si-Bi-Zn glass system is percentage composition by weight, comprises following component: silica 40%～50%, bismuth oxide 20%～40%, zinc oxide 20%～30% therein.
In embodiment, described macromolecule resin is abietic resin or ethyl cellulose therein.
In embodiment, described organic solvent is esters solvent, fat hydrocarbon solvent or ether solvent therein.
In embodiment, described lipid solvent is monobutyl ether acetate therein.
In embodiment, described ether solvent is the diethylene glycol butyl ether therein.
In embodiment, described organic additive is castor oil or peanut oil therein.
Above-mentioned chip resistor is with in unleaded electrode slurry, and its silver powder comprises that percentage by weight is that 40%～60% submicron silver powder and percentage by weight are 40%～60% flake silver powder.Submicron silver powder is arranged in pairs or groups as conductive phase mutually with flake silver powder, after sintering, submicron silver powder and flake silver powder are piled up mutually filling, effectively fill up the space between silver powder, make after the electrode slurry sintering silver layer fine and close, be conducive to the lifting of conductivity, so its conductivity is better.
Embodiment
, for above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with embodiment, be described in detail.
The chip resistor of one execution mode is with unleaded electrode slurry, and percentage composition, comprise following component: silver powder 70%～75%, glass dust 4%～6%, organic carrier 19%～26% by weight.
Preferably, silver powder is percentage composition by weight, comprises following component: submicron silver powder 40%～60%, flake silver powder 40%～60%.Select crystallization spherical silver and the strip silver powder of sub-micron to arrange in pairs or groups mutually as conductive phase, in order to be applicable to the technological requirement of chip resistor sintering on the one hand, particle diameter due to submicron silver powder is in sub-micron rank (particle size diameter 100nm～1.0 μ m) on the other hand, submicron silver powder is arranged in pairs or groups as conductive phase mutually with flake silver powder, after sintering, submicron silver powder and flake silver powder are piled up mutually filling, effectively fill up the space between silver powder particles, silver slurry silver layer after sintering is fine and close, is conducive to the lifting of conductivity.And due to the minimizing in micro-pore, crack, the migration also corresponding minimizing of silver in plasma resistance, can prevent product and change into and cause the resistance drift large because of the silver migration in the process of using, and affects the final electrical property of chip resistor.
Glass dust is as Binder Phase, and its Main Function is tightr for silver layer and base material combination are obtained, and can shield to the conductive layer silver layer in follow-up process, has improved anti-weldering ability.
Preferably, glass dust be chosen in 700 ℃～900 ℃ densified sintering products good, with the Si-Bi-Zn glass system that wetability is good and corrosivity is little of base material aluminium oxide as Binder Phase., except for chip resistor provides better adhesive force with unleaded electrode slurry and base material alumina substrate, can also meet solderability and the platability requirement of chip resistor with unleaded electrode slurry.
Preferably, the Si-Bi-Zn glass system is percentage composition by weight, comprises following component: silica 40%～50%, bismuth oxide 20%～40%, zinc oxide 20%～30%.
Organic carrier is percentage composition by weight, comprises that following component is: macromolecule resin 5%～20%, organic additive 1%～5%, organic solvent 75%～94%.The thixotroping of this organic carrier is effective, and adopting the brookfiled viscosimeter to detect 1.0rpm/10.0rpm ratio is 4～8.The slurry levelability is moderate, has guaranteed the printing quality of this chip resistor with unleaded electrode slurry, and the silk-screen dry thickness is 8 ± 1 μ m.
According to the fluid that the organic carrier of above-mentioned formula and proportional arrangement can form homogeneous transparent, have certain viscosity, can guarantee in the process with silver powder mixes complete, print out required figure uniformly.
Wherein, macromolecule resin can be abietic resin or ethyl cellulose.Organic solvent can be esters solvent, fat hydrocarbon solvent or ether solvent.In one embodiment, the lipid solvent can be monobutyl ether acetate.Ether solvent can be the diethylene glycol butyl ether.These organic solvents evaporation rate in the process of printing is moderate, can keep away slurry and condenses and stop up mesh and affect product quality.Organic additive can be castor oil or peanut oil.
Chip resistor can further include inorganic additive with unleaded electrode slurry, and wherein, it is 1%～5% with the percentage by weight of unleaded electrode slurry that inorganic additive accounts for chip resistor.Inorganic additive is used for preventing the excessive sintering of silver powder, suppresses the diffusion of liquefaction glass, help to form fine and close crystalline phase and with the coupling of plasma resistance.
Preferably, inorganic additive is the oxide of zinc or zinc.
The production process of above-mentioned chip resistor electrode slurry is: prepare burden according to above-mentioned formula, roll slurry after dispersion, obtain after filtering the semi-finished product inspection, then size mixing and obtain into product examine, packing warehouse-in.
Adopt above-mentioned chip resistor with the process that unleaded electrode slurry prepares chip resistor to be: 1, check aluminum oxide substrate; 2, silk-screen back electrode slurry and 220 ℃ of dryings; 3, the silk-screen chip resistor is with unleaded electrode slurry and at 850 ℃ of sintering; 4, silk-screen plasma resistance and at 220 ℃, carry out drying; 5, adopt the IQC check after 850 ℃ of co-sinterings; 6, glass paste of silk-screen and at 220 ℃, carry out drying; 7, laser resistor trimming after 600 ℃ of sintering; 8, silk-screen secondary glass slurry and at 180 ℃, carry out drying; 9, silk marks slurry and at 180 ℃, carry out drying; 10, once be divided into strip at 200 ℃ after being cured, 11, vacuum sputtering and examine the quality of the production 12, secondary splitting is granular and carries out surface treatment, check again; 13, braid and packaging product.
Above-mentioned chip resistor is with in unleaded electrode slurry, and its silver powder comprises that percentage by weight is that 40%～60% submicron silver powder and percentage by weight are 40%～60% flake silver powder.Submicron silver powder is arranged in pairs or groups as conductive phase mutually with flake silver powder, after sintering, submicron silver powder and flake silver powder are piled up mutually filling, effectively fill up the space between silver powder, make after the electrode slurry sintering silver layer fine and close, be conducive to the lifting of conductivity, so its conductivity is better.The Si-Bi-Zn system glass dust of selecting is as glass dust, this glass dust is as Binder Phase, make chip resistor higher with the adhesive force of unleaded electrode slurry and base material alumina substrate, further, add inorganic additive, be used for preventing the excessive sintering of silver powder, suppress the diffusion of liquefaction glass, help to form fine and close crystalline phase and with the coupling of plasma resistance.This chip resistor can be attached to the surface of chip resistor sheet by the mode of silk screen printing with unleaded electrode slurry, and the contact resistance slurry is derived resistance.
Embodiment
The formula of embodiment forms as shown in table 1, and the chip resistor that makes according to the formula of table 1 is with unleaded electrode slurry, then the performance of the chip resistor of making is as shown in table 2.
Table 1
Annotate:
※The weight ratio that is expressed as sub-micron and sheet is 1:1.
Table 2
As from the foregoing, chip resistor according to the present invention is lower with the resistivity of unleaded electrode slurry with the chip resistor that the formula of unleaded electrode slurry makes, its excellent conductivity, and simultaneously, after sintering, silver layer is fine and close, and adhesive force is better, and solderability is good.
The chip resistor that adds inorganic additive is as shown in table 3 with the formula of unleaded electrode slurry embodiment, and the chip resistor that makes according to the formula of table 3 is with unleaded electrode slurry, then the performance of the chip resistor of making is as shown in table 4.
Table 3
Table 4
As from the foregoing, after the inorganic additive that adds in unleaded electrode slurry at chip resistor, the Electrodes rate further reduces, and conductivity further improves, and its adhesive force also further improves.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a chip resistor, with unleaded electrode slurry, is characterized in that, percentage composition, comprise following component: silver powder 70%～75%, glass dust 4%～6%, organic carrier 19%～26% by weight;
Wherein, described silver powder is percentage composition by weight, comprises following component: submicron silver powder 40%～60%, flake silver powder 40%～60%;
Described organic carrier is percentage composition by weight, comprises following component: macromolecule resin 5%～20%, organic additive 1%～5%, organic solvent 75%～94%.
2. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 1, also comprises inorganic additive, and it is 1%～5% with the percentage by weight of unleaded electrode slurry that described inorganic additive accounts for described chip resistor.
3. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 2, and described inorganic additive is the oxide of zinc or zinc.
4. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 1, and described glass dust is Si-Bi-Zn system glass dust.
5. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 4, and described Si-Bi-Zn glass system is percentage composition by weight, comprises following component: silica 40%～50%, bismuth oxide 20%～40%, zinc oxide 20%～30%.
6. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 1, and described macromolecule resin is abietic resin or ethyl cellulose.
7. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 1, and described organic solvent is esters solvent, fat hydrocarbon solvent or ether solvent.
8. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 7, and described lipid solvent is monobutyl ether acetate.
9. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 7, and described ether solvent is the diethylene glycol butyl ether.
10. chip resistor, with unleaded electrode slurry, is characterized in that according to claim 1, and described organic additive is castor oil or peanut oil.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106128548A (en) * | 2016-06-29 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of resistance slurry of high electric heating conversion ratio |
| CN106415736A (en) * | 2014-06-20 | 2017-02-15 | 贺利氏贵金属北美康舍霍肯有限责任公司 | Organic vehicle for electroconductive paste |
| CN108117665A (en) * | 2017-12-19 | 2018-06-05 | 西安宏星电子浆料科技有限责任公司 | Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof |
| CN109411112A (en) * | 2017-08-18 | 2019-03-01 | 西安宏星电子浆料科技有限责任公司 | A kind of plate resistor unleaded face electrode slurry of the acidproof type of resistance to weldering |
| CN112635096A (en) * | 2020-12-10 | 2021-04-09 | 潮州三环（集团）股份有限公司 | Silver paste for sheet resistor |
| CN112992402A (en) * | 2021-04-16 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | Silver and two-dimensional MXene mixed system conductor slurry for chip resistor and preparation method thereof |
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Cited By (8)
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| CN106415736A (en) * | 2014-06-20 | 2017-02-15 | 贺利氏贵金属北美康舍霍肯有限责任公司 | Organic vehicle for electroconductive paste |
| CN106128548A (en) * | 2016-06-29 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of resistance slurry of high electric heating conversion ratio |
| CN106128548B (en) * | 2016-06-29 | 2017-07-28 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of resistance slurry of high electric heating conversion ratio |
| CN109411112A (en) * | 2017-08-18 | 2019-03-01 | 西安宏星电子浆料科技有限责任公司 | A kind of plate resistor unleaded face electrode slurry of the acidproof type of resistance to weldering |
| CN108117665A (en) * | 2017-12-19 | 2018-06-05 | 西安宏星电子浆料科技有限责任公司 | Plate resistor unleaded encasement medium slurry of anti-acid and preparation method thereof |
| CN112635096A (en) * | 2020-12-10 | 2021-04-09 | 潮州三环（集团）股份有限公司 | Silver paste for sheet resistor |
| CN112992402A (en) * | 2021-04-16 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | Silver and two-dimensional MXene mixed system conductor slurry for chip resistor and preparation method thereof |
| CN112992402B (en) * | 2021-04-16 | 2021-10-08 | 西安宏星电子浆料科技股份有限公司 | Silver and two-dimensional MXene mixed system conductor slurry for chip resistor and preparation method thereof |
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Application publication date: 20131113 |