CN103632781B - Slice component termination packaging slurry and the preparation method of slice component - Google Patents
Slice component termination packaging slurry and the preparation method of slice component Download PDFInfo
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- CN103632781B CN103632781B CN201310687709.9A CN201310687709A CN103632781B CN 103632781 B CN103632781 B CN 103632781B CN 201310687709 A CN201310687709 A CN 201310687709A CN 103632781 B CN103632781 B CN 103632781B
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Abstract
The invention discloses a kind of slice component termination packaging slurry and the preparation method of slice component, wherein packaging slurry is made up of 35 45% metal dusts by mass percentage, 15 25% macromolecule resins, 20 35% calcium carbonate and 10 20% organic solvents, and mixes；The preparation method of slice component includes the encapsulation process of slice component, it may be assumed that packaging slurry is encapsulated in the termination of slice component.Packaging slurry Chemical Physics stability disclosed in this invention is good, and sealing property is good, modest viscosity；This packaging slurry is encapsulated in the slice component that slice component termination is made, solves the process difficulties of slice component termination protection, make 1% precision qualification rate of the slice component made be improved.
Description
Technical field
The present invention relates to a kind of slice component termination packaging slurry and the preparation method of a kind of slice component.
Background technology
In recent years, along with passive element SMT technology develops rapidly, market is to passive element electric property and steady
Qualitative requirement is more and more higher, and the critesistor with negative temperature characteristic is carrying out chip type simultaneously, the essence to technique
Refinement requires more and more higher.The chip 1% precision qualification rate that original critesistor technique platform is produced is low,
It is difficult to batch production, it is impossible to meet the market demand to high-precision thermistor chip.Made with high precision work
The exploitation of skill platform is the difficult problem needing to capture, and particularly high accuracy die terminals head protection has then become critical process.
As a example by 0402 size chip-type negative temperature coefficient thermistor relatively conventional in industry, 25 DEG C of nominal electricity
Resistance is the chip of 100k Ω, the chip 1% precision qualification rate that not high precision process platform is produced less than or
Equal to 20%, made with high precision technique platform chip 1% precision qualification rate out is also only capable of reaching about 40%.
And the critical process of made with high precision platform is high accuracy termination protection technique, if it is possible to solve this technique difficult
Topic, 1% precision qualification rate also will be greatly improved.
Summary of the invention
It is an object of the invention to provide a kind of slice component termination packaging slurry and preparation method thereof, apply the present invention
The slice component made resistance value concordance at 25 DEG C is good, and 1% precision qualification rate can reach more than 70%；
And the surface of slice component does not has bad defect, chip reliability is qualified.
For reaching above-mentioned purpose, the present invention by the following technical solutions:
The invention discloses a kind of slice component termination packaging slurry, by 35-45% gold by mass percentage
Belong to powder, 15-25% macromolecule resin, 20-35% calcium carbonate and 10-20% organic solvent composition, and mix and
Become.
Preferably, the mass percent of described metal dust is 40-45%, the quality hundred of described macromolecule resin
Proportion by subtraction is 15-20%, and the mass percent of described calcium carbonate is 25-30%.
Preferably, described metal dust is argentum powder, and described macromolecule resin is epoxy resin.
The invention also discloses the preparation method of a kind of slice component, including the encapsulation process of slice component termination,
The encapsulation process of described slice component termination comprises the following steps: by the bag described in any one of claims 1 to 3
Slurry seal material is encapsulated in the termination of slice component.
Preferably, the termination that described packaging slurry is encapsulated in slice component comprises the following steps: by described encapsulating
Slurry is screen-printed to slice component termination by screen printer in 300-450 purpose, forms print thickness and is
The encapsulating protective layer of 15-50 μm.
Preferably, the encapsulation process of described slice component termination is further comprising the steps of: will form described encapsulating and protect
The slice component termination of sheath solidifies 2-4 hour at 100-120 DEG C；By the slice component termination bag after solidification
Slurry seal material carries out carbonization at 300-450 DEG C.
Preferably, the encapsulation process of described slice component termination is further comprising the steps of: by the chip unit after carbonization
Part termination packaging slurry passes through ultrasonic waves for cleaning, and operating current is 1-3A, and the working time is 10-25 minute.
Preferably, described print thickness is 20-40 μm.
Preferably, the persistent period of described solidification is 2.5-3.5 hour, and the temperature of described carbonization is 370-430
℃。
Preferably, described packaging slurry is mixed by mechanical agitation, and described churned mechanically speed is
60-100r/min。
The invention has the beneficial effects as follows: the present invention use mass percent be respectively 35-45% metal dust,
The packaging slurry chemistry that 15-25% macromolecule resin, 20-35% calcium carbonate and 10-20% organic solvent mix
Stable physical property is good, and sealing property is good, modest viscosity.The packaging slurry of this proportioning is encapsulated in chip unit
The slice component that the termination of part is prepared as, solves the process difficulties of slice component termination protection, makes to make simultaneously
1% precision qualification rate of slice component be improved significantly, and the surface of slice component does not haves salient point
Or the defect such as burr, the reliability compliance of its chip.
Accompanying drawing explanation
Fig. 1 is the critesistor high accuracy chip schematic diagram after the packaging slurry encapsulating of the preferred embodiment of the present invention；
Fig. 2 is the critesistor high accuracy core after the packaging slurry encapsulating carbonization of the preferred embodiment of the present invention, burning glass
Sheet schematic diagram.
Description of reference numerals: 1 critesistor high accuracy chip, 2 packaging slurries, 3 glass glazes.
Detailed description of the invention
Below against accompanying drawing and combine preferred embodiment the invention will be further described.
Embodiment one:
Present embodiments provide the slice component termination packaging slurry mixed by the raw material of different quality proportioning.
Metal dust, macromolecule resin, calcium carbonate, organic solvent are respectively 40%:20% according to mass percent:
20%:20% carries out mechanical agitation, and the most churned mechanically speed is 60-100r/min, can be more preferably
70-90r/min, forms packaging slurry after stirring mixing, and at 25 DEG C, viscosity is about 150-170Pa*s, admittedly contain
Amount is 70-80%.
In the embodiment of slice component termination packaging slurry, metal dust, macromolecule resin, calcium carbonate, have
The mass percent of machine solvent is it may also is that 40%:20%:25%:15%, or 45%:20%:
20%:15%, or 35%:25%:30%:10%, or 40%:15%:35%:10%.
In addition it should be noted that in the present embodiment metal dust most preferably select argentum powder.
Embodiment two:
Present embodiments provide a kind of termination that packaging slurry is encapsulated in slice component and prepare the side of slice component
Method.The present embodiment uses critesistor chip in high precision as the citing of slice component, the encapsulating of its termination
Journey comprises the following steps:
(1) by argentum powder, macromolecule resin, calcium carbonate, organic solvent is respectively 40% according to mass percent:
20%:25%:15% carries out being mixed to form packaging slurry, wherein organic solvent can use propyl acetate and
Ethanol ratio by mass percentage is the mixture of 3:1 mixing, and macromolecule resin can use epoxy resin.
(2) packaging slurry prepared is screen-printed to critesistor by screen printer in 300-450 purpose high
Precision die termination, the encapsulating protective layer of print thickness 15-50 μm, as it is shown in figure 1, encapsulate for encapsulating is good
The critesistor high accuracy chip 1 of slurry 2.
(3) critesistor encapsulated high accuracy chip is placed at a temperature of drying baker 110 DEG C carry out drying solid
(i.e. organic solvent volatilizees at this temperature or becomes gas to distribute with air reaction, macromolecule resin simultaneously in change
By heat cure), the 2.5 hours time of baking and curing.
(4) one layer of slurry containing glass dust is sprayed by spraying coating process at critesistor high accuracy chip circumference,
Carburizing temperature 300-450 DEG C, decomposes macromolecule resin carbonization in packaging slurry, and burns at 860 DEG C
Knot, as in figure 2 it is shown, be fired into glass glaze 3 by the glass dust covered on critesistor high accuracy chip 1.
(5) burning the critesistor high accuracy chip after glass and pass through ultrasonic waves for cleaning, operating current 2.0A, during work
Between be 20min, the organic residue of termination carbonization, calcium carbonate cleans up, and dries the most again.
(6) at the two ends being covered with glass-glazed critesistor high accuracy chip, envelope last layer silver slurry, at 670 DEG C
Under be sintered, make critesistor high accuracy chip obtain good ohmic contact metal electrode.
The critesistor high accuracy chip prepared by above method, the resistance value concordance at 25 DEG C is good, product
1% precision qualification rate is high, has randomly drawed 30 finished products that 0402 nominal resistance is 100k Ω, to its resistance
Test, be specifically shown in Table 1.
Table 1 (unit: k Ω)
| Numbering | 1# | 2# | 3# | 4# | 5# | 6# | 7# | 8# |
| R25 | 100.32 | 99.43 | 99.05 | 101.02 | 100.78 | 100.21 | 99.54 | 99.67 |
| Numbering | 9# | 10# | 11# | 12# | 13# | 14# | 15# | 16# |
| R25 | 100.56 | 98.06 | 99.63 | 99.90 | 98.47 | 99.71 | 97.41 | 100.72 |
| Numbering | 17# | 18# | 19# | 20# | 21# | 22# | 23# | 24# |
| R25 | 100.29 | 99.69 | 100.62 | 101.02 | 99.44 | 98.97 | 100.01 | 100.57 |
| Numbering | 25# | 26# | 27# | 28# | 29# | 30# | ||
| R25 | 99.60 | 98.59 | 100.55 | 99.48 | 101.39 | 99.38 |
In the present embodiment, the critesistor high-precision product that packaging slurry prepares, 1% precision qualification rate are used
Reaching 73.3%, described packaging slurry ensures the raising of electrical precision significantly.The surface of the product simultaneously obtained is also
The defect such as salient point or burr does not occur.
Embodiment three:
The present embodiment also provides a kind of termination that packaging slurry is encapsulated in slice component and prepares slice component
Method.The present embodiment uses critesistor chip in high precision equally as the citing of slice component, its termination
Encapsulation process is essentially identical with the preparation method of embodiment two, and difference is, argentum powder, macromolecule in the present embodiment
Resin, calcium carbonate, organic solvent is respectively 45%:20%:20%:15% according to mass percent.
Randomly draw 30 chips that 0402 nominal resistance is 47k Ω made according to above-mentioned formula, to it
Resistance is tested, and is specifically shown in Table 2.
Table 2 (unit: k Ω)
In the present embodiment, the critesistor high-precision product that packaging slurry prepares, 1% precision qualification rate are used
Can reach 76.6%, described packaging slurry ensures the raising of electrical precision significantly.The table of the product simultaneously obtained
The most there is not the defect such as salient point or burr in face.
Above content is to combine concrete preferred implementation further description made for the present invention, it is impossible to
Assert the present invention be embodied as be confined to these explanations.For those skilled in the art
For, without departing from the inventive concept of the premise, it is also possible to make some equivalents and substitute or obvious modification, and
And performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a slice component termination packaging slurry, it is characterised in that by 35-45% by mass percentage
Metal dust, 15-25% macromolecule resin, 20-35% calcium carbonate and 10-20% organic solvent composition, and mix
Form.
2. slice component termination as claimed in claim 1 packaging slurry, it is characterised in that described metal powder
The mass percent at end is 40-45%, and the mass percent of described macromolecule resin is 15-20%, described carbonic acid
The mass percent of calcium is 25-30%.
3. slice component termination as claimed in claim 1 or 2 packaging slurry, it is characterised in that described gold
Genus powder is argentum powder, and described macromolecule resin is epoxy resin.
4. a preparation method for slice component, including the encapsulation process of slice component termination, it is characterised in that
The encapsulation process of described slice component termination comprises the following steps:
Packaging slurry described in any one of claims 1 to 3 is encapsulated in the termination of slice component.
5. the preparation method of slice component as claimed in claim 4, it is characterised in that by described encapsulating slurry
Material is encapsulated in the termination of slice component and comprises the following steps:
Described packaging slurry is screen-printed to slice component termination by screen printer in 300-450 purpose, is formed
Print thickness is the encapsulating protective layer of 15-50 μm.
6. the preparation method of slice component as claimed in claim 5, it is characterised in that described slice component
The encapsulation process of termination is further comprising the steps of:
The slice component termination forming described encapsulating protective layer is solidified 2-4 hour at 100-120 DEG C；
Slice component termination packaging slurry after solidification is carried out carbonization at 300-450 DEG C.
7. the preparation method of slice component as claimed in claim 6, it is characterised in that described slice component
The encapsulation process of termination is further comprising the steps of:
By the slice component termination packaging slurry after carbonization by ultrasonic waves for cleaning, operating current is 1-3A, work
It it is 10-25 minute as the time.
8. the preparation method of slice component as claimed in claim 5, it is characterised in that described print thickness
For 20-40 μm.
9. the preparation method of slice component as claimed in claim 6, it is characterised in that holding of described solidification
The continuous time is 2.5-3.5 hour, and the temperature of described carbonization is 370-430 DEG C.
10. the preparation method of the slice component as described in any one of claim 4 to 9, it is characterised in that institute
Stating packaging slurry to be mixed by mechanical agitation, described churned mechanically speed is 60-100r/min.
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| CN105070442B (en) * | 2015-07-23 | 2018-05-04 | 中国振华集团云科电子有限公司 | A kind of encapsulating method of chip thick film fixed resister |
| CN108288529B (en) * | 2018-01-19 | 2019-07-26 | 安徽建筑大学 | Bear the preparation method of low ageing rate negative temperature coefficient thermistor ceramic material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101268524A (en) * | 2005-09-15 | 2008-09-17 | 松下电器产业株式会社 | Chip-shaped electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2670756B2 (en) * | 1995-02-02 | 1997-10-29 | 釜屋電機株式会社 | Chip type fuse resistor and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1512522A (en) * | 2002-12-30 | 2004-07-14 | 广东风华高新科技集团有限公司 | Resin size used for chip resistor |
| CN101268524A (en) * | 2005-09-15 | 2008-09-17 | 松下电器产业株式会社 | Chip-shaped electronic component |
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