JP2670756B2 - Chip type fuse resistor and manufacturing method thereof - Google Patents
Chip type fuse resistor and manufacturing method thereofInfo
- Publication number
- JP2670756B2 JP2670756B2 JP7015709A JP1570995A JP2670756B2 JP 2670756 B2 JP2670756 B2 JP 2670756B2 JP 7015709 A JP7015709 A JP 7015709A JP 1570995 A JP1570995 A JP 1570995A JP 2670756 B2 JP2670756 B2 JP 2670756B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- thick film
- resistance
- paste
- fusing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、溶断特性において速断
性に優れ、抵抗部の破損を確実に防止することができる
チップ形ヒューズ抵抗器、及び上記チップ形ヒューズ抵
抗器を効率良く製造し、生産性を著しく向上させること
ができるチップ形ヒューズ抵抗器の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type fuse resistor which is excellent in quick-cutting property in terms of fusing characteristics and capable of reliably preventing breakage of a resistance portion, and to efficiently manufacture the chip-type fuse resistor, The present invention relates to a method for manufacturing a chip-type fuse resistor that can remarkably improve productivity.
【０００２】[0002]
【従来の技術】従来のチップ形ヒューズ抵抗器として
は、直方体チップ形状の絶縁基板上に配置した電極間に
真空蒸着法、スパッタ法、無電解めっき法により抵抗皮
膜を形成し、この抵抗皮膜にトリミング法により溶断部
（ヒューズ部）を形成し、その溶断部と前記基板との間
にガラスよりなる断熱層を介在させ、トリミングによる
負荷の集中とガラスの断熱性とによって過電流発生時の
抵抗皮膜の溶断時間を短縮するようにした構造のものが
知られている。2. Description of the Related Art As a conventional chip-type fuse resistor, a resistance film is formed between electrodes arranged on a rectangular chip-shaped insulating substrate by a vacuum deposition method, a sputtering method, or an electroless plating method. A fusing part (fuse part) is formed by a trimming method, and a heat insulating layer made of glass is interposed between the fusing part and the substrate. Due to the concentration of load due to trimming and the heat insulating property of the glass, resistance when an overcurrent occurs A structure having a structure designed to shorten the fusing time of the film is known.
【０００３】また、直方体チップ形状の絶縁基板上に活
性化層を形成し、無電解めっき法により抵抗皮膜を形成
した後、トリミング法により溶断部（電流集中部）を形
成し、その溶断部上に溶融材を設けた他の構造のものも
知られている。Further, an activation layer is formed on an insulating substrate having a rectangular parallelepiped chip shape, a resistance film is formed by an electroless plating method, and then a fusing part (current concentration part) is formed by a trimming method, and the fusing part is formed on the fusing part. Other structures in which a molten material is provided are also known.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上述し
た前者のチップ形ヒューズ抵抗器の場合には、断熱層が
部分的に形成されるため、その段差の影響により抵抗皮
膜が均一に形成されにくく、また抵抗皮膜が真空蒸着
法、スパッタ法、無電解めっき法により形成されるため
生産性に乏しいという欠点がある。However, in the case of the former chip type fuse resistor described above, since the heat insulating layer is partially formed, it is difficult to form the resistance film uniformly due to the influence of the step. Further, since the resistance film is formed by the vacuum vapor deposition method, the sputtering method or the electroless plating method, there is a drawback that the productivity is poor.
【０００５】一方、後者のチップ形ヒューズ抵抗器の場
合には、前者と同様に抵抗皮膜を形成するために無電解
めっき法を採用しているため生産性に乏しいという欠点
があるうえ、溶断部上に設けた溶融材が再現性に乏し
く、溶断特性の速断性に欠けるといった他の欠点があ
る。On the other hand, in the case of the latter chip type fuse resistor, the electroless plating method is used to form the resistance film as in the former case, and therefore, there is a drawback that the productivity is poor, and the fusing part is also cut off. There are other drawbacks such that the molten material provided above has poor reproducibility and lacks quick disconnection characteristics.
【０００６】更に、これら従来のチップ形ヒューズ抵抗
器は、溶断部及び抵抗部が分離形成されておらず、同一
材料から一体形成されるため、溶断特性と抵抗値とが上
記抵抗皮膜のシート抵抗（面積抵抗）に依存し、形状、
寸法上厳重な制約があり、良好な溶断特性を得ようとす
ると抵抗器としての信頼性の低下などといった欠点があ
った。なお、従来のチップ形ヒューズ抵抗器では通電異
常時（過電流発生時）における溶断後の残留抵抗は初期
抵抗値の約５０倍程度である。Further, in these conventional chip-type fuse resistors, the fusing part and the resistance part are not formed separately, but are integrally formed from the same material, so that the fusing characteristics and the resistance value are the sheet resistance of the resistance film. Shape, depending on (area resistance)
There are strict restrictions on dimensions, and there are drawbacks such as a decrease in reliability as a resistor when trying to obtain good fusing characteristics. Incidentally, in the conventional chip-type fuse resistor, the residual resistance after fusing at the time of abnormal conduction (when an overcurrent occurs) is about 50 times the initial resistance value.
【０００７】本発明は上述の従来の技術の欠点に着目
し、これを解決せんとしたものであり、その目的は、溶
断特性において速断性に優れ、しかも抵抗部の初期値に
関係なく溶断後の残留抵抗を高くし、開回路電圧を高く
することができると共に、抵抗部の破損を確実に防止す
ることができるチップ形ヒューズ抵抗器を提供すること
にある。The present invention focuses on the above-mentioned drawbacks of the prior art and solves this problem. The purpose thereof is to provide a fast cutting property in terms of fusing characteristics, and to be used after fusing regardless of the initial value of the resistance portion. It is an object of the present invention to provide a chip-type fuse resistor that can increase the residual resistance of the device, increase the open circuit voltage, and reliably prevent damage to the resistance portion.
【０００８】本発明の他の目的は、上記チップ形ヒュー
ズ抵抗器を効率良く製造し、生産性を著しく向上させる
ことができるチップ形ヒューズ抵抗器の製造方法を提供
することにある。Another object of the present invention is to provide a method for manufacturing a chip-type fuse resistor, which can efficiently manufacture the above-mentioned chip-type fuse resistor and remarkably improve the productivity.
【０００９】[0009]
【課題を解決するための手段】本発明は上記の目的に鑑
みてなされたものであり、その要旨とするところは、金
属有機物ペーストからなる膜厚１μｍ未満の薄膜溶断部
と、酸化ルテニウム系ペースト等の厚膜ペーストからな
る膜厚１μｍ以上の厚膜抵抗部と、金属有機物ペースト
からなり、上記薄膜溶断部及び厚膜抵抗部を各々独立し
て配設するための各配設位置を備える導体パターンと、
を絶縁基板上に形成することを特徴とするチップ形ヒュ
ーズ抵抗器にある。SUMMARY OF THE INVENTION The present invention has been made in view of the above objects, and its gist is to provide a thin film fusing part made of a metal organic paste having a film thickness of less than 1 μm and a ruthenium oxide paste. A thick film resistor portion having a film thickness of 1 μm or more, which is made of a thick film paste, etc., and a metal organic paste, and conductors having respective positions for independently arranging the thin film fusing portion and the thick film resistor portion. Pattern,
In a chip-type fuse resistor characterized in that is formed on an insulating substrate.
【００１０】薄膜溶断部は、生産性を向上させるために
金属有機物ペーストを用いる。また、高い残留抵抗、及
び速断性に優れる溶断特性を得るために膜厚は１μｍ未
満にする必要がある。このように形成することによって
ヒューズ抵抗器の溶断機能と生産性の向上が図られる。The thin film fusing part uses a metal organic paste in order to improve productivity. Further, the film thickness needs to be less than 1 μm in order to obtain high residual resistance and fusing characteristics that are excellent in quick disconnection. By forming in this way, the fusing function of the fuse resistor and the productivity can be improved.
【００１１】厚膜抵抗部は、ヒューズ抵抗器の抵抗機能
を信頼性の良い従来の厚膜抵抗相当にするために酸化ル
テニウム系ペースト等の厚膜ペーストを用いる。厚膜ペ
ーストとしては、酸化ルテニウム系ペーストの他、銀パ
ラジウム系厚膜ペーストを掲げることができるが、特に
上記酸化ルテニウム系ペーストを用いることによって、
抵抗値の自由度を高く、また抵抗値の信頼性、特に耐湿
性を良好にすることができる。また、この厚膜抵抗部
は、従来の厚膜抵抗として良好な信頼性を発揮させるた
めに膜厚１μｍ以上にする必要がある。このように形成
することによってヒューズ抵抗器の抵抗機能、且つ生産
性を向上させる溶断機能としても速断性をもたせること
が可能となる。The thick film resistor section uses a thick film paste such as a ruthenium oxide paste in order to make the resistance function of the fuse resistor correspond to a reliable conventional thick film resistor. As the thick film paste, in addition to the ruthenium oxide-based paste, it is possible to cite a silver palladium-based thick film paste, in particular, by using the ruthenium oxide-based paste,
The degree of freedom of the resistance value can be increased, and the reliability of the resistance value, especially the moisture resistance can be improved. Further, this thick film resistance portion needs to have a film thickness of 1 μm or more in order to exhibit good reliability as a conventional thick film resistance. By forming in this way, it becomes possible to provide the fuse resistor with a resistance function and also as a fusing function for improving productivity.
【００１２】導体パターンは、上記薄膜溶断部及び厚膜
抵抗部を各々独立して配設するための各配設位置を備え
るように、また薄膜溶断部及び厚膜抵抗部の共用の導体
として機能を発揮させるために金属有機物ペーストで形
成する。この導体パターンの形成材料、及び上記薄膜溶
断部の形成材料として、同一の金属有機物ペーストを用
いることは無論可能であり、薄膜溶断部及び導体パター
ンは同時に形成することもできる。The conductor pattern is provided with respective placement positions for independently arranging the thin film fusing part and the thick film resistance part, and also functions as a common conductor for the thin film fusing part and the thick film resistance part. It is formed of a metal organic paste in order to bring out the effect. It is of course possible to use the same metal organic paste as the material for forming the conductor pattern and the material for forming the thin film fusing part, and the thin film fusing part and the conductor pattern can be formed at the same time.
【００１３】金属有機物ペーストとして用いる金属とし
ては、金、銀、白金、ロジウム、パラジウム等を掲げる
ことができ、これらのうち少なくとも１種を含む金属有
機物ペーストを用いる。Examples of the metal used as the metal organic paste include gold, silver, platinum, rhodium, palladium and the like, and the metal organic paste containing at least one of these is used.
【００１４】上述したように、本発明のチップ形ヒュー
ズ抵抗器では、薄膜溶断部及び厚膜抵抗部を異なる形成
材料によって独立して設けており、しかも薄膜溶断部を
１μｍ未満の薄膜にすると共に、厚膜抵抗部を１μｍ以
上の厚膜にしたこと、即ち厚膜抵抗部を上述のように厚
膜にして当該厚膜抵抗部の形成に要する面積（領域）を
狭くしたことで、残りの広い面積（領域）に薄膜溶断部
を形成することが可能となる。このように、薄膜溶断部
及び厚膜抵抗部を各々の独立して配設したこと、更に溶
断部を金属有機物ペーストを用い、薄膜として形成した
ことによって過電流発生時の優れた速断性を発揮し、ま
た厚膜抵抗部が薄膜溶断部より先に溶断してしまうとい
った心配がなく、抵抗部の確実な破損防止を可能にす
る。As described above, in the chip-type fuse resistor of the present invention, the thin film fusing part and the thick film fusing part are independently provided by different forming materials, and the thin film fusing part is formed as a thin film of less than 1 μm. Since the thick film resistance portion is formed to be a thick film of 1 μm or more, that is, the thick film resistance portion is formed to be a thick film as described above to reduce the area (region) required for forming the thick film resistance portion, It becomes possible to form the thin film fusing part in a wide area (region). In this way, by arranging the thin film fusing part and the thick film resistance part independently, and by forming the fusing part as a thin film using a metal organic paste, excellent quick disconnection property at the time of overcurrent occurrence is demonstrated. In addition, there is no concern that the thick-film resistance portion will melt before the thin-film melting portion, and it is possible to reliably prevent damage to the resistance portion.
【００１５】本発明の他の要旨は、絶縁基板上に金属有
機物ペーストからなり、且つ薄膜溶断部及び厚膜抵抗部
を各々独立して配設するための各配設位置を備える導体
パターンをスクリーン印刷法及び／又はフォトエッチン
グ法によって形成する工程と、該導体パターンの所定配
設位置に酸化ルテニウム系ペースト等の厚膜ペーストか
らなる膜厚１μｍ以上の厚膜抵抗部をスクリーン印刷法
によって形成する工程と、上記導体パターンの所定配設
位置に金属有機物ペーストからなる膜厚１μｍ未満の薄
膜溶断部をスクリーン印刷法及び／又はフォトエッチン
グ法によって形成する工程と、厚膜抵抗部を抵抗値調整
を行なうトリミング工程と、保護膜を形成する工程と、
を含むことを特徴とするチップ形ヒューズ抵抗器の製造
方法にある。Another aspect of the present invention is to screen a conductor pattern, which is made of a metal organic paste on an insulating substrate, and has respective placement positions for independently arranging the thin film fusing part and the thick film resistance part. A step of forming by a printing method and / or a photo-etching method, and a thick film resistance portion having a film thickness of 1 μm or more made of a thick film paste such as a ruthenium oxide paste or the like is formed by a screen printing method at a predetermined position of the conductor pattern. A step of forming a thin film fusing part made of a metal organic paste having a film thickness of less than 1 μm at a predetermined position of the conductor pattern by a screen printing method and / or a photo-etching method, and adjusting a resistance value of the thick film resistance part. A trimming step to be performed, a step of forming a protective film,
And a method of manufacturing a chip-type fuse resistor.
【００１６】上記導体パターンを形成する工程において
は、薄膜溶断部及び厚膜抵抗部を各々独立して配設する
ための各配設位置を備える導体パターンをスクリーン印
刷法及び／又はフォトエッチング法により金、銀、白
金、ロジウム、パラジウム等の金属有機物ペーストで形
成する。この導体パターンの形成材料と、薄膜溶断部の
形成材料とが同一の金属有機物ペーストである場合に
は、スクリーン印刷法及び／又はフォトエッチング法に
よって同時に形成することもでき、これによってより生
産性を向上することができる。In the step of forming the conductor pattern, the conductor pattern having the respective disposition positions for independently disposing the thin film fusing part and the thick film resistance part is formed by the screen printing method and / or the photoetching method. It is formed of a metal organic paste such as gold, silver, platinum, rhodium or palladium. When the material for forming the conductor pattern and the material for forming the thin film fusing part are the same metal organic paste, they can be simultaneously formed by the screen printing method and / or the photo-etching method, thereby further improving the productivity. Can be improved.
【００１７】また、厚膜抵抗部を形成する工程において
は、酸化ルテニウム系ペースト等の厚膜ペーストからな
る厚膜抵抗部をスクリーン印刷法によって導体パターン
の所定配設位置に形成する。Further, in the step of forming the thick film resistance portion, the thick film resistance portion made of a thick film paste such as a ruthenium oxide paste is formed at a predetermined position of the conductor pattern by screen printing.
【００１８】薄膜溶断部を形成する工程においては、薄
膜溶断部をスクリーン印刷法及び／又はフォトエッチン
グ法により金、銀、白金、ロジウム、パラジウム等の金
属有機物ペーストで上記導体パターンの所定配設位置に
形成する。In the step of forming the thin film fusing part, the thin film fusing part is formed by a screen printing method and / or a photoetching method with a metal organic paste such as gold, silver, platinum, rhodium, or palladium at a predetermined position of the conductor pattern. To form.
【００１９】トリミング工程においては、厚膜抵抗部の
抵抗値調整をレーザートリミング法等によって行ない、
また保護膜を形成する工程においては、上記厚膜抵抗部
の耐環境性及びめっき時の保護として働く保護膜によっ
て溶断部、抵抗部、及び電極部の一部（導体パターン）
を被覆する。そして、ニッケル、はんだ等の電極膜を形
成する。In the trimming step, the resistance value of the thick film resistance portion is adjusted by a laser trimming method,
In the step of forming the protective film, the fusing part, the resistance part, and a part of the electrode part (conductor pattern) are formed by the protective film that functions as environmental resistance of the thick film resistance part and protection during plating.
Is coated. Then, an electrode film of nickel, solder or the like is formed.
【００２０】このように、導体パターン及び薄膜溶断部
をスクリーン印刷法及び／又はフォトエッチング法によ
って形成すると共に、厚膜抵抗部をスクリーン印刷法に
よって形成し、ヒューズとして機能する部分と、抵抗と
して機能する部分とを分離させるようにしたので、通電
正常時には厚膜抵抗としての高い信頼性のある抵抗器と
して機能し、通電異常時（過電流発生時）には溶断特性
において速断性に優れるヒューズとして機能するチップ
形ヒューズ抵抗器を効率良く製造し、生産性を著しく向
上させることができる。As described above, the conductor pattern and the thin film fusing part are formed by the screen printing method and / or the photo-etching method, and the thick film resistance part is formed by the screen printing method. Since it is separated from the part to be activated, it functions as a highly reliable resistor as a thick film resistance when the current is normally applied, and as a fuse with excellent fast-acting characteristics in the fusing characteristics when the current is abnormal (when an overcurrent occurs). It is possible to efficiently manufacture a functioning chip fuse resistor and significantly improve productivity.
【００２１】[0021]
【作用】本発明のチップ形ヒューズ抵抗器は、絶縁基板
上に形成された金属有機物ペーストからなる導体パター
ンが、薄膜溶断部及び厚膜抵抗部の形成にかかる各々の
独立した配設位置を確保し、各配設位置に金属有機物ペ
ーストからなる膜厚１μｍ未満の薄膜溶断部、及び酸化
ルテニウム系ペーストなどの厚膜ペーストからなる膜厚
１μｍ以上の厚膜抵抗部を独立して形成した構造とした
ことによって過電流発生時の迅速な溶断を可能にすると
共に、抵抗部の確実な破損防止を可能にする。In the chip-type fuse resistor of the present invention, the conductor pattern made of the metal organic paste formed on the insulating substrate ensures the independent placement positions for forming the thin film fusing part and the thick film resistance part. And a structure in which a thin film fusing part having a film thickness of less than 1 μm made of a metal organic paste and a thick film resistance part having a film thickness of 1 μm or more made of a thick film paste such as a ruthenium oxide paste are independently formed at respective positions. By doing so, it is possible to quickly fuse the overcurrent when it occurs, and to prevent the resistance part from being damaged.
【００２２】また、本発明のチップ形ヒューズ抵抗器の
製造方法は、まず絶縁基板上に金属有機物ペーストから
なり、且つ薄膜溶断部及び厚膜抵抗部を各々独立して配
設するための各配設位置を備える導体パターンをスクリ
ーン印刷法及び／又はフォトエッチング法によって形成
し、次いで該導体パターンの所定配設位置に酸化ルテニ
ウム系ペーストなどの厚膜ペーストからなる膜厚１μｍ
以上の厚膜抵抗部をスクリーン印刷法によって形成す
る。そして上記導体パターンの所定配設位置に金属有機
物ペーストからなる膜厚１μｍ未満の薄膜溶断部をスク
リーン印刷法及び／又はフォトエッチング法によって形
成し、更に厚膜抵抗部を抵抗値調整を行なった後、保護
膜を形成する。このように、導体パターン及び薄膜溶断
部をスクリーン印刷法及び／又はフォトエッチング法に
よって形成すると共に、厚膜抵抗部をスクリーン印刷法
によって形成し、通電正常時には厚膜抵抗として高い信
頼性のある抵抗器として機能し、且つ通電異常時（過電
流発生時）には速断性に優れるヒューズとして機能する
チップ形ヒューズ抵抗器を効率良く製造し、生産性を著
しく向上させる。Further, in the method of manufacturing the chip fuse resistor of the present invention, first, the respective arrangements for forming the thin film fusing portion and the thick film resistance portion independently of each other are made of the metal organic paste on the insulating substrate. A conductor pattern having an arranging position is formed by a screen printing method and / or a photoetching method, and then a film thickness of 1 μm made of a thick film paste such as a ruthenium oxide paste at a predetermined arranging position of the conductor pattern.
The thick film resistance portion described above is formed by screen printing. Then, a thin film fusing part made of a metal organic paste having a film thickness of less than 1 μm is formed at a predetermined position of the conductor pattern by a screen printing method and / or a photoetching method, and a thick film resistance part is further adjusted in resistance value. , Forming a protective film. In this way, the conductor pattern and the thin film fusing part are formed by the screen printing method and / or the photo-etching method, and the thick film resistance part is formed by the screen printing method. To efficiently manufacture a chip-type fuse resistor that functions as a fuse, and that functions as a fuse having excellent quick disconnection when an abnormal current flow occurs (when an overcurrent occurs), and remarkably improve productivity.
【００２３】[0023]
【実施例】以下、本発明の実施例を添付図面に基づいて
説明するが、本発明はこれに限定されるものではない。Embodiments of the present invention will be described below with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
【００２４】図１は本発明のチップ形ヒューズ抵抗器の
実施例を示す縦断面図、図２は本発明のチップ形ヒュー
ズ抵抗器と従来のチップ形ヒューズ抵抗器との溶断特性
を示すグラフである。FIG. 1 is a longitudinal sectional view showing an embodiment of a chip type fuse resistor of the present invention, and FIG. 2 is a graph showing a fusing characteristic of the chip type fuse resistor of the present invention and a conventional chip type fuse resistor. is there.
【００２５】本発明のチップ形ヒューズ抵抗器１０は、
図１に示すように、金属有機物ペースト（例えば金）か
らなる膜厚１μｍ未満の薄膜溶断部１１と、酸化ルテニ
ウム系ペースト等からなる膜厚１μｍ以上の厚膜抵抗部
１２と、金属有機物ペースト（例えば金）からなり、且
つ上記溶断部及び抵抗部を配設位置を各々独立して配設
するための備える導体パターン１３と、を絶縁基板１４
上に形成することによって構成される。The chip fuse resistor 10 of the present invention is
As shown in FIG. 1, a thin film fusing part 11 made of a metal organic paste (for example, gold) having a film thickness of less than 1 μm, a thick film resistance part 12 made of ruthenium oxide paste or the like having a film thickness of 1 μm or more, and a metal organic paste ( A conductor pattern 13 made of, for example, gold and provided for arranging the fusing portion and the resistance portion independently of each other at an insulating substrate 14
It is constructed by forming on top.
【００２６】まず絶縁基板１４上には、導体パターン１
３及び薄膜溶断部１１がスクリーン印刷法により金属有
機物ペーストで形成されている。First, the conductor pattern 1 is formed on the insulating substrate 14.
3 and the thin film fusing part 11 are formed of a metal organic paste by a screen printing method.
【００２７】上記導体パターン上の所定位置には、厚膜
抵抗部１２がスクリーン印刷法により酸化ルテニウム系
ペーストで形成している。また形成した厚膜抵抗部１２
は、レーザトリミング法によって抵抗値が調整され、そ
してガラスペーストからなる保護膜１５が形成されてい
る。A thick film resistor portion 12 is formed of a ruthenium oxide based paste by a screen printing method at a predetermined position on the conductor pattern. In addition, the thick film resistor portion 12 formed
Has a resistance value adjusted by a laser trimming method, and a protective film 15 made of glass paste is formed.
【００２８】そして、銀系の厚膜ペーストからなる下地
電極１６をスクリーン印刷法によって形成した後、ニッ
ケル、はんだからなるめっき膜１７を形成している。Then, after forming the base electrode 16 made of a silver-based thick film paste by screen printing, a plating film 17 made of nickel and solder is formed.
【００２９】このように構成された本発明のチップ形ヒ
ューズ抵抗器１０の溶断特性は（図２において示す
Ａ）、図２に示すように、従来のチップ形ヒューズ抵抗
器の溶断特性（図２において示すＢ）に比べて優れた速
断性を有する。また、本発明のチップ形ヒューズ抵抗器
の負荷寿命、耐湿負荷寿命について１０００時間の試験
を試みたところ、従来のチップ形ヒューズ抵抗器では抵
抗値が約５％以上変化していたのに対し、本発明のチッ
プ形ヒューズ抵抗器１０では抵抗値の変化を１．５％以
下にとどめることができ、抵抗値の安定性において従来
のチップ形ヒューズ抵抗器に比べ優れていることが明ら
かになった。The fusing characteristic of the chip-type fuse resistor 10 of the present invention thus constructed (A in FIG. 2) is, as shown in FIG. 2, the fusing characteristic of the conventional chip-type fuse resistor (see FIG. 2). It has an excellent quick-moving property as compared with B) shown in 1. When a load life and a moisture resistance load life of the chip-type fuse resistor of the present invention were tested for 1000 hours, the resistance value of the conventional chip-type fuse resistor changed by about 5% or more. With the chip-type fuse resistor 10 of the present invention, the change in the resistance value can be kept to 1.5% or less, and it has been revealed that the stability of the resistance value is superior to the conventional chip-type fuse resistor. .
【００３０】上記チップ形ヒューズ抵抗器１０の製造に
おいては、上述したように、導体パターン及び薄膜溶断
部をスクリーン印刷法及び／又はフォトエッチング法に
よって形成すると共に、厚膜抵抗部をスクリーン印刷法
によって形成する。これによって溶断特性の速断性に優
れたチップ形ヒューズ抵抗器を効率良く製造し、生産性
を著しく向上させることができる。In the manufacture of the chip-type fuse resistor 10, as described above, the conductor pattern and the thin film fusing part are formed by the screen printing method and / or the photo-etching method, and the thick film resistance part is formed by the screen printing method. Form. As a result, it is possible to efficiently manufacture a chip-type fuse resistor having excellent fusing characteristics and to significantly improve productivity.
【００３１】[0031]
【発明の効果】本発明のチップ形ヒューズ抵抗器では、
絶縁基板上に形成された金属有機物ペーストからなる導
体パターンが、薄膜溶断部及び厚膜抵抗部の形成にかか
る各々の独立した配設位置を確保し、各配設位置に金属
有機物ペーストからなる膜厚１μｍ未満の薄膜溶断部、
及び厚膜ペーストからなる膜厚１μｍ以上の厚膜抵抗部
を上記導体パターンを分離して形成した構造としたの
で、溶断特性における速断性に優れ、しかも抵抗部の初
期抵抗値に関係なく溶断後の残留抵抗を１０8 Ω以上と
し、開回路電圧を高くすることができると共に、抵抗部
の破損を確実に防止することができるチップ形ヒューズ
抵抗器を提供することができるといった顕著な効果を奏
する。According to the chip type fuse resistor of the present invention,
The conductor pattern made of the metal organic paste formed on the insulating substrate secures each independent placement position for forming the thin film fusing part and the thick film resistor part, and the film made of the metal organic paste at each placement position. Thin film fusing part with a thickness of less than 1 μm,
Also, since the thick film resistor portion having a film thickness of 1 μm or more made of thick film paste is formed by separating the above conductor pattern, it is excellent in quick disconnection property in the fusing property, and after fusing regardless of the initial resistance value of the resistor part. Has a residual resistance of 10 8 Ω or more, which makes it possible to provide a chip-type fuse resistor capable of increasing the open circuit voltage and reliably preventing damage to the resistance portion. .
【００３２】また、本発明のチップ形ヒューズ抵抗器の
製造方法では、まず絶縁基板上に金属有機物ペーストか
らなり、且つ薄膜溶断部及び厚膜抵抗部を各々独立して
配設するための各配設位置を備える導体パターンをスク
リーン印刷法及び／又はフォトエッチング法によって形
成し、次いで該導体パターンの所定配設位置に厚膜ペー
ストからなる膜厚１μｍ以上の厚膜抵抗部をスクリーン
印刷法によって形成し、そして上記導体パターンの所定
配設位置に金属有機物ペーストからなる膜厚１μｍ未満
の薄膜溶断部をスクリーン印刷法及び／又はフォトエッ
チング法によって形成し、更に厚膜抵抗部を抵抗値調整
を行なった後、保護膜を形成するようにしたので、上記
チップ形ヒューズ抵抗器を効率良く製造し、生産性を著
しく向上させることができる。Further, in the method of manufacturing the chip fuse resistor of the present invention, first, the respective arrangements for forming the thin film fusing part and the thick film resistance part independently of each other are made of the metal organic paste on the insulating substrate. A conductor pattern having an arranging position is formed by a screen printing method and / or a photo-etching method, and then a thick film resistor portion having a film thickness of 1 μm or more made of a thick film paste is formed by a screen printing method at a predetermined arranging position of the conductor pattern. Then, a thin film fusing part made of a metal organic paste having a film thickness of less than 1 μm is formed at a predetermined position of the conductor pattern by a screen printing method and / or a photo-etching method, and a thick film resistance part is subjected to resistance value adjustment. After that, a protective film is formed, so that the above chip-type fuse resistor can be manufactured efficiently and the productivity can be significantly improved. Can be.
【図１】本発明のチップ形ヒューズ抵抗器の実施例を示
す縦断面図である。FIG. 1 is a vertical sectional view showing an embodiment of a chip fuse resistor of the present invention.
【図２】本発明のチップ形ヒューズ抵抗器と従来のチッ
プ形抵抗器との溶断特性を示すグラフである。FIG. 2 is a graph showing the fusing characteristics of the chip fuse resistor of the present invention and the conventional chip resistor.
１０ チップ形ヒューズ抵抗器 １１ 薄膜溶断部 １２ 厚膜抵抗部 １３ 導体パターン １４ 絶縁基板 １５ 保護膜 １６ 下地電極 １７ めっき膜 Ａ 本発明のチップ形ヒューズ抵抗器１０の溶断特性 Ｂ 従来のチップ形ヒューズ抵抗器の溶断特性 10 Chip Fuse Resistor 11 Thin Film Fusing Part 12 Thick Film Resisting Part 13 Conductor Pattern 14 Insulating Substrate 15 Protective Film 16 Base Electrode 17 Plating Film A Fusing Characteristics of the Chip Fuse Resistor 10 of the Present Invention B Conventional Chip Fuse Resistor Fusing characteristics of vessel
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｃ 17/22 Ｈ０１Ｃ 17/22 Ｃ Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location H01C 17/22 H01C 17/22 C
Claims (2)
未満の薄膜溶断部と、厚膜ペーストからなる膜厚１μｍ
以上の厚膜抵抗部と、金属有機物ペーストからなり、且
つ上記薄膜溶断部及び厚膜抵抗部を各々独立して配設す
るための各配設位置を備える導体パターンと、を絶縁基
板上に形成することを特徴とするチップ形ヒューズ抵抗
器。1. A film thickness of 1 μm made of a metal organic paste
Film thickness of 1μm consisting of thick film paste and thin film fusing part
On the insulating substrate, the above thick film resistor portion and a conductor pattern made of a metal organic paste and provided with respective placement positions for independently arranging the thin film fusing portion and the thick film resistor portion are formed. A chip-type fuse resistor characterized in that
り、且つ薄膜溶断部及び厚膜抵抗部を各々の独立して配
設するため各配設位置を備える導体パターンをスクリー
ン印刷法及び／又はフォトエッチング法によって形成す
る工程と、該導体パターンの所定配設位置に厚膜ペース
トからなる膜厚１μｍ以上の厚膜抵抗部をスクリーン印
刷法によって形成する工程と、上記導体パターンの所定
配設位置に金属有機物ペーストからなる膜厚１μｍ未満
の薄膜溶断部をスクリーン印刷法及び／又はフォトエッ
チング法によって形成する工程と、厚膜抵抗部の抵抗値
調整を行なうトリミング工程と、保護膜を形成する工程
と、を含むことを特徴とするチップ形ヒューズ抵抗器の
製造方法。2. A conductor pattern made of a metal organic paste on an insulating substrate and provided with respective placement positions for independently arranging the thin film fusing part and the thick film resistance part by screen printing and / or photo A step of forming by an etching method, a step of forming a thick film resistance portion made of a thick film paste and having a film thickness of 1 μm or more at a predetermined arrangement position of the conductor pattern by a screen printing method, and a step of forming the conductor pattern at a predetermined arrangement position. A step of forming a thin film fusing part made of a metal organic paste with a film thickness of less than 1 μm by a screen printing method and / or a photoetching method, a trimming step for adjusting a resistance value of a thick film resistance part, and a step of forming a protective film. A method for manufacturing a chip-type fuse resistor, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7015709A JP2670756B2 (en) | 1995-02-02 | 1995-02-02 | Chip type fuse resistor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7015709A JP2670756B2 (en) | 1995-02-02 | 1995-02-02 | Chip type fuse resistor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08213216A JPH08213216A (en) | 1996-08-20 |
| JP2670756B2 true JP2670756B2 (en) | 1997-10-29 |
Family
ID=11896303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7015709A Expired - Lifetime JP2670756B2 (en) | 1995-02-02 | 1995-02-02 | Chip type fuse resistor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2670756B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4396787B2 (en) * | 1998-06-11 | 2010-01-13 | 内橋エステック株式会社 | Thin temperature fuse and method of manufacturing thin temperature fuse |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| CN103632781B (en) * | 2013-12-13 | 2016-08-24 | 深圳顺络电子股份有限公司 | Slice component termination packaging slurry and the preparation method of slice component |
-
1995
- 1995-02-02 JP JP7015709A patent/JP2670756B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08213216A (en) | 1996-08-20 |
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