CN100396424C - 激光加工设备、加工方法及利用其制造电路板的方法 - Google Patents

激光加工设备、加工方法及利用其制造电路板的方法 Download PDF

Info

Publication number
CN100396424C
CN100396424C CNB038188279A CN03818827A CN100396424C CN 100396424 C CN100396424 C CN 100396424C CN B038188279 A CNB038188279 A CN B038188279A CN 03818827 A CN03818827 A CN 03818827A CN 100396424 C CN100396424 C CN 100396424C
Authority
CN
China
Prior art keywords
laser beam
light path
described laser
energy distribution
optical path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038188279A
Other languages
English (en)
Chinese (zh)
Other versions
CN1675020A (zh
Inventor
赤坂朗
伊藤敏文
高桥喜久夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN1675020A publication Critical patent/CN1675020A/zh
Application granted granted Critical
Publication of CN100396424C publication Critical patent/CN100396424C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
CNB038188279A 2002-08-09 2003-08-07 激光加工设备、加工方法及利用其制造电路板的方法 Expired - Fee Related CN100396424C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002232609A JP2004066327A (ja) 2002-08-09 2002-08-09 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
JP232609/2002 2002-08-09

Publications (2)

Publication Number Publication Date
CN1675020A CN1675020A (zh) 2005-09-28
CN100396424C true CN100396424C (zh) 2008-06-25

Family

ID=31711839

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038188279A Expired - Fee Related CN100396424C (zh) 2002-08-09 2003-08-07 激光加工设备、加工方法及利用其制造电路板的方法

Country Status (4)

Country Link
US (1) US7807944B2 (https=)
JP (1) JP2004066327A (https=)
CN (1) CN100396424C (https=)
WO (1) WO2004014595A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102441739A (zh) * 2010-09-30 2012-05-09 三星钻石工业股份有限公司 激光加工装置、被加工物的加工方法及被加工物的分割方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4579575B2 (ja) 2004-05-14 2010-11-10 株式会社半導体エネルギー研究所 レーザ照射方法及びレーザ照射装置
DE102005019756A1 (de) * 2005-04-28 2006-11-02 Sms Elotherm Gmbh Vorrichtung und Verfahren zum Behandeln von zylindrisch geformten Flächen mittels Laserstrahls
WO2007049525A1 (en) 2005-10-26 2007-05-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and manufacturing method of semiconductor device
US7945087B2 (en) 2006-06-26 2011-05-17 Orbotech Ltd. Alignment of printed circuit board targets
KR101414867B1 (ko) * 2006-06-26 2014-07-03 오르보테크 엘티디. 인쇄 회로 기판 타깃의 정렬
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
CN102350591B (zh) * 2011-07-08 2015-01-28 厦门大学 矩形水波导激光加工装置
US9931712B2 (en) * 2012-01-11 2018-04-03 Pim Snow Leopard Inc. Laser drilling and trepanning device
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
JP6599098B2 (ja) * 2014-12-12 2019-10-30 株式会社ディスコ レーザー加工装置
WO2017109928A1 (ja) * 2015-12-25 2017-06-29 ギガフォトン株式会社 レーザ照射装置
CN107092166B (zh) * 2016-02-18 2019-01-29 上海微电子装备（集团）股份有限公司 曝光系统、曝光装置及曝光方法
JP6306659B1 (ja) * 2016-10-19 2018-04-04 ファナック株式会社 ビーム分配器
CN107234345B (zh) * 2017-07-14 2019-06-14 大族激光科技产业集团股份有限公司 一种激光切割系统及其切割方法
CN107702797B (zh) * 2017-08-31 2023-06-23 中国工程物理研究院激光聚变研究中心 可调谐脉冲序列发生装置
TWI686256B (zh) * 2018-04-13 2020-03-01 財團法人工業技術研究院 雷射清潔裝置及方法
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
CN110587123A (zh) * 2019-09-17 2019-12-20 深圳市牧激科技有限公司 激光加工装置及其加工方法
CN110893519A (zh) * 2019-12-26 2020-03-20 深圳中科光子科技有限公司 一种双光源四工位的激光加工设备及加工方法
CN111922511A (zh) * 2020-06-12 2020-11-13 大族激光科技产业集团股份有限公司 一种激光加工装置、加工设备、加工系统及加工方法
CN111922521B (zh) * 2020-07-10 2021-09-03 清华大学 一种实现聚酰亚胺烧蚀或碳化的飞秒激光加工系统和方法
CN112589813B (zh) * 2020-12-15 2025-10-28 青岛丰光精密机械股份有限公司 工业机器人手臂关节切割系统
JP2022105463A (ja) * 2021-01-02 2022-07-14 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
CN114465080A (zh) * 2022-02-09 2022-05-10 江苏亮点光电科技有限公司 一种扇角可切换的一字线激光器
CN114951975A (zh) * 2022-05-31 2022-08-30 苏州科韵激光科技有限公司 激光加工设备和方法
CN119794622B (zh) * 2024-12-18 2025-11-28 北京理工大学 一种时/频整形激光在厚电极上构建超低损耗通孔的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106328A (zh) * 1993-07-13 1995-08-09 松下电器产业株式会社 激光照射装置
EP1043110A2 (en) * 1999-04-02 2000-10-11 Murata Manufacturing Co., Ltd. Method for machining ceramic green sheet and apparatus for machining the same
CN1337896A (zh) * 1999-03-05 2002-02-27 三菱电机株式会社 激光加工装置
JP2002096187A (ja) * 2000-09-18 2002-04-02 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法
US20020040893A1 (en) * 2000-10-06 2002-04-11 Hitachi Via Mechanics, Ltd. Method and apparatus for drilling printed wiring boards

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0199793A (ja) 1987-10-09 1989-04-18 Mitsubishi Electric Corp レーザー分光装置
JP2683926B2 (ja) * 1988-01-25 1997-12-03 三菱電機株式会社 絶縁被覆電線の被覆剥離方法及びその装置
JPH058072A (ja) 1991-07-04 1993-01-19 Nec Corp レーザ加工方法
JPH07331422A (ja) 1994-06-09 1995-12-19 Toshiba Corp レーザ・アブレーション装置
US5523543A (en) * 1994-09-09 1996-06-04 Litel Instruments Laser ablation control system and method
US6373026B1 (en) * 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
JP3159906B2 (ja) * 1995-10-23 2001-04-23 アルプス電気株式会社 液晶表示素子の製造方法
US5837961A (en) * 1995-11-24 1998-11-17 Miller; Richard T. Laser wire stripping apparatus having multiple synchronous mirrors and a method therefor
JPH09164493A (ja) 1995-12-18 1997-06-24 Mitsubishi Electric Corp レーザ加工装置
JPH10137959A (ja) 1996-11-07 1998-05-26 Sanei Kikai:Kk レーザ加工装置
US5948219A (en) * 1997-05-07 1999-09-07 Advanced Micro Devices, Inc. Apparatus for selectively exposing a semiconductor topography to an electric field
JPH1147965A (ja) 1997-05-28 1999-02-23 Komatsu Ltd レーザ加工装置
JP3175006B2 (ja) 1997-05-28 2001-06-11 住友重機械工業株式会社 レーザ加工装置及び加工方法
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
JPH11147188A (ja) 1997-11-13 1999-06-02 Toshiba Corp レ−ザ加工装置
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
JP2000280085A (ja) 1999-03-30 2000-10-10 Seiko Epson Corp レーザ加工装置及びその加工方法
EP1072350A1 (de) 1999-07-12 2001-01-31 MDC Max Dätwyler AG Bleienbach Verfahren zur Erzeugung einer Intensitätsverteilung über einen Arbeitslaserstrahl sowie Vorrichtung hierzu
JP2002217550A (ja) 2001-01-16 2002-08-02 Toshiba Corp レーザ加工方法、レーザ加工装置および多層配線基板の製造方法
US6621044B2 (en) * 2001-01-18 2003-09-16 Anvik Corporation Dual-beam materials-processing system
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
JP3687607B2 (ja) * 2001-12-25 2005-08-24 松下電工株式会社 プリプレグの切断方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1106328A (zh) * 1993-07-13 1995-08-09 松下电器产业株式会社 激光照射装置
CN1337896A (zh) * 1999-03-05 2002-02-27 三菱电机株式会社 激光加工装置
EP1043110A2 (en) * 1999-04-02 2000-10-11 Murata Manufacturing Co., Ltd. Method for machining ceramic green sheet and apparatus for machining the same
JP2002096187A (ja) * 2000-09-18 2002-04-02 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法
US20020040893A1 (en) * 2000-10-06 2002-04-11 Hitachi Via Mechanics, Ltd. Method and apparatus for drilling printed wiring boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102441739A (zh) * 2010-09-30 2012-05-09 三星钻石工业股份有限公司 激光加工装置、被加工物的加工方法及被加工物的分割方法
CN102441739B (zh) * 2010-09-30 2015-11-25 三星钻石工业股份有限公司 激光加工装置、被加工物的加工方法及被加工物的分割方法

Also Published As

Publication number Publication date
CN1675020A (zh) 2005-09-28
WO2004014595A1 (ja) 2004-02-19
US20050232316A1 (en) 2005-10-20
JP2004066327A (ja) 2004-03-04
US7807944B2 (en) 2010-10-05

Similar Documents

Publication Publication Date Title
CN100396424C (zh) 激光加工设备、加工方法及利用其制造电路板的方法
CN100388428C (zh) 利用激光束的处理装置
US8916798B2 (en) Laser machining apparatus with switchable laser system and laser machining method
JP4551086B2 (ja) レーザーによる部分加工
JP4074589B2 (ja) レーザ加工装置及びレーザ加工方法
US12083620B2 (en) Laser based machining
TW525240B (en) Ultraviolet laser ablative patterning of microstructures in semiconductors
US8350187B2 (en) Method and apparatus for laser machining
WO2001024964A1 (en) Method and apparatus for laser drilling
JP2004066327A5 (https=)
JP2009539610A (ja) レーザ誘起衝撃波を利用した微小流体装置の製造
US5585019A (en) Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams
US6624382B2 (en) Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure
JPH0810970A (ja) レーザ加工装置及び方法
CN105102174A (zh) 基于激光放射所控制的射束定位器
JP4156805B2 (ja) 工作物の表面から物質を除去するための方法および装置
JP2021115625A (ja) 積層造形装置、積層造形方法及び加工経路生成方法
CN112955273B (zh) 用于以去除材料的方式对工件进行激光加工的方法
CN101500934A (zh) 采用激光感应冲击波的微流控器件的制造
WO2020012771A1 (ja) レーザ加工装置、レーザ加工方法及び成膜マスクの製造方法
JP2006082120A (ja) レーザ加工方法及びレーザ照射装置
CN1323797C (zh) 喷墨喷嘴和用于喷墨喷嘴的激光钻孔工艺
KR100594528B1 (ko) 레이저 가공 장치, 가공 방법 및 상기 가공 방법을 이용한회로 기판의 제조 방법
JP3605722B2 (ja) レーザ穴あけ加工方法及び加工装置
KR100664573B1 (ko) 레이저 가공 장치 및 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080625

Termination date: 20120807