CN100396367C - 分散体在制备电子元件中的应用 - Google Patents
分散体在制备电子元件中的应用 Download PDFInfo
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- CN100396367C CN100396367C CNB2004800060223A CN200480006022A CN100396367C CN 100396367 C CN100396367 C CN 100396367C CN B2004800060223 A CNB2004800060223 A CN B2004800060223A CN 200480006022 A CN200480006022 A CN 200480006022A CN 100396367 C CN100396367 C CN 100396367C
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- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- LXNOENXQFNYMGT-UHFFFAOYSA-N xi-5-Hydroxydodecanoic acid Chemical compound CCCCCCCC(O)CCCC(O)=O LXNOENXQFNYMGT-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- B22—CASTING; POWDER METALLURGY
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Abstract
Description
分散剂 | 聚酯链(PC) | 聚亚胺(PI) | PC∶PI的比 |
1 | PHS | SP200 | 10∶1 |
2 | PRA | SP200 | 10∶1 |
3 | RA∶Cap(4∶1) | SP200 | 9∶1 |
4 | PHS | - | - |
5 | PRA | - | - |
6 | PRA | - | - |
7 | RA∶HSA(1∶1) | SP200 | 14∶1 |
8 | PRA | SP200 | 18∶1 |
9 | PRA | SP200 | 20∶1 |
10 | PRA | SP050 | 7∶1 |
实施例 | 分散剂 | 分散剂的量 | Ni | BaTiO<sub>3</sub> | 松油醇稀释剂 | 粘度 |
1 | 1 | 0.2 | 7 | - | 2.8 | B/C |
2 | 2 | 0.2 | 7 | - | 2.8 | C |
3 | 3 | 0.2 | 7 | - | 2.8 | B/C |
4 | 4 | 0.2 | 7 | - | 2.8 | B |
A | - | - | 7 | - | 3.0 | C/D |
5 | 1 | 0.2 | - | 5 | 4.8 | A/B |
6 | 2 | 0.2 | - | 5 | 4.8 | B |
7 | 3 | 0.2 | - | 5 | 4.8 | A/B |
8 | 4 | 0.2 | - | 5 | 4.8 | A/B |
B | - | - | - | 5 | 5 | D |
9 | 1 | 0.2 | - | 6 | 3.8 | B/C |
10 | 2 | 0.2 | - | 6 | 3.8 | C |
11 | 3 | 0.2 | - | 6 | 3.8 | B/C |
12 | 4 | 0.2 | - | 6 | 3.8 | B/C |
13 | 8 | 0.1 | 7 | - | 2.9 | B/C |
14 | 10 | 0.1 | 7 | - | 2.9 | B/C |
15 | 7 | 0.1 | 7 | - | 2.9 | B/C |
16 | 8 | 0.1 | 5 | 4.9 | A/B | |
17 | 10 | 0.1 | 5 | 4.9 | A/B | |
18 | 7 | 0.1 | 5 | 4.9 | A/B | |
19 | 6 | 0.1 | 5 | 4.9 | A/B | |
20 | 9 | 0.1 | 5 | 4.9 | A/B | |
C | - | 0 | 5 | 5 | D |
实施例 | 分散剂 | 分散剂的量 | 氧化铈 | 松油醇稀释剂 | 粘度 |
D | - | - | 2.5 | 7.5 | B/C |
21 | 4 | 0.1 | 2.5 | 7.4 | A/B |
22 | 7 | 0.1 | 2.5 | 7.4 | A/B |
23 | 3 | 0.2 | 2.5 | 7.33 | A/B |
24 | 4 | 0.2 | 2.8 | 7 | B |
实施例 | 分散剂 | 分散剂的量 | MEL氧化锆 | 二氧化硅 | 松油醇稀释剂 | 粘度 |
F | - | - | 4 | - | 6 | C |
25 | 5 | 0.1 | 4 | - | 5.9 | A/B |
26 | 9 | 0.1 | 4 | - | 5.9 | A/B |
G | - | - | - | 4.5 | 5.5 | B |
27 | 7 | 0.1 | - | 4.5 | 5.4 | A/B |
实施例 | 分散剂 | 分散剂的量 | SumitomoAlumina AESIIC | 松油醇稀释剂 | 粘度 |
1 | - | - | 5 | 5 | B/C |
2 | 10 | 0.1 | 5 | 4.9 | B |
3 | 9 | 0.1 | 5 | 4.9 | B |
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0304941.8 | 2003-03-05 | ||
GBGB0304941.8A GB0304941D0 (en) | 2003-03-05 | 2003-03-05 | Use of dispersions in making electronic devices |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1756593A CN1756593A (zh) | 2006-04-05 |
CN100396367C true CN100396367C (zh) | 2008-06-25 |
Family
ID=9954096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800060223A Expired - Lifetime CN100396367C (zh) | 2003-03-05 | 2004-03-05 | 分散体在制备电子元件中的应用 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1599282B1 (zh) |
JP (1) | JP4649399B2 (zh) |
CN (1) | CN100396367C (zh) |
AT (1) | ATE437696T1 (zh) |
DE (1) | DE602004022258D1 (zh) |
GB (1) | GB0304941D0 (zh) |
TW (1) | TWI352619B (zh) |
WO (1) | WO2004078333A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0519551D0 (en) * | 2005-09-26 | 2005-11-02 | Ici Plc | Dispersant |
KR20100015351A (ko) | 2007-03-05 | 2010-02-12 | 바스프 에스이 | 폴리아민-폴리아크릴레이트 분산제 |
TW201622806A (zh) * | 2014-11-24 | 2016-07-01 | 盧伯利索先進材料有限公司 | 用於使用噴墨墨水及噴墨墨水印表機對陶瓷磚上色之聚酯分散劑 |
WO2019168065A1 (ja) * | 2018-03-02 | 2019-09-06 | 味の素株式会社 | セラミックス製造用分散剤 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0248029A (ja) * | 1988-08-05 | 1990-02-16 | Dainippon Ink & Chem Inc | 分散剤及び該分散剤を含有する分散液 |
GB9306222D0 (en) * | 1993-03-25 | 1993-05-19 | Zeneca Ltd | Dispersants |
GB9326374D0 (en) * | 1993-12-23 | 1994-02-23 | Zeneca Ltd | Process |
US5591789A (en) * | 1995-06-07 | 1997-01-07 | International Business Machines Corporation | Polyester dispersants for high thermal conductivity paste |
AU5638999A (en) * | 1998-10-24 | 2000-05-15 | Avecia Limited | Dispersants, compositions and use |
GB9922039D0 (en) * | 1999-09-18 | 1999-11-17 | Avecia Ltd | Polyester dispersants |
GB0109708D0 (en) * | 2001-04-20 | 2001-06-13 | Avecia Ltd | Dispersants |
-
2003
- 2003-03-05 GB GBGB0304941.8A patent/GB0304941D0/en not_active Ceased
-
2004
- 2004-03-05 AT AT04718177T patent/ATE437696T1/de active
- 2004-03-05 WO PCT/US2004/007345 patent/WO2004078333A1/en active Application Filing
- 2004-03-05 EP EP04718177A patent/EP1599282B1/en not_active Expired - Lifetime
- 2004-03-05 JP JP2006507052A patent/JP4649399B2/ja not_active Expired - Lifetime
- 2004-03-05 DE DE602004022258T patent/DE602004022258D1/de not_active Expired - Lifetime
- 2004-03-05 TW TW093105898A patent/TWI352619B/zh not_active IP Right Cessation
- 2004-03-05 CN CNB2004800060223A patent/CN100396367C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2004078333A1 (en) | 2004-09-16 |
JP4649399B2 (ja) | 2011-03-09 |
GB0304941D0 (en) | 2003-04-09 |
EP1599282B1 (en) | 2009-07-29 |
TWI352619B (en) | 2011-11-21 |
CN1756593A (zh) | 2006-04-05 |
DE602004022258D1 (de) | 2009-09-10 |
JP2006523947A (ja) | 2006-10-19 |
TW200500133A (en) | 2005-01-01 |
ATE437696T1 (de) | 2009-08-15 |
EP1599282A1 (en) | 2005-11-30 |
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