CN100381619C - 半导体衬底、半导体器件、发光二极管及其制造方法 - Google Patents

半导体衬底、半导体器件、发光二极管及其制造方法 Download PDF

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Publication number
CN100381619C
CN100381619C CNB2004800121458A CN200480012145A CN100381619C CN 100381619 C CN100381619 C CN 100381619C CN B2004800121458 A CNB2004800121458 A CN B2004800121458A CN 200480012145 A CN200480012145 A CN 200480012145A CN 100381619 C CN100381619 C CN 100381619C
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CN
China
Prior art keywords
layer
substrate
manufacturing
light
led
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Expired - Fee Related
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CNB2004800121458A
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English (en)
Chinese (zh)
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CN1784515A (zh
Inventor
米原隆夫
关口芳信
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Canon Inc
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Canon Inc
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Publication of CN1784515A publication Critical patent/CN1784515A/zh
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Publication of CN100381619C publication Critical patent/CN100381619C/zh
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  • Led Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
CNB2004800121458A 2003-05-06 2004-04-30 半导体衬底、半导体器件、发光二极管及其制造方法 Expired - Fee Related CN100381619C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP127999/2003 2003-05-06
JP2003127999A JP2004331438A (ja) 2003-05-06 2003-05-06 半導体基板及びその製造方法
JP359348/2003 2003-10-20

Publications (2)

Publication Number Publication Date
CN1784515A CN1784515A (zh) 2006-06-07
CN100381619C true CN100381619C (zh) 2008-04-16

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CNB2004800121458A Expired - Fee Related CN100381619C (zh) 2003-05-06 2004-04-30 半导体衬底、半导体器件、发光二极管及其制造方法

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JP (1) JP2004331438A (ja)
CN (1) CN100381619C (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811348A (en) * 1995-02-02 1998-09-22 Sony Corporation Method for separating a device-forming layer from a base body
JPH10326884A (ja) * 1997-03-26 1998-12-08 Canon Inc 半導体基板及びその作製方法とその複合部材
US6326279B1 (en) * 1999-03-26 2001-12-04 Canon Kabushiki Kaisha Process for producing semiconductor article

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811348A (en) * 1995-02-02 1998-09-22 Sony Corporation Method for separating a device-forming layer from a base body
JPH10326884A (ja) * 1997-03-26 1998-12-08 Canon Inc 半導体基板及びその作製方法とその複合部材
US6326279B1 (en) * 1999-03-26 2001-12-04 Canon Kabushiki Kaisha Process for producing semiconductor article

Also Published As

Publication number Publication date
JP2004331438A (ja) 2004-11-25
CN1784515A (zh) 2006-06-07

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Granted publication date: 20080416

Termination date: 20160430