CN100372054C - 显示装置及其制造方法 - Google Patents
显示装置及其制造方法 Download PDFInfo
- Publication number
- CN100372054C CN100372054C CNB2004100974912A CN200410097491A CN100372054C CN 100372054 C CN100372054 C CN 100372054C CN B2004100974912 A CNB2004100974912 A CN B2004100974912A CN 200410097491 A CN200410097491 A CN 200410097491A CN 100372054 C CN100372054 C CN 100372054C
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- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 239000010408 film Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 239000010409 thin film Substances 0.000 claims abstract description 13
- 239000011159 matrix material Substances 0.000 claims abstract description 9
- 239000012528 membrane Substances 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 46
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000000137 annealing Methods 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 92
- 229920005591 polysilicon Polymers 0.000 description 92
- 239000010410 layer Substances 0.000 description 37
- 230000037230 mobility Effects 0.000 description 19
- 230000008569 process Effects 0.000 description 13
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 7
- 238000005224 laser annealing Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 238000010168 coupling process Methods 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
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- 229920000768 polyamine Polymers 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
- H01L27/1285—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1296—Multistep manufacturing methods adapted to increase the uniformity of device parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003398085 | 2003-11-27 | ||
JP2003398085A JP2005159162A (ja) | 2003-11-27 | 2003-11-27 | 表示装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1638024A CN1638024A (zh) | 2005-07-13 |
CN100372054C true CN100372054C (zh) | 2008-02-27 |
Family
ID=34723053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100974912A Expired - Fee Related CN100372054C (zh) | 2003-11-27 | 2004-11-29 | 显示装置及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7084081B2 (zh) |
JP (1) | JP2005159162A (zh) |
KR (1) | KR100693235B1 (zh) |
CN (1) | CN100372054C (zh) |
SG (1) | SG112108A1 (zh) |
TW (1) | TWI266921B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4589830B2 (ja) * | 2005-06-29 | 2010-12-01 | 共同印刷株式会社 | フレキシブルディスプレイ及びその製造方法 |
US7187123B2 (en) * | 2004-12-29 | 2007-03-06 | Dupont Displays, Inc. | Display device |
KR100703467B1 (ko) * | 2005-01-07 | 2007-04-03 | 삼성에스디아이 주식회사 | 박막트랜지스터 |
KR101293566B1 (ko) * | 2007-01-11 | 2013-08-06 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
WO2009042784A1 (en) * | 2007-09-25 | 2009-04-02 | The Trustees Of Columbia University In The City Of New York | Methods of producing high uniformity in thin film transistor devices fabricated on laterally crystallized thin films |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000243968A (ja) * | 1999-02-24 | 2000-09-08 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタとその製造方法及びそれを用いた液晶表示装置とその製造方法 |
US6177301B1 (en) * | 1998-06-09 | 2001-01-23 | Lg.Philips Lcd Co., Ltd. | Method of fabricating thin film transistors for a liquid crystal display |
CN1346153A (zh) * | 2000-09-29 | 2002-04-24 | 三洋电机株式会社 | 半导体器件 |
CN1361551A (zh) * | 1994-02-03 | 2002-07-31 | 株式会社半导体能源研究所 | 一种半导体器件的制造方法 |
US6479837B1 (en) * | 1998-07-06 | 2002-11-12 | Matsushita Electric Industrial Co., Ltd. | Thin film transistor and liquid crystal display unit |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11121751A (ja) | 1997-10-13 | 1999-04-30 | Sanyo Electric Co Ltd | 薄膜半導体装置の製造方法 |
JP2000243969A (ja) | 1999-02-24 | 2000-09-08 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタとその製造方法及びそれを用いた液晶表示装置とその製造方法 |
JP2000133807A (ja) | 1998-10-22 | 2000-05-12 | Seiko Epson Corp | 多結晶シリコン薄膜トランジスタ |
JP2001109399A (ja) * | 1999-10-04 | 2001-04-20 | Sanyo Electric Co Ltd | カラー表示装置 |
JP4289816B2 (ja) * | 2001-03-22 | 2009-07-01 | シャープ株式会社 | 半導体装置及びその製造方法 |
JP2004119919A (ja) * | 2002-09-30 | 2004-04-15 | Hitachi Ltd | 半導体薄膜および半導体薄膜の製造方法 |
-
2003
- 2003-11-27 JP JP2003398085A patent/JP2005159162A/ja active Pending
-
2004
- 2004-09-30 TW TW093129637A patent/TWI266921B/zh not_active IP Right Cessation
- 2004-09-30 KR KR1020040077809A patent/KR100693235B1/ko not_active IP Right Cessation
- 2004-11-25 SG SG200407601A patent/SG112108A1/en unknown
- 2004-11-26 US US10/996,409 patent/US7084081B2/en active Active
- 2004-11-29 CN CNB2004100974912A patent/CN100372054C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1361551A (zh) * | 1994-02-03 | 2002-07-31 | 株式会社半导体能源研究所 | 一种半导体器件的制造方法 |
US6177301B1 (en) * | 1998-06-09 | 2001-01-23 | Lg.Philips Lcd Co., Ltd. | Method of fabricating thin film transistors for a liquid crystal display |
US6479837B1 (en) * | 1998-07-06 | 2002-11-12 | Matsushita Electric Industrial Co., Ltd. | Thin film transistor and liquid crystal display unit |
JP2000243968A (ja) * | 1999-02-24 | 2000-09-08 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタとその製造方法及びそれを用いた液晶表示装置とその製造方法 |
CN1346153A (zh) * | 2000-09-29 | 2002-04-24 | 三洋电机株式会社 | 半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
JP2005159162A (ja) | 2005-06-16 |
TW200523596A (en) | 2005-07-16 |
US7084081B2 (en) | 2006-08-01 |
US20050158903A1 (en) | 2005-07-21 |
SG112108A1 (en) | 2005-06-29 |
CN1638024A (zh) | 2005-07-13 |
KR100693235B1 (ko) | 2007-03-12 |
KR20050051539A (ko) | 2005-06-01 |
TWI266921B (en) | 2006-11-21 |
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SE01 | Entry into force of request for substantive examination | ||
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GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JAPAN DISPLAY MIDDLE INC. Free format text: FORMER NAME: TOSHIBA MOBILE DISPLAY CO., LTD. Owner name: TOSHIBA MOBILE DISPLAY CO., LTD. Free format text: FORMER NAME: TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Saitama Prefecture, Japan Patentee after: JAPAN DISPLAY Inc. Address before: Saitama Prefecture, Japan Patentee before: Toshiba Mobile Display Co.,Ltd. |
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CP03 | Change of name, title or address |
Address after: Saitama Prefecture, Japan Patentee after: Toshiba Mobile Display Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 Termination date: 20211129 |
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CF01 | Termination of patent right due to non-payment of annual fee |