CN100363243C - Reduced movement wafer box - Google Patents
Reduced movement wafer box Download PDFInfo
- Publication number
- CN100363243C CN100363243C CNB200480016925XA CN200480016925A CN100363243C CN 100363243 C CN100363243 C CN 100363243C CN B200480016925X A CNB200480016925X A CN B200480016925XA CN 200480016925 A CN200480016925 A CN 200480016925A CN 100363243 C CN100363243 C CN 100363243C
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- CN
- China
- Prior art keywords
- cylindrical wall
- semiconductor wafer
- pedestal
- preservation equipment
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The semiconductor wafer containment device or wafer box includes a base with a planar floor and a double concentric cylindrical wall structure arising therefrom. The double concentric cylindrical wall structure includes slots through which latch elements pivot radially. The latch elements include an inward padded spacer element. The latch elements pivot between an outward position wherein the padded spacer elements are relatively away from the wafer containment space and an inward upright position wherein the padded spacer elements impinge into the wafer containment space and are urged against the semiconductor wafers therein. Ramps on the lid capture the latch elements in the outward position and urge the latch elements to pivot to the inward upright position and be detent engaged in this position by slots formed on the lid.
Description
Background of invention
It is that the 60/479th, No. 086 the interim patent of the U.S. is as preceence that this utility application requires with the sequence number that on June 17th, 2003 submitted to.
Technical field
The application relates to a kind of preservation equipment or wafer case of semiconductor wafer.Specifically, this preservation equipment has the wall of trough of belt, and this groove is used to the outstanding body chip wafer pin of inserting after being received in semiconductor wafer or is with wing pin, with buffering wafer moving in transportation.Body chip wafer pin or outstanding band wing pin are removed before the unloading from preservation equipment automatically at semiconductor wafer.
The description of prior art
Prior art comprises the multiple design of the preservation equipment and the transportation device of semiconductor wafer.These designs must provide the protection of static with this two aspect of machinery to the wafer that is contained in wherein, and preferred this preservation equipment should easily be applicable to the automation equipment of various loading or unloading semiconductor wafers.This preservation equipment should have simple design, can be reliable and batch manufacturing economically.In addition, remodeling conventional semiconductor wafer preservation equipment helps the development that semiconductor wafer is preserved the aspect, field.
The example of some prior aries is US Patent 6,193,068 of Lewis, and name is called " the preservation equipment that keeps semiconductor wafer ", and open day is February 27 calendar year 2001; The US Patent 6,286,684 of Brooks, name are called " protection system that remains on integrated circuit (IC) wafer that is used for the container that stores and transport ", and open day is September 11 calendar year 2001; The US Patent 6,003,674 of Brooks, name are called " packing is to the method and apparatus and the gained packing of the goods of pollutants sensitivity ", and open day is on December 21st, 1999; The US Patent 5,724,748 of Brooks, name are called " packing is to the device and the gained packing of the goods of pollutants sensitivity ", and open day is on March 10th, 1998.
Purpose of the present invention and summary
In order to reach above-mentioned and other purpose, the cylindrical wall that semiconductor wafer is preserved equipment is provided with groove.After loading semiconductor wafer, these grooves receive outstanding body chip wafer pin or band wing pin.The band wing pin that the lid of preservation equipment will be given prominence to is caught at transporting position.Outstanding body chip wafer pin or band wing pin removed before wafer is by Robotics or similar approach unloading.Outstanding body chip wafer pin or band wing pin are designed to reduce taking up room in basic box, and the firm engagement semiconductor wafer, so that semiconductor wafer is not moved in preservation equipment.Body chip wafer pin or band wing pin are enough flexible so that unexpected side wall impact is not damaged the wafer except having, and also have enough rigidity and occupy requisite space.Fin or pin can be provided with around whole periphery or half periphery of cylindrical wall.
Description of drawings
Further aim of the present invention and advantage will become very obvious from following explanation and accompanying drawing.Wherein:
Fig. 1 is the top view of the pedestal of semiconductor wafer of the present invention first embodiment of preserving equipment, has double-wall structure and four grooves that are used for the brilliant fin of engage body core.
Fig. 2 is the lateral plan of the pedestal of semiconductor wafer of the present invention first embodiment of preserving equipment.
Fig. 3 is the section drawing of Fig. 1 midplane 3-3.
Fig. 4 is the backplan of the pedestal of semiconductor wafer of the present invention first embodiment of preserving equipment.
Fig. 5 is the section drawing of Fig. 1 midplane 5-5.
Fig. 6 is the section drawing of the part of further enlarged drawing 3.
Fig. 7 is the top view of the lid of semiconductor wafer of the present invention first embodiment of preserving equipment, and represents the lid of other embodiment.
Fig. 8 is the section drawing of Fig. 7 midplane 8-8.
Fig. 9 is the backplan of lid shown in Figure 7.
Figure 10 is the front elevation of lid shown in Figure 7.
Figure 11 is the lateral plan of lid shown in Figure 7.
Figure 12 is the section drawing of Fig. 7 midplane 12-12.
Figure 13 is the section drawing of the part of further enlarged drawing 8.
Figure 14 is the top view of the pedestal of semiconductor wafer of the present invention second embodiment of preserving equipment, has double-wall structure and six grooves that are used for the brilliant fin of engage body core.
Figure 15 is the top view of the pedestal of semiconductor wafer of the present invention the 3rd embodiment of preserving equipment, has double-wall structure and eight grooves that are used for the brilliant fin of engage body core.
Figure 16 is the top view of the pedestal of semiconductor wafer of the present invention the 4th embodiment of preserving equipment, and it is bigger than first, second and the 3rd embodiment usually, has double-wall structure and six grooves that are used for the brilliant fin of engage body core.
Figure 17 is the lateral plan of the pedestal of semiconductor wafer of the present invention the 4th embodiment of preserving equipment.
Figure 18 is the section drawing of Figure 16 midplane 18-18.
Figure 19 is the backplan of the pedestal of semiconductor wafer of the present invention the 4th embodiment of preserving equipment.
Figure 20 is the top view of the pedestal of semiconductor wafer of the present invention the 5th embodiment of preserving equipment, and it has identical size with the 4th embodiment usually, still has four grooves that are used for engage body core crystalline substance fin.
Figure 21 is the top view of the pedestal of semiconductor wafer of the present invention the 6th embodiment of preserving equipment, and it has identical size with the 4th embodiment and the 5th embodiment usually, still has eight grooves that are used for engage body core crystalline substance fin.
Figure 22 is the transparent view of body chip wafer pin of the present invention.
Figure 23 is the end elevation of body chip wafer pin of the present invention.
Figure 24 is the transparent view of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with outstanding band wing pin at its whole periphery.
Figure 25 is the transparent view of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with single outstanding band wing pin on a position of its periphery.
Figure 26 is first lateral plan of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with outstanding band wing pin.
Figure 27 is second lateral plan of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with outstanding band wing pin.
Figure 28 is the 3rd lateral plan of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with outstanding band wing pin.
Figure 29 is the top view of the pedestal of semiconductor wafer of the present invention the 7th embodiment of preserving equipment, is inserted with outstanding band wing pin.In addition, single optional dividing wall is shown in broken lines in the drawings.
Figure 30 is first transparent view of the band wing pin given prominence to of the present invention.
Figure 31 is second transparent view of the band wing pin given prominence to of the present invention.
The detailed description of preferred implementation
Referring now to accompanying drawing, identical parts are represented with identical Reference numeral in whole a few width of cloth accompanying drawings, and Fig. 1 is the top view of the pedestal 10 of semiconductor wafer of the present invention first embodiment of preserving equipment or wafer case.Pedestal 10 comprises the square floor 12 on the basic plane that is formed by side 14,16,18,20.From the plane bottom plate rise inside and outside concentric segmented cylindrical wall 22,24 is arranged.Inside and outside concentric segmented cylindrical wall 22,24 comprises less relatively aligned gaps, forms with an angle of 90 degrees groove 26,28,30,32 at interval at its periphery thus.Similarly, inside and outside concentric segmented cylindrical wall 22,24 comprises relatively large aligned gaps, forms with 180 degree angle opening opposing 34,36 at its periphery thus.Shown in Fig. 3 part charge, the part of next-door neighbour's opening 34,36 of interior concentric segmented cylindrical wall 22 comprises partial notch 38.Wafer storage area 40 is formed within the interior concentric segmented cylindrical wall 22.In this specific embodiment, wafer storage area 40 goes for the wafer of eight inches of diameters, but also goes for the wafer of other range of sizes certainly.Terminal has the turning of clip 44,46 relative base plate 12 from a pair of diagonal angle of inverted ledges 48,50 to rise.
Fig. 4 illustrates the backplan of pedestal 10, comprises peripheral base structure 60, and the periphery that centers on base plate 12 stretches out, and is used for affording redress between the surperficial (not shown) of base plate 12 and placement pedestal 10.In addition, lattice work 62 is formed on the bottom of base plate 12.
Fig. 7-13 illustrates lid 70 is preserved equipment or wafer case applicable to semiconductor wafer of the present invention various disclosed embodiments.Lid 70 comprises top planar rectangular surface 72, its by around the flange that protrudes upward 74 surround.Groove 76,78 is formed on the relative corner location of top planar rectangular surface 72.At this installation position, groove 76,78 receives clip 44,46 to form detent configuration.Outer cylindrical wall 80 is formed on the downside of top planar rectangular surface 72, and outer cylindrical wall 80 further comprises the opening 82 with 180 ° of separation.In this installation site, outer cylindrical wall 80 outwards is close to outer concentric segmented cylindrical wall 24 with one heart.A kind of similar lid is disclosed in US Patent 6,193, and in 068, name is called " the preservation equipment that keeps semiconductor wafer ", its content at this by with reference to introducing.
Figure 14 discloses the application's semiconductor wafer and has preserved the pedestal 10 of second embodiment of equipment or wafer case.Except six grooves 26,27,28,29,30,32 that are formed on wall 22,24 peripheries, this embodiment and Fig. 1-6 disclosed contents are closely similar.Interval between the groove 26 and 27, between the groove 27 and 28, between the groove 29 and 30, between the groove 30 and 32 approximately is 45 °, yet between groove 26 and the 32 and interval between groove 28 and 29 approximately is 90 °, and wherein these 90 ° of intervals comprise gap 34 and 36 respectively.In this specific embodiment, wafer storage area 40 goes for the wafer of eight inches of diameters, but also goes for the wafer of other range of sizes certainly.
Figure 15 discloses the application's semiconductor wafer and has preserved the pedestal 10 of the 3rd embodiment of equipment or wafer case, eight grooves 26,27,28,29,30,31,32,33 are formed on the periphery of wall 22,24, and between any two succeeding vats are 45 ° at interval.In this specific embodiment, wafer storage area 40 goes for the wafer of eight inches of diameters, but also goes for the wafer of other range of sizes certainly.
The semiconductor wafer that Figure 16-19 discloses the application is preserved the pedestal 10 of the 4th specific embodiment of equipment or wafer case.The 4th specific embodiment is applicable to than the larger sized wafer of previous embodiment, and especially the wafer of 12 inches of diameters can be accommodated in the wafer storage area, but also goes for the wafer of other range of sizes certainly.Because present embodiment pedestal 10 is bigger than the pedestal in the previous embodiment 10, the other clip 45,47 of the inverted ledges 49,51 that has separately is provided, be respectively arranged with clip 44,45,46,47 with position, four turnings at pedestal 10.Certainly, corresponding to this pedestal 10, lid 70 has matched size, and comprises four grooves similar with the groove 76,78 shown in 9 to Fig. 7, is used for engaging clip 44,45,46,47.
The semiconductor wafer that Figure 20 and 21 discloses the application is respectively preserved the pedestal 10 of the 5th and the 6th specific embodiment of equipment or wafer case.The 5th is similar to the 4th specific embodiment of pedestal 10 with the 6th specific embodiment, except Figure 20 discloses along the periphery of wall 22,24 four grooves 26,28,30,32 with 90 ° of intervals, and Figure 21 discloses along the periphery of wall 22,24 eight grooves 26,27,28,29,30,31,32 with 45 ° of intervals.
Figure 22 and 23 is respectively the transparent view and the end elevation of body chip wafer pin 90, and it is used for first to the 6th specific embodiment that above-mentioned semiconductor wafer is preserved equipment or wafer case.Body chip wafer pin 90 comprises columniform head 92, and it is equipped with enough big diameter so that it can not pass any slit 26-33.Central longitudinal is passed head 91 to hole 91.Body chip wafer pin 90 further comprises 90 afterbodys that stretch out 94 from the head, and comprises the one group of tooth 96 that forms and vertically stretch out from the afterbody 94 along its Width.
In order to form the firm of joint wafer (not shown) but resilient structure in wafer storage area 40, wafer (normally diameter eight or 12 inches, but other diameter is applicable among the design fully) is placed in the wafer storage area 40.Between the neighboring of interior concentric segmented cylindrical wall 22 and wafer, some gaps are arranged.In order to fill this gap, body chip wafer pin 90 is placed among the groove 26-33, makes head 92 outwards contiguous outer concentric segmented cylindrical wall 24, and afterbody 94 passes groove respectively, far-end 98 passes groove respectively backward, thereby in abutting connection with head 92, and the ring of the pressured wafer of formation elasticity.Selectively, head 92 can be placed in the inwall 22, makes head 92 parts be nested among the groove 26-33, and afterbody 94 passes that groove 26-33 stretches out towards the outside and at reasonable time as the grip portions that removes body chip wafer pin 90.
Figure 24-29 has shown the pedestal 110 of the 7th specific embodiment of semiconductor wafer preservation equipment or wafer case.Pedestal 110 comprises the square floor 112 of cylindrical wall 114 from the common plane of its rise.Disclose single cylindrical wall 114 among the figure, but in order further to reduce contamination of heavy, some application may need two concentric cylindrical wall 14.Cylindrical wall 114 comprises around six grooves 115,116,117,118,119,120 of its periphery and comprises opening 122.In addition, Ren Xuan dividing wall can be formed on the outside of each groove 115,116,117,118,119,120 to reduce contamination of heavy.Figure 29 has been shown in broken lines the single optional groove 119 exterior dividing walls 123 that are formed on.
Cylindrical stabilizing equipment 124,126 rises from the relative turning of the first couple of base plate 112, and terminal is the second couple relative turning rise of the clip 128,130 of inverted ledges 132,134 from base plate 112.
Outstanding band wing pin 140 is illustrated in detail in Figure 30 and 31.The cross-sectional plane of outstanding band wing pin 140 comprises circular export-oriented part 142 and the fin 148 that inwardly stretches out.
As shown in figure 24, outstanding band wing pin 140 inserts in the groove 115,116,117,118,119,120 of cylindrical wall 114, usually after the circular semiconductor wafers (not shown) is loaded onto in the cylindrical wall 114, between circular semiconductor wafers and cylindrical wall 114, certain clearance is arranged.The outstanding band wing.The groove 144,146 of pin 140 is caught the edge of the cylindrical wall 114 that forms groove 115,116,117,118,119,120.The fin 148 that inwardly stretches out stretches into space in the cylindrical wall 114 so that engage with circular semiconductor wafers.Figure 24 shows that outstanding band wing pin 140 inserts in each groove 115,116,117,118,119,120 of the periphery that centers on cylindrical wall 114.Yet some application may only used outstanding band wing pin 140 on half periphery of cylindrical wall 114.Similarly, some specific embodiments of pedestal 112 may comprise the groove that only centers on the part of cylindrical wall 114.
Outstanding band wing pin 140 needs thin and soft, and with buffering semiconductor wafer (not shown), but that it also needs is enough firm in to stop mobile as fin 148, promotes the semiconductor wafer lamination gently as spring.A kind of representative type material of outstanding band wing pin 140 can be that (Kraton) rises in section, but those skilled in the art can discern many equivalent material after studying the present invention carefully.
Before the unloading semiconductor wafer, lid 70 (for example those are disclosed in Fig. 7-11) and outstanding band wing pin 140 are removed.
Therefore, several above-mentioned targets and advantage are obtained most effectively.Although the preferred embodiments of the present invention are open and in this detailed description, should be appreciated that the present invention is in no way limited to this, and its scope is defined by the following claims.
Claims (20)
1. the preservation equipment of a holding semiconductor wafer comprises:
Pedestal, comprise at least one from its cylindrical wall that stretches out, described at least one cylindrical wall forms the wafer storage area therein, at least a portion of described at least one cylindrical wall is cut apart, in described at least one cylindrical wall, form groove thus, described groove receives the isolated component that stretches into described wafer storage area, and a plurality of semiconductor wafers and described at least one cylindrical wall are separated;
Therefore described isolated component comprises flexible material, a plurality of semiconductor wafers can be placed in the described wafer storage area so that described isolated component to be installed afterwards, and can remove described isolated component before removing a plurality of semiconductor wafers; With
Lid comprises the device that engages described pedestal, and when described pedestal and described lid were bonded together, described lid constituted the top of described preservation equipment.
2. the preservation equipment of the holding semiconductor wafer of claim 1, wherein said at least one cylindrical wall vertically stretches out from described pedestal.
3. the preservation equipment of the holding semiconductor wafer of claim 1, the described device that wherein engages described pedestal comprise and receive the groove that is formed on the pin on the described pedestal.
4. the preservation equipment of the holding semiconductor wafer of claim 1, wherein, described lid comprises cylindrical wall, when described pedestal and described lid were bonded together, it outwards was close to described at least one cylindrical wall of described pedestal.
5. the preservation equipment of the holding semiconductor wafer of claim 1 wherein, is formed on around described at least one cylindrical wall to described recess gauge rule.
6. the preservation equipment of the holding semiconductor wafer of claim 1, wherein, described at least one cylindrical wall comprises at least one gap bigger than described groove.
7. the preservation equipment of the holding semiconductor wafer of claim 1 also comprises the described groove arc dividing wall on every side that is formed in described at least one cylindrical wall.
8. the preservation equipment of a holding semiconductor wafer comprises:
Pedestal, comprise at least one from its cylindrical wall that stretches out, described at least one cylindrical wall forms the wafer storage area therein, at least a portion of described at least one cylindrical wall is cut apart, form groove thus in described at least one cylindrical wall, described groove receives the isolated component that stretches into described wafer storage area;
Lid comprises the device that engages described pedestal, and when described pedestal and described lid were bonded together, described lid constituted the top of described preservation equipment; And
Described isolated component comprises groove, is used to catch the edge of described at least one cylindrical wall that forms described groove, and also comprises the fin that stretches in the described wafer storage area.
9. the preservation equipment of the holding semiconductor wafer of claim 8, wherein, described isolated component passes through extrusion moulding.
10. the preservation equipment of the holding semiconductor wafer of claim 9, wherein, described isolated component is enough soft, thinks that the semiconductor wafer in the described wafer storage area forms buffering.
11. the preservation equipment of a holding semiconductor wafer comprises:
Pedestal, comprise from its interior concentric cylindrical wall of stretching out and outside concentric cylindrical wall, concentric cylindrical wall forms the wafer storage area therein in described, at least a portion of described inside and outside concentric cylindrical wall is cut apart, in described inside and outside concentric cylindrical wall, form groove thus, described groove receives the isolated component that stretches into described wafer storage area, and a plurality of semiconductor wafers and described interior concentric cylindrical wall are separated;
Therefore described isolated component comprises flexible material, a plurality of semiconductor wafers can be placed in the described wafer storage area so that described isolated component to be installed afterwards, and can remove described isolated component before removing a plurality of semiconductor wafers; With
Lid comprises the device that engages described pedestal, and when described pedestal and described lid engage a time-out, described lid constitutes the top of described preservation equipment.
12. the preservation equipment of the holding semiconductor wafer of claim 11, wherein, described inside and outside concentric cylindrical wall is vertically stretched out from described pedestal.
13. the preservation equipment of the holding semiconductor wafer of claim 11, wherein, the described device that engages described pedestal comprises that reception is formed on the groove of the pin on the described pedestal.
14. the preservation equipment of the holding semiconductor wafer of claim 11, wherein, described lid comprises cylindrical wall, and when described pedestal and described lid were bonded together, it outwards was close to the described outer concentric cylindrical outer wall of described pedestal.
15. the preservation equipment of the holding semiconductor wafer of claim 11 wherein, is formed on around the described inside and outside concentric cylindrical wall to described recess gauge rule.
16. the preservation equipment of the holding semiconductor wafer of claim 11, wherein, described inside and outside concentric cylindrical wall comprises at least one gap bigger than described groove.
17. the preservation equipment of the holding semiconductor wafer of claim 11, wherein, described isolated component comprises cylindrical head and from its afterbody that stretches out.
18. the preservation equipment of the holding semiconductor wafer of claim 17, wherein, described afterbody comprises the tooth that stretches out from it.
19. the preservation equipment of the holding semiconductor wafer of claim 18, wherein, described isolated component is enough soft, thinks that the semiconductor wafer in the described wafer storage area forms buffering.
20. the preservation equipment of the holding semiconductor wafer of claim 17, wherein, described cylindrical head is enough big, passes described groove to prevent described cylindrical head.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47908603P | 2003-06-17 | 2003-06-17 | |
| US60/479,086 | 2003-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1805889A CN1805889A (en) | 2006-07-19 |
| CN100363243C true CN100363243C (en) | 2008-01-23 |
Family
ID=34061926
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200480016925XA Expired - Fee Related CN100363243C (en) | 2003-06-17 | 2004-02-25 | Reduced movement wafer box |
| CNB2004800169264A Expired - Fee Related CN100361879C (en) | 2003-06-17 | 2004-05-11 | Wafer box with radially pivoting latch elements |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800169264A Expired - Fee Related CN100361879C (en) | 2003-06-17 | 2004-05-11 | Wafer box with radially pivoting latch elements |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1633660A4 (en) |
| JP (1) | JP4499718B2 (en) |
| KR (1) | KR101150405B1 (en) |
| CN (2) | CN100363243C (en) |
| WO (1) | WO2005006405A2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6988621B2 (en) * | 2003-06-17 | 2006-01-24 | Illinois Tool Works Inc. | Reduced movement wafer box |
| CN101888957B (en) * | 2007-10-12 | 2013-01-02 | 大元半导体包装产业有限公司 | Wafer container with staggered wall structure |
| US8556079B2 (en) * | 2009-08-26 | 2013-10-15 | Texchem Advanced Products Incorporated Sdn Bhd | Wafer container with adjustable inside diameter |
| CN102569138B (en) * | 2010-12-10 | 2016-05-11 | 台湾积体电路制造股份有限公司 | Wafer case |
| JP5749002B2 (en) * | 2010-12-28 | 2015-07-15 | 芝浦メカトロニクス株式会社 | Load lock device and vacuum processing device |
| CN106742730B (en) * | 2016-12-01 | 2018-12-07 | 海麟文博（厦门）文物预防性保护技术有限公司 | A kind of historical relic box of buffer structure and level 2 buffering |
| KR102595526B1 (en) * | 2021-09-07 | 2023-10-30 | 주식회사 삼에스코리아 | Waper shipping box |
| KR102595523B1 (en) * | 2021-09-07 | 2023-10-30 | 주식회사 삼에스코리아 | Waper shipping box |
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| US5366079A (en) * | 1993-08-19 | 1994-11-22 | Taiwan Semiconductor Manufacturing Company | Integrated circuit wafer and retainer element combination |
| US5553711A (en) * | 1995-07-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | Storage container for integrated circuit semiconductor wafers |
| US5611448A (en) * | 1995-09-25 | 1997-03-18 | United Microelectronics Corporation | Wafer container |
| US5725100A (en) * | 1995-02-28 | 1998-03-10 | Komatsu Electronic Metals Co., Ltd. | Semiconductor wafer case |
| US6193090B1 (en) * | 1999-04-06 | 2001-02-27 | 3M Innovative Properties Company | Reusable container |
| US6341695B1 (en) * | 1998-05-07 | 2002-01-29 | Texas Instruments Incorporated | Containment device for retaining semiconductor wafers |
| CN2492943Y (en) * | 2001-09-12 | 2002-05-22 | 财团法人工业技术研究院 | Chip holder |
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| JP2941125B2 (en) * | 1992-08-15 | 1999-08-25 | アキレス株式会社 | Semiconductor wafer storage container |
| US5816410A (en) * | 1994-07-15 | 1998-10-06 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
| JPH09205136A (en) * | 1996-01-25 | 1997-08-05 | Sony Corp | Wafer case |
| JP3472685B2 (en) * | 1997-05-28 | 2003-12-02 | アキレス株式会社 | Semiconductor wafer storage container |
| CN2308571Y (en) * | 1997-08-04 | 1999-02-24 | 财团法人工业技术研究院 | Bottom disk locking device of crystal chip box |
| DE60044028D1 (en) * | 1999-07-23 | 2010-04-29 | Ray G Brooks | SECURING SYSTEM FOR WAFER WITH INTEGRATED CIRCUIT (IC) |
| JP4480296B2 (en) * | 2001-05-09 | 2010-06-16 | アキレス株式会社 | Electronic material storage container |
| JP4577603B2 (en) * | 2001-09-20 | 2010-11-10 | 株式会社安川電機 | Container for thin objects |
| JP2004266181A (en) | 2003-03-04 | 2004-09-24 | Nec Electronics Corp | Semiconductor substrate storage container |
-
2004
- 2004-02-25 KR KR1020057024092A patent/KR101150405B1/en not_active IP Right Cessation
- 2004-02-25 JP JP2006517075A patent/JP4499718B2/en not_active Expired - Fee Related
- 2004-02-25 CN CNB200480016925XA patent/CN100363243C/en not_active Expired - Fee Related
- 2004-02-25 EP EP04714663A patent/EP1633660A4/en not_active Withdrawn
- 2004-02-25 WO PCT/US2004/005725 patent/WO2005006405A2/en active Application Filing
- 2004-05-11 CN CNB2004800169264A patent/CN100361879C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5366079A (en) * | 1993-08-19 | 1994-11-22 | Taiwan Semiconductor Manufacturing Company | Integrated circuit wafer and retainer element combination |
| US5725100A (en) * | 1995-02-28 | 1998-03-10 | Komatsu Electronic Metals Co., Ltd. | Semiconductor wafer case |
| US5553711A (en) * | 1995-07-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | Storage container for integrated circuit semiconductor wafers |
| US5611448A (en) * | 1995-09-25 | 1997-03-18 | United Microelectronics Corporation | Wafer container |
| US6341695B1 (en) * | 1998-05-07 | 2002-01-29 | Texas Instruments Incorporated | Containment device for retaining semiconductor wafers |
| US6193090B1 (en) * | 1999-04-06 | 2001-02-27 | 3M Innovative Properties Company | Reusable container |
| CN2492943Y (en) * | 2001-09-12 | 2002-05-22 | 财团法人工业技术研究院 | Chip holder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006527919A (en) | 2006-12-07 |
| KR20060017647A (en) | 2006-02-24 |
| CN100361879C (en) | 2008-01-16 |
| WO2005006405A3 (en) | 2005-06-09 |
| EP1633660A2 (en) | 2006-03-15 |
| KR101150405B1 (en) | 2012-06-01 |
| WO2005006405A2 (en) | 2005-01-20 |
| JP4499718B2 (en) | 2010-07-07 |
| EP1633660A4 (en) | 2008-07-23 |
| CN1805890A (en) | 2006-07-19 |
| CN1805889A (en) | 2006-07-19 |
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