WO2005006405A3 - Reduced movement wafer box - Google Patents

Reduced movement wafer box Download PDF

Info

Publication number
WO2005006405A3
WO2005006405A3 PCT/US2004/005725 US2004005725W WO2005006405A3 WO 2005006405 A3 WO2005006405 A3 WO 2005006405A3 US 2004005725 W US2004005725 W US 2004005725W WO 2005006405 A3 WO2005006405 A3 WO 2005006405A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
wafer
cylindrical wall
semiconductor wafers
during transportation
semiconductor
Prior art date
Application number
PCT/US2004/005725
Other languages
French (fr)
Other versions
WO2005006405A2 (en )
Inventor
Valoris L Forsyth
Original Assignee
Illinois Tool Works
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Abstract

The semiconductor wafer containment device or wafer box includes a base with a planar floor and a cylindrical wall arising therefrom. A double concentric wall structure (22, 24) includes slots (26, 28, 30, 32) which receive body chip wafer pins (90) which extend into the space formed between the inner cylindrical wall and the wafer so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. Alternately, a single cylindrical wall includes slots which receive extruded finned pins (140) which include fins which extend inward into the space formed within the cylindrical wall so as to cushion the semiconductor wafers and prevent movement of the semiconductor wafers during transportation. The semiconductor wafer containment device or wafer box further includes a lid (70) which is engaged by the base thereby capturing the extruded finned pins during transportation.
PCT/US2004/005725 2003-06-17 2004-02-25 Reduced movement wafer box WO2005006405A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US47908603 true 2003-06-17 2003-06-17
US60/479,086 2003-06-17

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20040714663 EP1633660A4 (en) 2003-06-17 2004-02-25 Reduced movement wafer box
JP2006517075A JP4499718B2 (en) 2003-06-17 2004-02-25 Web file box to limit the movement

Publications (2)

Publication Number Publication Date
WO2005006405A2 true WO2005006405A2 (en) 2005-01-20
WO2005006405A3 true true WO2005006405A3 (en) 2005-06-09

Family

ID=34061926

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/005725 WO2005006405A3 (en) 2003-06-17 2004-02-25 Reduced movement wafer box

Country Status (4)

Country Link
EP (1) EP1633660A4 (en)
JP (1) JP4499718B2 (en)
CN (2) CN100363243C (en)
WO (1) WO2005006405A3 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6988621B2 (en) * 2003-06-17 2006-01-24 Illinois Tool Works Inc. Reduced movement wafer box
KR20100080503A (en) * 2007-10-12 2010-07-08 피크 플라스틱 앤 메탈 프로덕츠 (인터내셔널) 리미티드 Wafer container with staggered wall structure
US8556079B2 (en) * 2009-08-26 2013-10-15 Texchem Advanced Products Incorporated Sdn Bhd Wafer container with adjustable inside diameter
CN102569138B (en) * 2010-12-10 2016-05-11 台湾积体电路制造股份有限公司 Wafer cassette
JP5749002B2 (en) * 2010-12-28 2015-07-15 芝浦メカトロニクス株式会社 Load-lock device and the vacuum processing apparatus
CN106742730A (en) * 2016-12-01 2017-05-31 海麟文博(厦门)文物预防性保护技术有限公司 Buffer structure and two-stage buffer cultural relic box

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366079A (en) * 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
US5611448A (en) * 1995-09-25 1997-03-18 United Microelectronics Corporation Wafer container
US5725100A (en) * 1995-02-28 1998-03-10 Komatsu Electronic Metals Co., Ltd. Semiconductor wafer case
US6193090B1 (en) * 1999-04-06 2001-02-27 3M Innovative Properties Company Reusable container
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366079A (en) * 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
US5725100A (en) * 1995-02-28 1998-03-10 Komatsu Electronic Metals Co., Ltd. Semiconductor wafer case
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
US5611448A (en) * 1995-09-25 1997-03-18 United Microelectronics Corporation Wafer container
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6193090B1 (en) * 1999-04-06 2001-02-27 3M Innovative Properties Company Reusable container

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1633660A4 *

Also Published As

Publication number Publication date Type
CN100361879C (en) 2008-01-16 grant
EP1633660A2 (en) 2006-03-15 application
KR20060017647A (en) 2006-02-24 application
CN1805890A (en) 2006-07-19 application
JP4499718B2 (en) 2010-07-07 grant
CN1805889A (en) 2006-07-19 application
CN100363243C (en) 2008-01-23 grant
EP1633660A4 (en) 2008-07-23 application
JP2006527919A (en) 2006-12-07 application
WO2005006405A2 (en) 2005-01-20 application

Similar Documents

Publication Publication Date Title
USD488672S1 (en) Beverage container with motion sensitive LED-containing base
USD521208S1 (en) Pallet
USD506926S1 (en) Coffee pod
US6812475B1 (en) Device for storing radioactive material and shipping apparatus for the same
USD501125S1 (en) Tool holder
US20040052611A1 (en) Heat sink fastener
JPS58154256A (en) Semiconductor memory and preparation thereof
USD510728S1 (en) Semiconductor device package
USD406822S (en) Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
USD478193S1 (en) Animal feeding receptacle holder
US20040256285A1 (en) Reduced movement wafer box
JPH04263457A (en) Semiconductor device
USD515970S1 (en) Plant pot
USD506355S1 (en) Stemware
JPS6295796A (en) Semiconductor multivalue memory device
USD541217S1 (en) Lamination for an electric motor
JPS53129985A (en) Production of semiconductor device
USD484412S1 (en) Lid for a bowl
US20050140022A1 (en) Multi-chip package structure
JPH04233765A (en) Semiconductor device and manufacture thereof
JPS63237561A (en) Semiconductor storage device and manufacture thereof
JPH1039495A (en) Housing container for mask

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2004714663

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 1020057024092

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2004816925X

Country of ref document: CN

Ref document number: 2006517075

Country of ref document: JP

WWP Wipo information: published in national office

Ref document number: 1020057024092

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2004714663

Country of ref document: EP