JP4577603B2 - Container for thin objects - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a storage container used for transporting and storing thin objects such as silicon wafers and glass wafers (hereinafter simply referred to as wafers) used in the manufacturing process of semiconductor chips.
[0002]
[Prior art]
In a semiconductor chip manufacturing process, a wafer as a material may be transferred between different processing apparatuses, or the wafer may be stored outside an ultra-clean atmosphere. At this time, since the wafer needs to be kept in an ultra-clean atmosphere, a storage container dedicated to the wafer is used. As a typical example, there is a storage container described in JP-A-6-199379.
[0003]
Hereinafter, a description will be given with reference to FIG. FIG. 5 is a cross-sectional view showing the inside of the storage container. In FIG. 5, 20 is a wafer, 21 is a storage container body, 22 is an internal space, 23 is an upper surface in the internal space 22, 24 is a lower surface in the internal space 22, and 25 is a rack in the internal space 22. The wafer 20 is supported by the rack 25 to be stored in the internal space 22 in the storage container 21 and is held without touching the upper surface 23 and the lower surface 24 of the storage container body 21.
[0004]
Further, in recent years, the wafer size has increased, and accordingly, as disclosed in Japanese Patent No. 2539447, a production method for transporting and storing wafers one by one has been adopted. In this case, since the mass to be conveyed becomes light, it is often moved manually or attached to the apparatus. Along with the increase in the size of the wafer, depending on the specifications, wafers with a very high unit price have come out, and the value per wafer has become extremely high.
[0005]
[Problems to be solved by the invention]
In the semiconductor chip manufacturing process, a dust-free ultra-clean atmosphere is required, and such a storage container is designed to minimize dust generation from the contact surface with the wafer. Accordingly, when a wafer is stored, it is currently fixed by fixing means such as several pins or grippers.
[0006]
On the other hand, when such a storage container is moved manually or attached to the apparatus, it may be inadvertently dropped. If the storage container is dropped, a large impact is applied to the fixed portion of the wafer. A wafer made of silicon, glass, or the like has low fracture toughness, and therefore fracture starts from the vicinity of the fixed portion of the wafer where stress is concentrated. In addition, as the wafer size increases, the wafer is easily destroyed by a small stress. Therefore, if the storage container is dropped too much, a very large loss is incurred.
[0007]
The present invention has been made in view of such a problem, and even when the storage container is accidentally dropped, a thin object is stored so that the wafer itself is not subjected to a large stress and the wafer is protected. The purpose is to provide a container.
[0008]
[Means for Solving the Problems]
In order to solve the above problem, the present invention provides a housing having a storage space capable of storing at least one thin object, and an opening / closing removably attached to the housing so as to cover an opening of the housing. A container for a thin object having a lid and a fixing portion provided on the housing for fixing the thin object, and transporting or storing the thin object while maintaining the ultra-clean atmosphere in the accommodating space In this case, only when a force greater than a certain value is applied, a deformed portion that absorbs the force by being deformed to the extent that it does not recover to the original shape according to the force, and a force received by the deformed portion connected to the deformed portion. Furthermore the absorbing buffering unit, and interpolation between the between the fixed portion and the housing or the lid and the fixed part, the interior of the side wall of the housing at a position corresponding to the fixing portion and A cavity is provided inside the opening / closing lid, and the cavity Forming a portion surrounded by the notches on the inner surface of the corresponding side, it is to that that part and deformed portion.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0010]
[First embodiment]
FIGS. 1A and 1B are perspective views showing a container for storing a thin object in the first embodiment of the present invention. FIG. 1A shows a state in which the opening / closing lid is opened, and FIG. 1B shows a state in which the opening / closing lid is closed. Yes. 2A and 2B show the internal structure of the storage container of FIG. 1. FIG. 2A is a plan sectional view of the wafer as viewed from above, and FIG. 2B is a front sectional view of the main part when the side wall of the storage container is viewed from the front. is there. FIG. 3 is a front sectional view of a main part showing a method for forming a cavity in the storage container of FIG.
[0011]
In FIG. 1, reference numeral 1 denotes a wafer which is a thin object. In general, in the manufacture of semiconductor chips, a wafer having a thickness of about several hundred μm is used. Reference numeral 2 denotes a storage space for the wafer 1, which can store at least one wafer. In the figure, the case of storing one wafer is described. However, when storing two or more wafers, although not shown, the storage space 2 is enlarged in the vertical direction so that the wafers do not overlap. What is necessary is just to set it as the structure which can be accommodated in a space | interval. Reference numeral 3 denotes a housing constituting the storage space 2 for storing the wafer 1. Reference numeral 4 denotes an opening of the storage space 2 from which the wafer 1 is taken in and out. An open / close lid 5 is detachably attached to the housing 3 so as to cover the opening 4 of the housing 3. Reference numeral 6 denotes a mounting table provided for placing the wafer 1 in contact with the lower surface of the wafer 1 in the storage space 2, and 7 is attached to the back of the housing 3 to press the outer peripheral surface of the wafer 1 in the radial direction. An elastic body such as a spring for sandwiching the wafer 1, and 8 an elastic body such as a spring that is attached to the housing 3 side of the opening / closing lid 5 and presses the outer peripheral surface of the wafer 1 in the radial direction to sandwich the wafer 1. is there. The mounting table 6 and the elastic bodies 7 and 8 constitute a fixed portion. The mounting table 6 is provided with a protrusion 9 that is a contact surface with the wafer 1.
[0012]
In FIG. 1A, the opening / closing lid 5 and the housing 3 are separated, and the wafer 1 is taken in and out in this state. As shown in FIG. 1B, when the opening / closing lid 5 is attached to the housing 3, the storage space 2 is blocked from the outside and the wafer 1 can be kept in an ultra-clean atmosphere.
[0013]
Further, as shown in FIG. 2A, the elastic body 7 and the elastic body 8 press and hold the wafer 1 in the radial direction, so that the wafer 1 is completely fixed in the storage space 2. A handle (not shown) is attached to the housing 3 and is transported by means such as a machine or human hands, or the wafer 1 is stored outside an ultra-clean atmosphere. The material of the housing 3 and the opening / closing lid 5 is preferably robust and lightweight. Further, a material having a certain degree of softness is preferable so that particles are not scattered even when the wafer 1 comes into contact with the housing 3.
[0014]
In order to satisfy such a requirement, in the present embodiment, a resin material such as polycarbonate is used for the main body portion of the casing 3 and the opening / closing lid 5, and static electricity is generated on the surface portion through the storage container 2. The material containing the conductive synthetic resin is used so as not to be transmitted to 1. The housing 3 is transparent or translucent at least at the upper surface so that the inside can be seen, and the fixed state of the wafer 1 can be visually observed. By using such a material, it is possible to protect the electronic circuit recorded on the wafer 1 without the static electricity being transmitted to the wafer 1 through the storage container 2.
[0015]
As shown in FIG. 2 (b), reference numeral 10 denotes a cavity provided inside the side wall 3a of the housing 3 and inside the opening / closing lid 5 at a position corresponding to the mounting table 6 and the elastic bodies 7, 8. Deformed portions 11 are provided on the inner surface of the side wall 3 a of the housing 3 and the inner surface of the opening / closing lid 5 corresponding to the hollow portion 10. The deformable portion 11 is formed by surrounding the mounting table 6 and the elastic bodies 7 and 8 with a notch 12 and surrounding portions. The deformation portion 11 is deformed in the direction in which a force is applied, but only when a force greater than a certain value is applied, the portion between the notch 12 and the cavity portion 10 is cut and deformed. .
[0016]
In FIG. 1, the deformable portion 11 has an elliptical shape, but is not limited to this shape, and may be a rectangular shape or the like. Further, the depth of the notch 12 is increased or decreased depending on the location, and the direction in which the force is applied and the value at which the portion between the notch 12 and the cavity 10 is broken according to the force is appropriately set. It is preferable to design so that it can be controlled with various values.
[0017]
In normal use, the storage container 2 holds the wafer 1 firmly and suppresses dust generation due to friction or the like. Therefore, the inside of the storage container 2 can be kept in an ultra-clean atmosphere.
[0018]
Further, it is desirable that the periphery of the notch 12 be sealed with a protective material 13 so that particles are not scattered even when the portion between the notch 11 and the cavity 10 is broken. Reference numeral 14 denotes a buffer portion inserted into the cavity portion 10, which is connected to the deformable portion 11 and absorbs the force received by the deformable portion 11. As the buffer material 14a constituting the buffer unit 14, it is desirable to use an elastic material softer than the mounting table 6 and the elastic bodies 7 and 8, for example, using a material such as hard rubber. Furthermore, a thing with a high attenuation | damping characteristic is desirable.
[0019]
As shown in FIG. 3, the side wall 3a of the housing 3 is filled with the buffer material 14a by forming a recess 3b on the side wall 3a of the housing 3 from the outside, and placing the buffer material 14a in the recess 3b with an arrow. There is a method in which the concave portion 3b is bonded and sealed in such a manner that the lid 15 having a shape suitable for this space is inserted in the direction of the arrow in the remaining space of the concave portion 3b and covered with the cushioning material 14a. . Although not shown, the casing 3 and the opening / closing lid 5 are each divided into two vertically, and divided into two, for example, to form a lid, thereby forming the cavity 10, and the cushioning material is formed in the formed cavity 10. There is also a method of inserting 14a and attaching a fixing portion and then bonding with an adhesive.
[0020]
By inserting the cushioning material 14a into the cavity 10 of the housing 3, the external appearance is the same as that of the conventional storage container, and the flow of gas such as pure nitrogen gas sealed when sealed is not hindered. be able to.
[0021]
Thus, by supporting the wafer 1 by the support structure A configured by the mounting table 6 (the elastic bodies 7 and 8 are the same), the deformable portion 11, the notch 12, and the protective material 13, the storage container 2 should be used. Even if it is dropped, dust generation from the deformable portion 11 and the buffer portion 14 can be suppressed. Therefore, the inside of the storage container 2 can be kept in an ultra-clean atmosphere.
[0022]
In this way, between the fixed portion constituted by the mounting table 6 and the elastic bodies 7 and 8 and the housing 3 or the opening / closing lid 5, By providing the buffer portion 14 that absorbs the received force, even if a large stress is applied to the wafer 1 due to a drop of the storage container 2 or the like, the stress is absorbed by the deformable portion 11 and the buffer portion 14 and the wafer 1 Can be reliably protected.
[0023]
[Second Embodiment]
A second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a front sectional view of an essential part showing a container for storing thin objects in the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected about what has the same function as what was demonstrated in the 1st Example, and description is abbreviate | omitted.
[0024]
In FIG. 4, reference numeral 16 denotes a contact surface between the protrusion 9 of the mounting table 6 and the wafer 1. The material of the contact surface 16 is preferably made of quartz or Teflon resin such as PFA or PTFE. By doing so, the frictional resistance between the wafer 1 and the protrusion 9 is reduced, and dust generation from the wafer 1 and the protrusion 9 is suppressed. Therefore, the inside of the storage container 2 can be kept in an ultra-clean atmosphere. Reference numeral 17 denotes a pressure detection sheet inserted between the mounting table 6 and the deforming portion 11. Specifically, a slight gap is provided between the mounting table 6 and the deformable portion 11, and the pressure detection sheet 17 is sandwiched in the gap. When a pressure greater than a certain value is applied between the mounting table 6 and the housing 3, the pressure detection sheet 17 is colored.
[0025]
In FIG. 4, the pressure detection sheet 17 is sandwiched between the mounting table 6 and the deformable portion 11. However, the configuration is not limited to the configuration illustrated in FIG. 4. For example, although not illustrated, the mounting table 6 and the protrusion 9 are not illustrated. The pressure detection sheet 17 may be sandwiched between them, or the pressure detection sheet 17 may be attached to the contact surface at the tip of the protrusion 9.
[0026]
The pressure detection sheet 17 detects a pressure equal to or higher than a certain value, and can visually check whether or not a large stress is applied to the wafer 1 from the outside of the housing 3 depending on the presence or absence of coloring. Therefore, it can be confirmed whether the deformation | transformation part 11 deform | transformed, and the damage of the notch 12 can be known from the exterior of the housing | casing 3. FIG.
[0027]
【The invention's effect】
As described above, the present invention has the following effects.
[0028]
(1) According to the storage container of any one of the first to fourth aspects, the fixing portion for securely fixing the wafer is provided, and the force is applied between the fixing portion and the housing or the opening / closing lid. By interpolating the deformation part that exhibits deformation and the buffer part that absorbs the force received by the deformation part, in normal use, the wafer can be held firmly and dust generation from the wafer can be suppressed. Even if a large stress acts on the wafer due to dropping or the like, the stress can be absorbed by the deforming portion and the buffer portion to protect the wafer.
[0029]
(2) According to the storage container of the fifth aspect, since the deforming portion is constituted by the portion surrounded by the notch, it can be easily deformed only when a force of a certain value or more is applied, Even in such a case, the wafer can be reliably protected.
[0030]
(3) According to the storage container of the sixth aspect, since the periphery of the notch is sealed with the protective material, even when the storage container is dropped, dust generation from the deformed portion and the buffer portion can be suppressed. Therefore, the inside of the storage container can be maintained in an ultra-clean atmosphere.
[0031]
(4) According to the storage container of the seventh aspect, since a pressure detection sheet for detecting a pressure of a predetermined value or more is further inserted between the fixing means and the casing or the opening / closing lid, a large stress is applied to the wafer. It can be confirmed from the outside whether it has acted. Moreover, it can be confirmed whether the deformation | transformation part deform | transformed, and the damage of a notch part can also be known from the outside.
[0032]
(5) According to the storage container of the eighth aspect, since the material of the contact surface of the mounting table is quartz or Teflon resin such as PFA or PTFE, the friction between the wafer and the fixing means is reduced. Dust can be suppressed. Therefore, the inside of the storage container can be maintained in an ultra-clean atmosphere.
[0033]
(6) According to the storage container of the ninth aspect, since the material of the surface of the housing or the opening / closing lid is a material containing a conductive synthetic resin, the static electricity is not transmitted to the wafer through the storage container, but on the wafer. It is possible to protect the electronic circuit recorded in the memory.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a container for storing a thin object in a first embodiment of the present invention. FIG. 1 (a) shows a state in which an opening / closing lid is opened, and FIG. 1 (b) shows that the opening / closing lid is closed. Indicates the state.
2 shows the internal structure of the storage container of FIG. 1. FIG. 2A is a plan sectional view of the wafer as viewed from above, and FIG. 2B is a front sectional view of the main part of the side wall of the storage container as viewed from the front. It is.
3 is a front cross-sectional view of a main part showing a method for forming a cavity in the storage container of FIG. 1. FIG.
FIG. 4 is a front sectional view of an essential part showing a container for storing a thin object in a second embodiment of the present invention.
FIG. 5 is a perspective view showing a conventional storage container, in which the inside is shown in cross section.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wafer 2 Storage space 3 Housing | casing 3a Side wall 3b Recessed part 4 Opening part 5 Opening / closing lid 6 Mounting base 7 Elastic body 8 Elastic body 9 Protrusion 10 Cavity part 11 Deformation part 12 Notch 13 Protection material 14 Buffering part 14a Buffering material 15 Cover 16 Contact surface 17 Pressure detection sheet

Claims (7)

A housing having a storage space capable of storing at least one or more thin objects; an open / close lid that is detachably attached to the housing so as to cover an opening of the housing; A container for fixing a thin object, and carrying or storing the thin object while keeping the thin object in an ultra-clean atmosphere in the storage space.
Only when a force greater than a certain value is applied, a deformed part that absorbs the force by deforming to the extent that it does not recover to its original shape according to the force,
A buffer portion that is coupled to the deformable portion and further absorbs the force received by the deformable portion;
And interpolating between the between the fixed portion and the housing or the lid and the fixed part,
While providing a hollow portion inside the side wall of the housing at a position corresponding to the fixed portion and the inside of the open / close lid,
A container for storing a thin object, wherein a portion surrounded by a notch is formed on an inner surface of the side portion corresponding to the hollow portion, and the portion is used as a deformed portion .   The container for thin objects according to claim 1, wherein a fixing portion is provided on the opening / closing lid. A mounting table for placing the thin object in contact with the lower surface of the thin object, and an elastic body that presses the outer peripheral surface of the thin object in a radial direction to sandwich the thin object. container of thin shaped bodies according to claim 1 or claim 2, characterized in that the configuration was. The container for a thin object according to claim 3, wherein a material of a contact surface between the mounting table and the thin object is quartz or Teflon (registered trademark) resin . The container for thin objects according to any one of claims 1 to 4, wherein the periphery of the notch is sealed with a protective material . 6. A pressure detection sheet for detecting a pressure of a predetermined value or more is inserted between the fixed portion and the housing or between the fixed portion and the opening / closing lid. The container for thin objects according to any one of the above. The container for thin objects according to any one of claims 1 to 6, wherein a material of a surface of the casing or the opening / closing lid is a material containing a conductive synthetic resin .

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