CN100360400C - 半导体材料线切割专用刃料 - Google Patents
半导体材料线切割专用刃料 Download PDFInfo
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- CN100360400C CN100360400C CNB2006100180211A CN200610018021A CN100360400C CN 100360400 C CN100360400 C CN 100360400C CN B2006100180211 A CNB2006100180211 A CN B2006100180211A CN 200610018021 A CN200610018021 A CN 200610018021A CN 100360400 C CN100360400 C CN 100360400C
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- micro mist
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- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000010298 pulverizing process Methods 0.000 claims abstract description 4
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 239000003595 mist Substances 0.000 claims description 36
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 230000018044 dehydration Effects 0.000 claims description 7
- 238000006297 dehydration reaction Methods 0.000 claims description 7
- 238000003786 synthesis reaction Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 3
- 238000013467 fragmentation Methods 0.000 claims description 3
- 238000006062 fragmentation reaction Methods 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 4
- 239000003245 coal Substances 0.000 abstract description 3
- 239000003921 oil Substances 0.000 abstract description 3
- 239000002002 slurry Substances 0.000 abstract description 3
- 229910021418 black silicon Inorganic materials 0.000 abstract description 2
- 238000005194 fractionation Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000007580 dry-mixing Methods 0.000 abstract 1
- 230000005518 electrochemistry Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 239000000567 combustion gas Substances 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
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Application Number | Priority Date | Filing Date | Title |
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CNB2006100180211A CN100360400C (zh) | 2006-06-27 | 2006-06-27 | 半导体材料线切割专用刃料 |
Applications Claiming Priority (1)
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CNB2006100180211A CN100360400C (zh) | 2006-06-27 | 2006-06-27 | 半导体材料线切割专用刃料 |
Publications (2)
Publication Number | Publication Date |
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CN1884067A CN1884067A (zh) | 2006-12-27 |
CN100360400C true CN100360400C (zh) | 2008-01-09 |
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CNB2006100180211A Expired - Fee Related CN100360400C (zh) | 2006-06-27 | 2006-06-27 | 半导体材料线切割专用刃料 |
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CN (1) | CN100360400C (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101870469B (zh) * | 2010-06-01 | 2011-05-25 | 河南新大新材料股份有限公司 | 晶硅片切割刃料的制备方法 |
CN101891194B (zh) * | 2010-06-28 | 2011-07-13 | 河南新大新材料股份有限公司 | 半导体晶圆片切割刃料的制备方法 |
CN101973548B (zh) * | 2010-08-31 | 2011-12-21 | 平顶山易成新材料股份有限公司 | 一种用于线切割光伏硅刃料的制备方法 |
CN102530944B (zh) * | 2012-03-16 | 2013-12-04 | 河南醒狮高新技术股份有限公司 | 用于蓝宝石磨抛的碳化硅刃料制造方法及专用分级装置 |
CN103819194B (zh) * | 2014-01-04 | 2016-01-20 | 河南晟道科技有限公司 | 用于烧结碳化硅陶瓷膜的专用陶瓷材料 |
CN103864077B (zh) * | 2014-02-17 | 2015-10-21 | 东北大学 | 一种蓝宝石晶片研磨用碳化硼粉的生产工艺 |
CN113956048B (zh) * | 2021-11-24 | 2022-10-14 | 唐山圣诺纳微科技有限公司 | 一种用于注浆注射挤压成型碳化硅陶瓷粉体的制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09262828A (ja) * | 1996-03-28 | 1997-10-07 | Shin Etsu Handotai Co Ltd | ワイヤーソー用砥粒の製造方法およびワイヤーソー用砥粒 |
JPH11171647A (ja) * | 1997-12-05 | 1999-06-29 | Bridgestone Corp | 炭化ケイ素粉体及びその製造方法 |
CN2338102Y (zh) * | 1997-05-30 | 1999-09-15 | 南海市科达微粉厂 | 碳化硅微粉精密分级装置 |
JP2000254543A (ja) * | 1999-03-12 | 2000-09-19 | Mikura Bussan Kk | 炭化珪素研磨剤の再生処理方法及び研磨剤 |
JP2001072407A (ja) * | 1999-09-02 | 2001-03-21 | Denki Kagaku Kogyo Kk | 炭化珪素粉末及び研磨剤 |
CN1449994A (zh) * | 2003-05-09 | 2003-10-22 | 西安科技学院 | 一种碳化硅晶须和微粉的工业制备方法 |
-
2006
- 2006-06-27 CN CNB2006100180211A patent/CN100360400C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09262828A (ja) * | 1996-03-28 | 1997-10-07 | Shin Etsu Handotai Co Ltd | ワイヤーソー用砥粒の製造方法およびワイヤーソー用砥粒 |
CN2338102Y (zh) * | 1997-05-30 | 1999-09-15 | 南海市科达微粉厂 | 碳化硅微粉精密分级装置 |
JPH11171647A (ja) * | 1997-12-05 | 1999-06-29 | Bridgestone Corp | 炭化ケイ素粉体及びその製造方法 |
JP2000254543A (ja) * | 1999-03-12 | 2000-09-19 | Mikura Bussan Kk | 炭化珪素研磨剤の再生処理方法及び研磨剤 |
JP2001072407A (ja) * | 1999-09-02 | 2001-03-21 | Denki Kagaku Kogyo Kk | 炭化珪素粉末及び研磨剤 |
CN1449994A (zh) * | 2003-05-09 | 2003-10-22 | 西安科技学院 | 一种碳化硅晶须和微粉的工业制备方法 |
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CN1884067A (zh) | 2006-12-27 |
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Assignee: Lianyungang Xingshi semiconductor new material products Co. Ltd. Assignor: Henan Xingshi High&New Technology Co., Ltd. Contract fulfillment period: 2008.12.16 to 2018.12.15 Contract record no.: 2009410000054 Denomination of invention: Dedicated blade materials for line cutting of semiconductor materials Granted publication date: 20080109 License type: General permission Record date: 2009.4.17 |
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Free format text: COMMON LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.12.16 TO 2018.12.15; CHANGE OF CONTRACT Name of requester: LIANYUNGANG XINGSHI SEMICONDUCTOR NEW MATERIAL PRO Effective date: 20090417 |
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Inventor after: Yang Dongping Inventor after: Wang Li Inventor before: Yang Dongping Inventor before: Tao Jian Inventor before: Wang Li |
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Free format text: CORRECT: INVENTOR; FROM: YANG DONGPING TAO JIAN WANG LI TO: YANG DONGPING WANG LI |
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Owner name: HENAN SHENGDAO TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HENAN XINGSHI HIGH+NEW TECHNOLOGY CO., LTD. Effective date: 20131218 |
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Free format text: CORRECT: ADDRESS; FROM: 450001 ZHENGZHOU, HENAN PROVINCE TO: 474500 KAIFENG, HENAN PROVINCE |
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Effective date of registration: 20131218 Address after: The eastern district administrative road Tongxu County in Henan province 474500 industrial city agglomeration Patentee after: Henan Sheng Dao Science and Technology Ltd. Address before: Yinping Rd. 450001 high tech Industrial Development Zone, Henan city of Zhengzhou province No. 12 Patentee before: Henan Xingshi High&New Technology Co., Ltd. |
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