CH680483A5 - - Google Patents

Download PDF

Info

Publication number
CH680483A5
CH680483A5 CH3818/89A CH381889A CH680483A5 CH 680483 A5 CH680483 A5 CH 680483A5 CH 3818/89 A CH3818/89 A CH 3818/89A CH 381889 A CH381889 A CH 381889A CH 680483 A5 CH680483 A5 CH 680483A5
Authority
CH
Switzerland
Prior art keywords
carrier film
adhesive
conductor track
substrate
circuit
Prior art date
Application number
CH3818/89A
Other languages
German (de)
English (en)
Inventor
Fritz Dipl-Ing Pichl
Original Assignee
Kobe Properties Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Properties Ltd filed Critical Kobe Properties Ltd
Priority to CH3818/89A priority Critical patent/CH680483A5/de
Priority to EP90119630A priority patent/EP0423651A1/de
Priority to JP2276583A priority patent/JPH03150893A/ja
Priority to US07/599,701 priority patent/US5184111A/en
Priority to US07/666,890 priority patent/US5174847A/en
Publication of CH680483A5 publication Critical patent/CH680483A5/de

Links

Classifications

    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
    • G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
    • G08B13/242—Tag deactivation
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/2442—Tag materials and material properties thereof, e.g. magnetic material details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/037—Stamping with other step
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Security & Cryptography (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CH3818/89A 1989-10-20 1989-10-20 CH680483A5 (en, 2012)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH3818/89A CH680483A5 (en, 2012) 1989-10-20 1989-10-20
EP90119630A EP0423651A1 (de) 1989-10-20 1990-10-12 Verfahren zur Herstellung einer Schaltungsanordnung, sowie Schaltungsanordnung auf einer Trägerfolie
JP2276583A JPH03150893A (ja) 1989-10-20 1990-10-17 回路配列の製作方法並びにキャリヤフィルム上に設けた回路配列
US07/599,701 US5184111A (en) 1989-10-20 1990-10-18 Circuit arrangement on a support film
US07/666,890 US5174847A (en) 1989-10-20 1991-03-08 Process for the production of a circuit arrangement on a support film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH3818/89A CH680483A5 (en, 2012) 1989-10-20 1989-10-20

Publications (1)

Publication Number Publication Date
CH680483A5 true CH680483A5 (en, 2012) 1992-08-31

Family

ID=4264125

Family Applications (1)

Application Number Title Priority Date Filing Date
CH3818/89A CH680483A5 (en, 2012) 1989-10-20 1989-10-20

Country Status (4)

Country Link
US (1) US5184111A (en, 2012)
EP (1) EP0423651A1 (en, 2012)
JP (1) JPH03150893A (en, 2012)
CH (1) CH680483A5 (en, 2012)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584120A (en) * 1992-02-14 1996-12-17 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
US5950305A (en) * 1992-02-14 1999-09-14 Research Organization For Circuit Knowledge Environmentally desirable method of manufacturing printed circuits
US5343616B1 (en) * 1992-02-14 1998-12-29 Rock Ltd Method of making high density self-aligning conductive networks and contact clusters
US5528001A (en) * 1992-02-14 1996-06-18 Research Organization For Circuit Knowledge Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
US6092282A (en) * 1992-02-14 2000-07-25 Research Organization For Circuit Knowledge Method of manufacturing printed circuits
DE69435230D1 (de) * 1993-12-30 2009-10-01 Miyake Kk Verbundfolie mit schaltungsförmiger Metallfolie oder dergleichen und Verfahren zur Herstellung
US6214444B1 (en) 1993-12-30 2001-04-10 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and processing for producing them
US5751256A (en) * 1994-03-04 1998-05-12 Flexcon Company Inc. Resonant tag labels and method of making same
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
SG71080A1 (en) * 1994-12-01 2000-03-21 Miyake Kk Resonant tag and method for deactivating resonant frequency characteristics thereof
CA2171526C (en) * 1995-10-13 1997-11-18 Glen E. Mavity Combination article security target and printed label and method and apparatus for making and applying same
US5735991A (en) * 1995-10-20 1998-04-07 Olympus Optical Co., Ltd. Method for sealing and cutting pads and moving the sealed and cut pads to a take off position by a moving support
US5826329A (en) * 1995-12-19 1998-10-27 Ncr Corporation Method of making printed circuit board using thermal transfer techniques
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
US6334248B1 (en) 1996-09-20 2002-01-01 Total Register, Inc. Apparatus and method for the continuous high speed rotary application of stamping foil
US5814079A (en) * 1996-10-04 1998-09-29 Medtronic, Inc. Cardiac arrhythmia management by application of adnodal stimulation for hyperpolarization of myocardial cells
US6222452B1 (en) * 1996-12-16 2001-04-24 Confidence International Ab Electronic identification tag
WO1998037740A1 (en) * 1997-02-21 1998-08-27 Koninklijke Philips Electronics N.V. A method of selectively metallizing a substrate using a hot foil embossing technique
CA2318187A1 (en) * 1998-01-24 1999-07-29 Schober Gmbh Werkzeug- Und Maschinenbau Rotative cutting method and device for printed circuit boards and electric conductors
US6395373B2 (en) 1998-02-11 2002-05-28 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
DE19809193A1 (de) * 1998-03-04 1999-09-23 Hannes Riebl Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur
DE19840825A1 (de) * 1998-09-07 2000-03-30 Siemens Ag Verfahren zum Herstellen einer Schaltungsträgerplatte sowie Schaltungsträgerplatte
DE10054373B4 (de) * 2000-10-30 2004-08-12 Infineon Technologies Ag Verfahren und Vorrichtung zur Herstellung großflächiger planarer Wellenleiterstrukturen
US7017820B1 (en) 2001-02-08 2006-03-28 James Brunner Machine and process for manufacturing a label with a security element
US6988666B2 (en) * 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
US20030227057A1 (en) * 2002-06-07 2003-12-11 Lochtefeld Anthony J. Strained-semiconductor-on-insulator device structures
US6981318B2 (en) * 2002-10-22 2006-01-03 Jetta Company Limited Printed circuit board manufacturing method
US7183917B2 (en) * 2003-05-19 2007-02-27 Checkpoint Systems, Inc. EAS/RFID identification hard tags
SE526725C2 (sv) * 2003-09-17 2005-11-01 Acreo Ab Förfarande och anordning för tillverkning av elektriska komponenter
WO2005077621A1 (de) * 2004-02-12 2005-08-25 Schober Gmbh Werkzeug- Und Maschinenbau Rotationsschneideeinrichtung mit auslagesystem zum geordneten sortieren von zuschnitten
ITBO20050048A1 (it) * 2005-01-31 2006-08-01 Spal Automotive Srl Metodo e impianto per la produzione di circuiti elettrici
US20100071573A1 (en) * 2008-09-24 2010-03-25 Vanpelt Christopher K Foil transfer apparatus and process
TWI593322B (zh) 2010-11-19 2017-07-21 帝斯曼知識產權資產管理有限公司 金屬箔圖案積層體、金屬箔之模切方法、電路基板及其製造方法、以及太陽能電池模組
EP3300125B1 (en) * 2011-06-06 2020-01-15 DSM IP Assets B.V. Metal foil, patterned-laminate and a solar cell module
CN104812180B (zh) * 2012-06-01 2017-10-03 旗胜科技股份有限公司 双面可挠性基板片连接成卷的结构
EP3794566A1 (en) 2018-05-17 2021-03-24 Checkpoint Systems, Inc. Dual hard tag
CN109013228B (zh) * 2018-08-20 2021-04-06 湖北万事兴装饰材料有限公司 一种铝塑板的生产工艺
CN111818732B (zh) * 2020-08-27 2021-03-23 广东勤天投资有限公司 一种柔性线路板整形装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3301730A (en) * 1961-04-03 1967-01-31 Rogers Corp Method of making a printed circuit
US3678577A (en) * 1969-09-25 1972-07-25 Jerobee Ind Inc Method of contemporaneously shearing and bonding conductive foil to a substrate
EP0063347A1 (de) * 1981-04-22 1982-10-27 IVO Irion & Vosseler Zählerfabrik GmbH & Co. Prägefolie zum Aufbringen von Leiterbahnen
EP0292827A1 (de) * 1987-05-22 1988-11-30 Actron Entwicklungs AG Verfahren zur Herstellung von Etiketten mit jeweils einer einen Schwingkreis bildenden Schaltung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369557A (en) * 1980-08-06 1983-01-25 Jan Vandebult Process for fabricating resonant tag circuit constructions
DE3221500A1 (de) * 1982-06-07 1983-12-08 Max-E. Dipl.-Ing. 7320 Göppingen Reeb Identifizierungsanordnung in form eines an einem gegenstand anbringbaren gebildes und verfahren zur herstellung
CA1294117C (en) * 1986-09-29 1992-01-14 S. Eugene Benge Method of making deactivatable tags

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3301730A (en) * 1961-04-03 1967-01-31 Rogers Corp Method of making a printed circuit
US3678577A (en) * 1969-09-25 1972-07-25 Jerobee Ind Inc Method of contemporaneously shearing and bonding conductive foil to a substrate
EP0063347A1 (de) * 1981-04-22 1982-10-27 IVO Irion & Vosseler Zählerfabrik GmbH & Co. Prägefolie zum Aufbringen von Leiterbahnen
EP0292827A1 (de) * 1987-05-22 1988-11-30 Actron Entwicklungs AG Verfahren zur Herstellung von Etiketten mit jeweils einer einen Schwingkreis bildenden Schaltung

Also Published As

Publication number Publication date
EP0423651A1 (de) 1991-04-24
JPH03150893A (ja) 1991-06-27
US5184111A (en) 1993-02-02

Similar Documents

Publication Publication Date Title
CH680483A5 (en, 2012)
DE2523002C2 (de) Verfahren zur Herstellung einer Vielzahl von einzelnen ebenen Resonanz-Markierungs-Stromkreisen
DE69702321T2 (de) Verbesserungen in bezug auf sicherheitsdokumente
DE69700701T2 (de) Variable doppelseitige trägerlose etiketten
DE102007026720A1 (de) Selbstklebende Antenne für ein RFID-System, insbesondere für ein RFID-Etikett, und Verfahren zu ihrer Herstellung
EP2183707A1 (de) Verfahren und vorrichtung zur herstellung eines rfid-etiketts
DE4239846C2 (de) Verfahren und Vorrichtung zur Herstellung von Diebstahlsicherungsetiketten
WO2000065992A1 (de) Neutralelektrode
EP1395427B1 (de) Verfahren und vorrichtung zur herstellung eines tragbaren datenträgers
DE69023460T2 (de) Verfahren zum Herstellen von Etiketten.
DE69017372T2 (de) Verfahren zum Herstellen von Etiketten.
WO1984004493A1 (en) Identity card
DE3403364A1 (de) Verfahren und vorrichtung zur herstellung von bandfoermigem haftetikettenmaterial sowie selbstklebeetikett
DE2917417C2 (de) Verfahren zur mehrfarbigen Dekoration von Gegenständen und Prägefolie zur Durchführung des Verfahrens
EP2394259B1 (de) Wert- und/oder sicherheitsdokument und verfahren zur herstellung desselben
EP1168239A2 (de) Haftklebe-Etikett
DE3724267C2 (en, 2012)
EP0498040B1 (de) Verfahren zum Herstellen von Dokumenten mit Sicherheitsmarken
EP1640938A1 (de) Verfahren und Vorrichtung zum Stanzen und Prägen von Faltschachtelzuschnitten
DE2209764A1 (de) Laminate, insbesondere mehrschichtige klebefolie, und verfahren zur herstellung
DE10109519A1 (de) Prägefolie, Verfahren zur Herstellung der Prägefolie und zur Übertragung eines Etiketts von der Prägefolie auf ein Substrat
DE60219804T2 (de) Werterzeugnis und verfahren zu ihrer herstellung
DE102019131654B4 (de) Verfahren zur Herstellung von Banknoten mit jeweils mindestens einer integrierten Schaltung
DE102013215706A1 (de) Transfer-Stanzen
DE102019107177B4 (de) Verfahren zur Herstellung von Sichteffekten auf einem Bedruckstoff

Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased