CH673920A5 - - Google Patents

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Publication number
CH673920A5
CH673920A5 CH191287A CH191287A CH673920A5 CH 673920 A5 CH673920 A5 CH 673920A5 CH 191287 A CH191287 A CH 191287A CH 191287 A CH191287 A CH 191287A CH 673920 A5 CH673920 A5 CH 673920A5
Authority
CH
Switzerland
Prior art keywords
application according
ink jet
deflection
ink
substrate
Prior art date
Application number
CH191287A
Other languages
English (en)
French (fr)
Inventor
Rino Doriguzzi
Original Assignee
Rino Doriguzzi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rino Doriguzzi filed Critical Rino Doriguzzi
Priority to CH191287A priority Critical patent/CH673920A5/fr
Priority to PCT/CH1988/000090 priority patent/WO1988009598A1/fr
Publication of CH673920A5 publication Critical patent/CH673920A5/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
CH191287A 1987-05-19 1987-05-19 CH673920A5 (enrdf_load_stackoverflow)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (enrdf_load_stackoverflow) 1987-05-19 1987-05-19
PCT/CH1988/000090 WO1988009598A1 (fr) 1987-05-19 1988-05-17 Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH191287A CH673920A5 (enrdf_load_stackoverflow) 1987-05-19 1987-05-19

Publications (1)

Publication Number Publication Date
CH673920A5 true CH673920A5 (enrdf_load_stackoverflow) 1990-04-12

Family

ID=4221501

Family Applications (1)

Application Number Title Priority Date Filing Date
CH191287A CH673920A5 (enrdf_load_stackoverflow) 1987-05-19 1987-05-19

Country Status (2)

Country Link
CH (1) CH673920A5 (enrdf_load_stackoverflow)
WO (1) WO1988009598A1 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930641A3 (en) * 1998-01-19 2000-02-02 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
WO2002047447A1 (en) * 2000-12-09 2002-06-13 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements
US6730357B2 (en) 2000-03-23 2004-05-04 Seiko Epson Corporation Deposition of soluble materials
EP1475177A1 (en) * 2003-05-09 2004-11-10 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
EP1672971A4 (en) * 2003-09-12 2009-08-19 Nat Inst Of Advanced Ind Scien SUBSTRATE AND METHOD FOR ITS MANUFACTURE

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2718142B1 (fr) * 1994-03-31 1996-12-20 Toxot Science & Appl Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre.
EP1070444B1 (de) * 1998-04-09 2002-04-17 B.R. Deutschland, vertr.d. Bundesministerium f. Wirtschaft u. Technologie, dieses vertr.d. Präs. d. Phys.-Techn. Bundesanstalt Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
FR2797976B1 (fr) * 1999-08-25 2002-03-22 Gemplus Card Int Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8429754D0 (en) * 1984-11-24 1985-01-03 Plessey Co Plc Coating electrical equipment

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0930641A3 (en) * 1998-01-19 2000-02-02 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US6877853B2 (en) 1998-01-19 2005-04-12 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US7114802B2 (en) 1998-01-19 2006-10-03 Seiko Epson Corporation Pattern formation method and substrate manufacturing apparatus
US6730357B2 (en) 2000-03-23 2004-05-04 Seiko Epson Corporation Deposition of soluble materials
WO2002047447A1 (en) * 2000-12-09 2002-06-13 Xaar Technology Limited Method of forming electrically conductive elements and patterns of such elements
EP1475177A1 (en) * 2003-05-09 2004-11-10 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
EP1672971A4 (en) * 2003-09-12 2009-08-19 Nat Inst Of Advanced Ind Scien SUBSTRATE AND METHOD FOR ITS MANUFACTURE

Also Published As

Publication number Publication date
WO1988009598A1 (fr) 1988-12-01

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