WO1988009598A1 - Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes - Google Patents
Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes Download PDFInfo
- Publication number
- WO1988009598A1 WO1988009598A1 PCT/CH1988/000090 CH8800090W WO8809598A1 WO 1988009598 A1 WO1988009598 A1 WO 1988009598A1 CH 8800090 W CH8800090 W CH 8800090W WO 8809598 A1 WO8809598 A1 WO 8809598A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic circuits
- application
- ink jet
- circuits according
- manufacturing electronic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000003068 static effect Effects 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 230000005684 electric field Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000976 ink Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 10
- 238000011161 development Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004590 computer program Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/105—Using an electrical field; Special methods of applying an electric potential
Definitions
- development consists in the development of a lay-out and then a photo-graphic film on a 1/1 scale which will be used for the production of screen-printing screens, the manufacturing being done by serigraphy on ceramic substrate, one per layer; the layers are then baked in an oven.
- development consists in developing a lay-out and then a photographic plate on a 1/1 scale, one for each layer of different materials, the manufacturing being done by evaporation under vacuum on a ceramic substrate, one per layer followed by a selective chemical attack on each layer after having exposed a sensitive photo layer serving as a mask.
- the development consists in the elaboration of a lay-out then of a photographic plate on the scale 1/1 which will be used in the manufacturing to expose a sensitive photo layer deposited on the support in gold material ⁇ ganique followed by a selective chemical attack.
- Figure 1 gives the principle of manufacturing electronic circuits by ink jet according to the invention.
- a pump 1 sends a very fine ink jet 2 which, while passing through the electro ⁇ of 3, is charged with static electricity. It then passes between two pairs of deflection electrodes VI and V2 for the vertical deflection, Hl and H2 for the horizontal deflection to finish on the substrate 4 which will constitute the electronic circuit.
- the deflection of the ink jet by the deflection plates VI, V2, Hl and H2 is controlled by a computer 5.
- inks necessary for the manufacture of hybrid electronic circuits printed by the method described above will be of several categories which depend on the support. For example, inks for hybrid circuits made on ceramic support are baked at high temperature: about 800 to 900 K, inks for hybrid circuits made on porcelain support are baked at medium temperature: about 600 ° K, inks for circuits prints made on organic support such as epoxy are cooked at low temperature: about 125 to 150 ° K,
- the circuits can be made on substrates of any shape and large dimensions.
- an inkjet device is less expensive than an automatic screen printer, a vacuum evaporator or a mask aligner.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH191287A CH673920A5 (enrdf_load_stackoverflow) | 1987-05-19 | 1987-05-19 | |
| CH1912/87-3 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1988009598A1 true WO1988009598A1 (fr) | 1988-12-01 |
Family
ID=4221501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CH1988/000090 WO1988009598A1 (fr) | 1987-05-19 | 1988-05-17 | Application du procede par jet d'encre pour la fabrication de circuits electroniques hybrides et imprimes |
Country Status (2)
| Country | Link |
|---|---|
| CH (1) | CH673920A5 (enrdf_load_stackoverflow) |
| WO (1) | WO1988009598A1 (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2718142A1 (fr) * | 1994-03-31 | 1995-10-06 | Toxot Science & Appl | Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre. |
| WO1999053738A1 (de) * | 1998-04-09 | 1999-10-21 | Institut für Diagnostikforschung GmbH an der Freien Universität Berlin | Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen |
| WO2001015504A1 (fr) * | 1999-08-25 | 2001-03-01 | Gemplus | Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4003273B2 (ja) | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | パターン形成方法および基板製造装置 |
| GB2360489A (en) | 2000-03-23 | 2001-09-26 | Seiko Epson Corp | Deposition of soluble materials |
| GB0030095D0 (en) * | 2000-12-09 | 2001-01-24 | Xaar Technology Ltd | Method of ink jet printing |
| US20040224541A1 (en) * | 2003-05-09 | 2004-11-11 | Murata Co., Ltd. | Apparatus and method for forming solder wicking prevention zone and electronic part |
| KR101160701B1 (ko) * | 2003-09-12 | 2012-06-28 | 도꾸리쯔교세이호진 상교기쥬쯔 소고겡뀨죠 | 기판 및 그 제조방법 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986003366A1 (en) * | 1984-11-24 | 1986-06-05 | Plessey Overseas Limited | Improvements relating to protectively coating electrical equipment |
-
1987
- 1987-05-19 CH CH191287A patent/CH673920A5/fr not_active IP Right Cessation
-
1988
- 1988-05-17 WO PCT/CH1988/000090 patent/WO1988009598A1/fr unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986003366A1 (en) * | 1984-11-24 | 1986-06-05 | Plessey Overseas Limited | Improvements relating to protectively coating electrical equipment |
Non-Patent Citations (1)
| Title |
|---|
| IBM Technical Disclosure Bulletin, vol. 15, no. 9, fevrier 1973, E.P. Damm, Jr.: "Forming metallized patterns on ceramic substrates", pages 2841, 2842 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2718142A1 (fr) * | 1994-03-31 | 1995-10-06 | Toxot Science & Appl | Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre. |
| WO1999053738A1 (de) * | 1998-04-09 | 1999-10-21 | Institut für Diagnostikforschung GmbH an der Freien Universität Berlin | Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen |
| WO2001015504A1 (fr) * | 1999-08-25 | 2001-03-01 | Gemplus | Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede |
| FR2797976A1 (fr) * | 1999-08-25 | 2001-03-02 | Gemplus Card Int | Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede |
Also Published As
| Publication number | Publication date |
|---|---|
| CH673920A5 (enrdf_load_stackoverflow) | 1990-04-12 |
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