CH643598A5 - Vakuumaufdampfanlage mit einer ventilkammer, einer bedampfungskammer und einer verdampferkammer. - Google Patents

Vakuumaufdampfanlage mit einer ventilkammer, einer bedampfungskammer und einer verdampferkammer. Download PDF

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Publication number
CH643598A5
CH643598A5 CH460080A CH460080A CH643598A5 CH 643598 A5 CH643598 A5 CH 643598A5 CH 460080 A CH460080 A CH 460080A CH 460080 A CH460080 A CH 460080A CH 643598 A5 CH643598 A5 CH 643598A5
Authority
CH
Switzerland
Prior art keywords
chamber
valve
evaporator
vacuum
evaporation system
Prior art date
Application number
CH460080A
Other languages
German (de)
English (en)
Inventor
Peter Mahler
Original Assignee
Leybold Heraeus Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Heraeus Gmbh & Co Kg filed Critical Leybold Heraeus Gmbh & Co Kg
Publication of CH643598A5 publication Critical patent/CH643598A5/de

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/139Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CH460080A 1979-10-03 1980-06-16 Vakuumaufdampfanlage mit einer ventilkammer, einer bedampfungskammer und einer verdampferkammer. CH643598A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792940064 DE2940064A1 (de) 1979-10-03 1979-10-03 Vakuumaufdampfanlage mir einer ventilkammer, einer bedampfungskammer und einer verdampferkammer

Publications (1)

Publication Number Publication Date
CH643598A5 true CH643598A5 (de) 1984-06-15

Family

ID=6082573

Family Applications (1)

Application Number Title Priority Date Filing Date
CH460080A CH643598A5 (de) 1979-10-03 1980-06-16 Vakuumaufdampfanlage mit einer ventilkammer, einer bedampfungskammer und einer verdampferkammer.

Country Status (6)

Country Link
US (1) US4338883A (OSRAM)
JP (1) JPS5658966A (OSRAM)
CH (1) CH643598A5 (OSRAM)
DE (1) DE2940064A1 (OSRAM)
FR (1) FR2466513A1 (OSRAM)
GB (1) GB2062690B (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4418646A (en) * 1982-03-29 1983-12-06 Eaton Corporation Load lock valve
US4464342A (en) * 1982-05-14 1984-08-07 At&T Bell Laboratories Molecular beam epitaxy apparatus for handling phosphorus
US4478174A (en) * 1983-02-25 1984-10-23 Canadian Patents & Development Limited Vacuum coating vessel with movable shutter plate
FR2549857B1 (fr) * 1983-07-26 1985-10-04 Allovon Michel Dispositif d'evaporation sous vide
US4607593A (en) * 1983-12-23 1986-08-26 U.S. Philips Corporation Apparatus for processing articles in a controlled environment
US4592926A (en) * 1984-05-21 1986-06-03 Machine Technology, Inc. Processing apparatus and method
CH663037A5 (de) * 1985-02-05 1987-11-13 Balzers Hochvakuum Dampfquelle fuer vakuumbeschichtungsanlagen.
US4966519A (en) * 1985-10-24 1990-10-30 Texas Instruments Incorporated Integrated circuit processing system
US4923584A (en) * 1988-10-31 1990-05-08 Eaton Corporation Sealing apparatus for a vacuum processing system
US5002010A (en) * 1989-10-18 1991-03-26 Varian Associates, Inc. Vacuum vessel
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6103069A (en) * 1997-03-31 2000-08-15 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
WO2013074345A1 (en) 2011-11-18 2013-05-23 First Solar, Inc. Vapor transport deposition method and system for material co-deposition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3206322A (en) * 1960-10-31 1965-09-14 Morgan John Robert Vacuum deposition means and methods for manufacture of electronic components
US3524426A (en) * 1968-02-29 1970-08-18 Libbey Owens Ford Glass Co Apparatus for coating by thermal evaporation
US3649339A (en) * 1969-09-05 1972-03-14 Eugene C Smith Apparatus and method for securing a high vacuum for particle coating process
US3656454A (en) * 1970-11-23 1972-04-18 Air Reduction Vacuum coating apparatus
US3641973A (en) * 1970-11-25 1972-02-15 Air Reduction Vacuum coating apparatus
CH540349A (de) * 1971-03-15 1973-08-15 Balzers Patent Beteilig Ag Vakuumanlage mit zwei getrennt evakuierbaren Kammern zum Behandeln von Gut
DE2330710A1 (de) * 1973-06-16 1975-01-09 Leybold Heraeus Gmbh & Co Kg Vakuumaufdampfvorrichtung mit mehreren kammern
CH573985A5 (OSRAM) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US3921572A (en) * 1974-02-25 1975-11-25 Ibm Vacuum coating apparatus

Also Published As

Publication number Publication date
JPS5658966A (en) 1981-05-22
DE2940064A1 (de) 1981-04-16
US4338883A (en) 1982-07-13
GB2062690A (en) 1981-05-28
FR2466513A1 (fr) 1981-04-10
GB2062690B (en) 1984-05-02
FR2466513B1 (OSRAM) 1984-04-27

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PL Patent ceased
PL Patent ceased