CH616295GA3 - - Google Patents

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Publication number
CH616295GA3
CH616295GA3 CH57577A CH57577A CH616295GA3 CH 616295G A3 CH616295G A3 CH 616295GA3 CH 57577 A CH57577 A CH 57577A CH 57577 A CH57577 A CH 57577A CH 616295G A3 CH616295G A3 CH 616295GA3
Authority
CH
Switzerland
Prior art keywords
module structure
resilient connector
display
circuit board
display means
Prior art date
Application number
CH57577A
Other languages
English (en)
Other versions
CH616295B (ro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH616295B publication Critical patent/CH616295B/xx
Application filed filed Critical
Publication of CH616295GA3 publication Critical patent/CH616295GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G9/00—Visual time or date indication means
    • G04G9/08—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques
    • G04G9/12—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G9/00—Visual time or date indication means
    • G04G9/02—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques
    • G04G9/06—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electric Clocks (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CH57577A 1976-01-20 1977-01-18 CH616295GA3 (ro)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP464676A JPS5288370A (en) 1976-01-20 1976-01-20 Electronic watch

Publications (2)

Publication Number Publication Date
CH616295B CH616295B (ro)
CH616295GA3 true CH616295GA3 (ro) 1980-03-31

Family

ID=11589718

Family Applications (1)

Application Number Title Priority Date Filing Date
CH57577A CH616295GA3 (ro) 1976-01-20 1977-01-18

Country Status (4)

Country Link
US (1) US4238848A (ro)
JP (1) JPS5288370A (ro)
CH (1) CH616295GA3 (ro)
DE (1) DE2701448A1 (ro)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000336B (en) * 1977-06-20 1982-07-07 Hitachi Ltd Electronic device and method of fabricating the same
JPS603632B2 (ja) * 1977-11-30 1985-01-29 セイコーインスツルメンツ株式会社 電子時計
JPS54114967U (ro) * 1978-01-31 1979-08-13
GB2075726B (en) * 1980-05-02 1983-11-23 Suwa Seikosha Kk Electronic timepiece
US4342105A (en) * 1980-06-23 1982-07-27 Timex Corporation Timepiece module frame and assembly
FR2514536A1 (fr) * 1981-10-14 1983-04-15 Sfena Element modulaire d'affichage a cristaux liquides
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members
JPS6059677A (ja) * 1983-09-09 1985-04-06 株式会社東芝 配線基板の接続装置
FR2583895A1 (fr) * 1985-06-25 1986-12-26 Graff Bruno Systeme d'indication de l'heure qu'il est, par la combinaison de symboles graphiques
JPS6312795U (ro) * 1987-06-18 1988-01-27
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5607882A (en) * 1994-12-20 1997-03-04 Lucent Technologies Inc. Multi-component electronic devices and methods for making them
US6976295B2 (en) * 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device
JP2001255833A (ja) * 2000-03-10 2001-09-21 Seiko Instruments Inc 電子機器用表示装置
JP3659175B2 (ja) * 2001-02-16 2005-06-15 株式会社村田製作所 半導体チップの製造方法および半導体ウエハ
EP1437683B1 (en) * 2002-12-27 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. IC card and booking account system using the IC card
US7652359B2 (en) * 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
US7566001B2 (en) * 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US7130185B2 (en) * 2004-06-02 2006-10-31 Research In Motion Limited Handheld computing device having drop-resistant LCD display
DE102008018930A1 (de) * 2007-04-17 2008-11-20 C2Cure Inc., Wilmington Bildgebende Systeme und Verfahren, insbesondere zur Verwendung mit einem bei offener Chirurgie verwendeten Instrument
CN101836426B (zh) * 2007-12-14 2013-09-18 富士通株式会社 显示板结构体、使用其的电子装置、以及便携式信息设备
DE102008036837A1 (de) * 2008-08-07 2010-02-18 Epcos Ag Sensorvorrichtung und Verfahren zur Herstellung
JP4905815B2 (ja) * 2009-10-28 2012-03-28 カシオ計算機株式会社 緩衝部材、腕時計の衝撃緩衝構造および腕時計
CN107393948B (zh) * 2017-08-11 2020-05-19 武汉华星光电半导体显示技术有限公司 用于固定柔性显示面板的中框及柔性显示装置
US10362684B1 (en) * 2018-10-11 2019-07-23 National Chung-Shan Institute Of Science And Technology Method for improving adhesion between ceramic carrier and thick film circuit
KR20210003410A (ko) * 2019-07-02 2021-01-12 삼성전자주식회사 도전성 연결 부재를 포함하는 전자 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672155A (en) * 1970-05-06 1972-06-27 Hamilton Watch Co Solid state watch
US3861135A (en) * 1973-02-08 1975-01-21 Chomerics Inc Electrical interconnector and method of making
DE2410527C3 (de) * 1973-03-08 1983-11-03 Casio Computer Co., Ltd., Tokyo Elektronisches Zeitanzeigegerät
US3800525A (en) * 1973-08-07 1974-04-02 Time Computer Solid state watch with magnetic setting
US3863436A (en) * 1974-04-18 1975-02-04 Timex Corp Solid state quartz watch
US3945196A (en) * 1974-05-30 1976-03-23 American Microsystems, Inc. Universal solid state time-keeping package
US3977176A (en) * 1974-08-22 1976-08-31 Citizen Watch Co., Ltd. Electronic watch structure
US3983689A (en) * 1975-03-31 1976-10-05 Hughes Aircraft Company Electronic watch construction

Also Published As

Publication number Publication date
DE2701448A1 (de) 1977-07-28
CH616295B (ro)
JPS5288370A (en) 1977-07-23
US4238848A (en) 1980-12-09

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