CH616295GA3 - - Google Patents

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Publication number
CH616295GA3
CH616295GA3 CH57577A CH57577A CH616295GA3 CH 616295G A3 CH616295G A3 CH 616295GA3 CH 57577 A CH57577 A CH 57577A CH 57577 A CH57577 A CH 57577A CH 616295G A3 CH616295G A3 CH 616295GA3
Authority
CH
Switzerland
Prior art keywords
module structure
resilient connector
display
circuit board
display means
Prior art date
Application number
CH57577A
Other versions
CH616295B (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH616295B publication Critical patent/CH616295B/xx
Application filed filed Critical
Publication of CH616295GA3 publication Critical patent/CH616295GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G9/00—Visual time or date indication means
    • G04G9/08—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques
    • G04G9/12—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G9/00—Visual time or date indication means
    • G04G9/02—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques
    • G04G9/06—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Abstract

An electronic timepiece comprising a module structure, the module structure comprising circuit board means including a plurality of circuit boards, display means having a display panel disposed on one surface and input terminals disposed on the other surface, resilient connector means having resiliency and conductivity, and an assembling casing for assembling the circuit board means, the display means and the resilient connector means. The resilient connector means affords the electric interconnection of said plurality of circuit boards and said display means and prevents damage of the module structure by shocks.
CH57577A 1976-01-20 1977-01-18 CH616295GA3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP464676A JPS5288370A (en) 1976-01-20 1976-01-20 Electronic watch

Publications (2)

Publication Number Publication Date
CH616295B CH616295B (en)
CH616295GA3 true CH616295GA3 (en) 1980-03-31

Family

ID=11589718

Family Applications (1)

Application Number Title Priority Date Filing Date
CH57577A CH616295GA3 (en) 1976-01-20 1977-01-18

Country Status (4)

Country Link
US (1) US4238848A (en)
JP (1) JPS5288370A (en)
CH (1) CH616295GA3 (en)
DE (1) DE2701448A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2072894B (en) * 1977-06-20 1982-08-25 Hitachi Ltd Electronic device eg an electronic watch
JPS603632B2 (en) * 1977-11-30 1985-01-29 セイコーインスツルメンツ株式会社 electronic clock
JPS54114967U (en) * 1978-01-31 1979-08-13
GB2075726B (en) * 1980-05-02 1983-11-23 Suwa Seikosha Kk Electronic timepiece
US4342105A (en) * 1980-06-23 1982-07-27 Timex Corporation Timepiece module frame and assembly
FR2514536A1 (en) * 1981-10-14 1983-04-15 Sfena LCD module with separate display and electronics - uses two circuit boards linked by printed circuit board connecting into flexible multi-conductor connectors on boards
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members
JPS6059677A (en) * 1983-09-09 1985-04-06 株式会社東芝 Device for connecting circuit board
FR2583895A1 (en) * 1985-06-25 1986-12-26 Graff Bruno SYSTEM FOR INDICATING THE TIME IT IS THROUGH THE COMBINATION OF GRAPHIC SYMBOLS
JPS6312795U (en) * 1987-06-18 1988-01-27
JPH05169885A (en) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp Thin ic card
US5607882A (en) * 1994-12-20 1997-03-04 Lucent Technologies Inc. Multi-component electronic devices and methods for making them
US6976295B2 (en) * 1997-07-29 2005-12-20 Seiko Epson Corporation Method of manufacturing a piezoelectric device
JP2001255833A (en) * 2000-03-10 2001-09-21 Seiko Instruments Inc Display device for electronic equipment
JP3659175B2 (en) * 2001-02-16 2005-06-15 株式会社村田製作所 Semiconductor chip manufacturing method and semiconductor wafer
EP1437683B1 (en) * 2002-12-27 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. IC card and booking account system using the IC card
US7652359B2 (en) * 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
US7566001B2 (en) 2003-08-29 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. IC card
US7130185B2 (en) * 2004-06-02 2006-10-31 Research In Motion Limited Handheld computing device having drop-resistant LCD display
DE102008018930A1 (en) * 2007-04-17 2008-11-20 C2Cure Inc., Wilmington Electronic component for use in imaging system i.e. camera system, for surgical instrument, has integrated circuit fastened to front side of substrate and electrically connected with continuous lines at front side
WO2009078057A1 (en) * 2007-12-14 2009-06-25 Fujitsu Limited Display panel structure, electronic device using the same, and portable information device
DE102008036837A1 (en) * 2008-08-07 2010-02-18 Epcos Ag Sensor device and method of manufacture
JP4905815B2 (en) * 2009-10-28 2012-03-28 カシオ計算機株式会社 Cushioning member, impact buffering structure of wristwatch, and wristwatch
CN107393948B (en) * 2017-08-11 2020-05-19 武汉华星光电半导体显示技术有限公司 Middle frame for fixing flexible display panel and flexible display device
US10362684B1 (en) * 2018-10-11 2019-07-23 National Chung-Shan Institute Of Science And Technology Method for improving adhesion between ceramic carrier and thick film circuit
KR20210003410A (en) * 2019-07-02 2021-01-12 삼성전자주식회사 Electronic device including electrically connecting member

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672155A (en) * 1970-05-06 1972-06-27 Hamilton Watch Co Solid state watch
US3861135A (en) * 1973-02-08 1975-01-21 Chomerics Inc Electrical interconnector and method of making
DE2410527C3 (en) * 1973-03-08 1983-11-03 Casio Computer Co., Ltd., Tokyo Electronic time display device
US3800525A (en) * 1973-08-07 1974-04-02 Time Computer Solid state watch with magnetic setting
US3863436A (en) * 1974-04-18 1975-02-04 Timex Corp Solid state quartz watch
US3945196A (en) * 1974-05-30 1976-03-23 American Microsystems, Inc. Universal solid state time-keeping package
US3977176A (en) * 1974-08-22 1976-08-31 Citizen Watch Co., Ltd. Electronic watch structure
US3983689A (en) * 1975-03-31 1976-10-05 Hughes Aircraft Company Electronic watch construction

Also Published As

Publication number Publication date
DE2701448A1 (en) 1977-07-28
JPS5288370A (en) 1977-07-23
CH616295B (en)
US4238848A (en) 1980-12-09

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