CH615464A5 - Special compositions and particular additives for gold electrolysis baths and their use - Google Patents

Special compositions and particular additives for gold electrolysis baths and their use Download PDF

Info

Publication number
CH615464A5
CH615464A5 CH707176A CH707176A CH615464A5 CH 615464 A5 CH615464 A5 CH 615464A5 CH 707176 A CH707176 A CH 707176A CH 707176 A CH707176 A CH 707176A CH 615464 A5 CH615464 A5 CH 615464A5
Authority
CH
Switzerland
Prior art keywords
nitro
gold
acid
composition according
compound
Prior art date
Application number
CH707176A
Other languages
English (en)
French (fr)
Inventor
Franco Zuntini
Original Assignee
Systemes Traitements Surfaces
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Systemes Traitements Surfaces filed Critical Systemes Traitements Surfaces
Priority to CH707176A priority Critical patent/CH615464A5/fr
Priority to DE19772723910 priority patent/DE2723910C2/de
Priority to FR7716583A priority patent/FR2353656A1/fr
Publication of CH615464A5 publication Critical patent/CH615464A5/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH707176A 1976-06-01 1976-06-01 Special compositions and particular additives for gold electrolysis baths and their use CH615464A5 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH707176A CH615464A5 (en) 1976-06-01 1976-06-01 Special compositions and particular additives for gold electrolysis baths and their use
DE19772723910 DE2723910C2 (de) 1976-06-01 1977-05-26 Zusatzgemisch und dessen Verwendung für Bäder zur elektrolytischen Abscheidung von Gold oder Goldlegierungen
FR7716583A FR2353656A1 (fr) 1976-06-01 1977-05-31 Composition d'addition pour bains electrolytiques de placage d'or et d'alliages d'or et son utilisation pour ameliorer ceux-ci

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH707176A CH615464A5 (en) 1976-06-01 1976-06-01 Special compositions and particular additives for gold electrolysis baths and their use

Publications (1)

Publication Number Publication Date
CH615464A5 true CH615464A5 (en) 1980-01-31

Family

ID=4319470

Family Applications (1)

Application Number Title Priority Date Filing Date
CH707176A CH615464A5 (en) 1976-06-01 1976-06-01 Special compositions and particular additives for gold electrolysis baths and their use

Country Status (3)

Country Link
CH (1) CH615464A5 (de)
DE (1) DE2723910C2 (de)
FR (1) FR2353656A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102517614A (zh) * 2011-12-20 2012-06-27 安徽华东光电技术研究所 一种在铝硅合金上电镀金的镀液配方及其电镀方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH622829A5 (de) * 1977-08-29 1981-04-30 Systemes Traitements Surfaces
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
EP0121492B1 (de) * 1983-02-07 1988-06-15 Heinz Emmenegger Galvanisches Bad für das Elektroplattieren einer Gold-Kupfer-Cadmiumlegierung, Verfahren zur Verwendung dieses Bades und aus diesem Verfahren resultierender Gegenstand
DE3319772A1 (de) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen Bad fuer die galvanische abscheidung von goldlegierungen
DE3328067A1 (de) * 1983-08-03 1985-02-21 Siemens AG, 1000 Berlin und 8000 München Bad und verfahren zum galvanischen abscheiden von edelmetall- und edelmetallhaltigen dispersionsueberzuegen
EP0304315B1 (de) * 1987-08-21 1993-03-03 Engelhard Limited Bad für das Elektroplattieren einer Gold-Kupfer-Zink-Legierung
DE3805627A1 (de) † 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
DE10110743A1 (de) * 2001-02-28 2002-09-05 Wieland Dental & Technik Gmbh Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
KR101079554B1 (ko) 2008-06-11 2011-11-04 니혼 고쥰도가가쿠 가부시키가이샤 전해 금도금액 및 그것을 이용하여 얻어진 금피막
JP5513784B2 (ja) * 2008-08-25 2014-06-04 日本エレクトロプレイテイング・エンジニヤース株式会社 硬質金系めっき液
JP2014139348A (ja) * 2008-08-25 2014-07-31 Electroplating Eng Of Japan Co 硬質金系めっき液
DE102011056318B3 (de) * 2011-12-13 2013-04-18 Doduco Gmbh Elektrolytisches Bad zum Abscheiden einer Goldkupferlegierung
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
EP3604626A1 (de) 2018-08-03 2020-02-05 COVENTYA S.p.A. Galvanisches bad zur abscheidung einer schwarzen legierung, verfahren zur elektrochemischen abscheidung einer schwarzen legierung auf einem substrat, schwarze legierung und mit solch einer schwarzen legierung beschichteter artikel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH286122A (fr) * 1952-04-28 1952-10-15 Spreter Victor Procédé pour le dépôt de revêtements en or ou en alliages d'or par voie galvanique.
US3833488A (en) * 1971-08-20 1974-09-03 Auric Corp Gold electroplating baths and process
US3776822A (en) * 1972-03-27 1973-12-04 Engelhard Min & Chem Gold plating electrolyte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102517614A (zh) * 2011-12-20 2012-06-27 安徽华东光电技术研究所 一种在铝硅合金上电镀金的镀液配方及其电镀方法

Also Published As

Publication number Publication date
FR2353656A1 (fr) 1977-12-30
DE2723910A1 (de) 1977-12-15
DE2723910C2 (de) 1984-03-01
FR2353656B1 (de) 1980-10-24

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Legal Events

Date Code Title Description
PFA Name/firm changed

Owner name: SYSTEMES DE TRAITEMENTS DE SURFACES S.A.

PL Patent ceased