CH615082GA3 - - Google Patents

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Publication number
CH615082GA3
CH615082GA3 CH579976A CH579976A CH615082GA3 CH 615082G A3 CH615082G A3 CH 615082GA3 CH 579976 A CH579976 A CH 579976A CH 579976 A CH579976 A CH 579976A CH 615082G A3 CH615082G A3 CH 615082GA3
Authority
CH
Switzerland
Prior art keywords
chip
lead frame
wire
base plate
bonding
Prior art date
Application number
CH579976A
Other languages
English (en)
Other versions
CH615082B (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH615082B publication Critical patent/CH615082B/fr
Application filed filed Critical
Publication of CH615082GA3 publication Critical patent/CH615082GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49579—Watch or clock making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electronic Switches (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electromechanical Clocks (AREA)
CH579976A 1975-05-08 1976-05-07 Procede d'assemblage de constituants d'une montre electronique. CH615082B (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50055762A JPS51130866A (en) 1975-05-08 1975-05-08 Method of mounting electronic timekeeper circuits

Publications (2)

Publication Number Publication Date
CH615082B CH615082B (fr)
CH615082GA3 true CH615082GA3 (de) 1980-01-15

Family

ID=13007848

Family Applications (1)

Application Number Title Priority Date Filing Date
CH579976A CH615082B (fr) 1975-05-08 1976-05-07 Procede d'assemblage de constituants d'une montre electronique.

Country Status (6)

Country Link
US (1) US4086696A (de)
JP (1) JPS51130866A (de)
CH (1) CH615082B (de)
DE (1) DE2619833A1 (de)
FR (1) FR2310588A1 (de)
GB (1) GB1503098A (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5351958U (de) * 1976-10-06 1978-05-02
JPS53103659U (de) * 1977-01-25 1978-08-21
US4254448A (en) * 1979-05-14 1981-03-03 Western Electric Company, Inc. Techniques for assembling electrical components with printed circuit boards
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
DE3427908C2 (de) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger
JPS60100461A (ja) * 1984-10-01 1985-06-04 Hitachi Ltd 電子装置の製造方法
US4656384A (en) * 1984-10-25 1987-04-07 Siemens Aktiengesellschaft Ultrasonic detection sensor in hybrid structure with appertaining electronic circuit
JPS62108607A (ja) * 1985-11-06 1987-05-19 Murata Mfg Co Ltd 圧電部品
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
DE3623419A1 (de) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers
DE3809005A1 (de) * 1988-03-17 1989-09-28 Hitachi Semiconductor Europ Gm Chipmodul und seine herstellung und verwendung
US5240746A (en) * 1991-02-25 1993-08-31 Delco Electronics Corporation System for performing related operations on workpieces
US5271953A (en) * 1991-02-25 1993-12-21 Delco Electronics Corporation System for performing work on workpieces
US5368899A (en) * 1992-02-28 1994-11-29 Delco Electronics Corp. Automatic vertical dip coater with simultaneous ultraviolet cure
TW272311B (de) * 1994-01-12 1996-03-11 At & T Corp
TW382079B (en) * 1998-08-28 2000-02-11 Via Tech Inc Integrated real time clock integrated circuit device and manufacturing method thereof
JP2000114918A (ja) * 1998-10-05 2000-04-21 Mitsubishi Electric Corp 表面弾性波装置及びその製造方法
JP3908512B2 (ja) * 2001-11-16 2007-04-25 セイコーインスツル株式会社 圧電トランスデューサ及び脈波検出装置
JP2008124097A (ja) * 2006-11-09 2008-05-29 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその作製方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3791025A (en) * 1972-04-06 1974-02-12 Teledyne Inc Method of manufacturing an electronic assembly
JPS5028662A (de) * 1973-07-17 1975-03-24
US3981138A (en) * 1973-05-31 1976-09-21 Uranus Electronics, Inc. Digital display timepiece
US3863436A (en) * 1974-04-18 1975-02-04 Timex Corp Solid state quartz watch
US3999285A (en) * 1975-06-30 1976-12-28 Burroughs Corporation Semiconductor device package

Also Published As

Publication number Publication date
FR2310588A1 (fr) 1976-12-03
FR2310588B1 (de) 1981-07-31
US4086696A (en) 1978-05-02
DE2619833A1 (de) 1976-11-18
JPS51130866A (en) 1976-11-13
CH615082B (fr)
GB1503098A (en) 1978-03-08

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