CH550862A - Verfahren zum abscheiden hochschmelzender metallschichten bei niedrigen temperaturen. - Google Patents

Verfahren zum abscheiden hochschmelzender metallschichten bei niedrigen temperaturen.

Info

Publication number
CH550862A
CH550862A CH1880269A CH1880269A CH550862A CH 550862 A CH550862 A CH 550862A CH 1880269 A CH1880269 A CH 1880269A CH 1880269 A CH1880269 A CH 1880269A CH 550862 A CH550862 A CH 550862A
Authority
CH
Switzerland
Prior art keywords
metal layers
low temperatures
high melting
melting metal
depositing high
Prior art date
Application number
CH1880269A
Other languages
German (de)
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH550862A publication Critical patent/CH550862A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0236—Pretreatment of the material to be coated by cleaning or etching by etching with a reactive gas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
CH1880269A 1969-01-02 1969-12-18 Verfahren zum abscheiden hochschmelzender metallschichten bei niedrigen temperaturen. CH550862A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691900119 DE1900119B2 (de) 1969-01-02 1969-01-02 Verfahren zum abscheiden hochschmelzender kontaktmetallschichten bei niedrigen temperaturen

Publications (1)

Publication Number Publication Date
CH550862A true CH550862A (de) 1974-06-28

Family

ID=5721667

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1880269A CH550862A (de) 1969-01-02 1969-12-18 Verfahren zum abscheiden hochschmelzender metallschichten bei niedrigen temperaturen.

Country Status (9)

Country Link
US (1) US3619288A (enrdf_load_stackoverflow)
JP (1) JPS4822886B1 (enrdf_load_stackoverflow)
AT (1) AT293813B (enrdf_load_stackoverflow)
CH (1) CH550862A (enrdf_load_stackoverflow)
DE (1) DE1900119B2 (enrdf_load_stackoverflow)
FR (1) FR2027649A1 (enrdf_load_stackoverflow)
GB (1) GB1251631A (enrdf_load_stackoverflow)
NL (1) NL6915312A (enrdf_load_stackoverflow)
SE (1) SE341864B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0241155A1 (en) * 1986-03-31 1987-10-14 Unisys Corporation Depositing vanadium underlayer for magnetic films

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250210A (en) 1977-12-27 1981-02-10 The International Nickel Co., Inc. Chemical vapor deposition
DE2929630C2 (de) * 1979-07-21 1983-12-15 Dornier System Gmbh, 7990 Friedrichshafen Verfahren zur Herstellung von Silberpulver
US4817557A (en) * 1983-05-23 1989-04-04 Anicon, Inc. Process and apparatus for low pressure chemical vapor deposition of refractory metal
US4619840A (en) * 1983-05-23 1986-10-28 Thermco Systems, Inc. Process and apparatus for low pressure chemical vapor deposition of refractory metal
JPS6050920A (ja) * 1983-08-30 1985-03-22 Toshiba Corp 半導体装置の製造方法
US4478890A (en) * 1983-09-12 1984-10-23 The United States Of America As Represented By The Secretary Of The Navy Low temperature deposition of nickel films
JPS6164344U (enrdf_load_stackoverflow) * 1984-09-29 1986-05-01
JPS6265754A (ja) * 1985-09-18 1987-03-25 富士ゼロツクスオフイスサプライ株式会社 細断機
US4868005A (en) * 1986-04-09 1989-09-19 Massachusetts Institute Of Technology Method and apparatus for photodeposition of films on surfaces
US4748045A (en) * 1986-04-09 1988-05-31 Massachusetts Institute Of Technology Method and apparatus for photodeposition of films on surfaces
US4668528A (en) * 1986-04-09 1987-05-26 Massachusetts Institute Of Technology Method and apparatus for photodeposition of films on surfaces
GB8620273D0 (en) * 1986-08-20 1986-10-01 Gen Electric Co Plc Deposition of thin films
US4830982A (en) * 1986-12-16 1989-05-16 American Telephone And Telegraph Company Method of forming III-V semi-insulating films using organo-metallic titanium dopant precursors
US4782034A (en) * 1987-06-04 1988-11-01 American Telephone And Telegraph Company, At&T Bell Laboratories Semi-insulating group III-V based compositions doped using bis arene titanium sources
EP0338206A1 (de) * 1988-03-24 1989-10-25 Siemens Aktiengesellschaft Verfahren zum konformen Abscheiden von Wolfram auf Halbleitersubstrate bei der Herstellung von höchstintegrierten Schaltungen
EP0349696A1 (en) * 1988-07-08 1990-01-10 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method of depositing metal on an aluminium substrate
EP0355296A3 (de) * 1988-08-18 1991-01-02 Siemens Aktiengesellschaft CVD-taugliche Wolframhalogenphosphankomplexverbindungen sowie Verfahren zu ihrer Herstellung
DE4023883A1 (de) * 1990-07-27 1992-01-30 Kali Chemie Ag Verfahren zur abscheidung von uebergangsmetall enthaltenden schichten
US5320978A (en) * 1993-07-30 1994-06-14 The United States Of America As Represented By The Secretary Of The Navy Selective area platinum film deposition
US6087704A (en) 1997-09-30 2000-07-11 National Science Council Structure and method for manufacturing group III-V composite Schottky contacts enhanced by a sulphur fluoride/phosphorus fluoride layer
JP4860176B2 (ja) * 2005-05-02 2012-01-25 株式会社トリケミカル研究所 Ｎｉ（ＰＦ３）４の製造方法
RU2406771C2 (ru) * 2009-02-12 2010-12-20 ООО "Институт Гипроникель" Способ синтеза тетракис-(трифторфосфина) палладия
FR3108920B1 (fr) 2020-04-07 2022-07-22 Commissariat Energie Atomique Procede de depot d’un film metallique de tungstene ou de molybdene par ald

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0241155A1 (en) * 1986-03-31 1987-10-14 Unisys Corporation Depositing vanadium underlayer for magnetic films

Also Published As

Publication number Publication date
US3619288A (en) 1971-11-09
AT293813B (de) 1971-10-25
GB1251631A (enrdf_load_stackoverflow) 1971-10-27
DE1900119A1 (de) 1970-08-13
SE341864B (enrdf_load_stackoverflow) 1972-01-17
NL6915312A (enrdf_load_stackoverflow) 1970-07-06
DE1900119B2 (de) 1977-06-30
FR2027649A1 (enrdf_load_stackoverflow) 1970-10-02
JPS4822886B1 (enrdf_load_stackoverflow) 1973-07-10

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