CH550485A - Kuehlanordnung fuer ein halbleiterbauelement. - Google Patents

Kuehlanordnung fuer ein halbleiterbauelement.

Info

Publication number
CH550485A
CH550485A CH132073A CH132073A CH550485A CH 550485 A CH550485 A CH 550485A CH 132073 A CH132073 A CH 132073A CH 132073 A CH132073 A CH 132073A CH 550485 A CH550485 A CH 550485A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
cooling arrangement
cooling
arrangement
semiconductor
Prior art date
Application number
CH132073A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2204589A external-priority patent/DE2204589A1/de
Priority claimed from DE2208937A external-priority patent/DE2208937A1/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH550485A publication Critical patent/CH550485A/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
CH132073A 1972-02-01 1973-01-30 Kuehlanordnung fuer ein halbleiterbauelement. CH550485A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2204589A DE2204589A1 (de) 1972-02-01 1972-02-01 Kuehlanordnung fuer flache halbleiterbauelemente
DE2208937A DE2208937A1 (de) 1972-02-25 1972-02-25 Waermerohr-kuehlanordnung fuer flache halbleiterbauelemente

Publications (1)

Publication Number Publication Date
CH550485A true CH550485A (de) 1974-06-14

Family

ID=25762653

Family Applications (1)

Application Number Title Priority Date Filing Date
CH132073A CH550485A (de) 1972-02-01 1973-01-30 Kuehlanordnung fuer ein halbleiterbauelement.

Country Status (8)

Country Link
AT (1) AT324436B (de)
BE (1) BE794501A (de)
CH (1) CH550485A (de)
FR (1) FR2170040B1 (de)
GB (1) GB1427624A (de)
IT (1) IT978507B (de)
LU (1) LU66933A1 (de)
NL (1) NL7300759A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359329A (ja) * 2001-05-30 2002-12-13 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
GB1427624A (en) 1976-03-10
AT324436B (de) 1975-08-25
NL7300759A (de) 1973-08-03
FR2170040B1 (de) 1978-02-10
IT978507B (it) 1974-09-20
FR2170040A1 (de) 1973-09-14
BE794501A (fr) 1973-05-16
LU66933A1 (de) 1973-04-02

Similar Documents

Publication Publication Date Title
CH551836A (de) Geraethalter fuer ein loetgeraet.
CH551690A (de) Halbleiteranordnung.
CH550642A (de) Bandfoermiges bolzen-magazin fuer ein bolzensetzgeraet.
CH554600A (de) Halbleiterbauelement.
CH544920A (de) Radiator
AT376844B (de) Halbleiterbauteil
DK138248C (da) Halvlederelement
CH552285A (de) Halbleiteranordnung.
CH552791A (de) Multiplex-schaltung fuer eine messanordnung.
CH549286A (de) Halbleiterbauelement.
CH550485A (de) Kuehlanordnung fuer ein halbleiterbauelement.
CH541869A (de) Halbleiterbauelement
CH549868A (de) Halter fuer ein druckkontaktiertes halbleiterbauelement.
IT994322B (it) Circuito integrato a semiconduttore
ES189658Y (es) Condensador.
BR7307396D0 (pt) Radiador
CH546527A (de) Schaltungsanordnung fuer zeitvielfachvermittlungsstellen.
CH548111A (de) Halbleiteranordnung.
TR16899A (tr) 1-aminoalkan-1,1-difosfonik asitlerin imaline mahsus usul
BE801030A (fr) Radiateur a elements
ES198361Y (es) Un elemento de base para alfombras.
CH549869A (de) Kuehlvorrichtung fuer ein scheibenfoermiges, gekapseltes halbleiterbauelement.
CH550353A (de) Dichtungselement fuer flanschverbindungen.
CH558515A (de) Rueckstossdaempfer fuer gewehre.
CH550493A (de) Loetoese fuer ein elektrisches geraet.

Legal Events

Date Code Title Description
PL Patent ceased